Patents by Inventor Wei-Hsin CHAIO

Wei-Hsin CHAIO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200120787
    Abstract: The present disclosure relates to an electronic device. The electronic device includes a circuit board. The circuit board includes a wiring layer and a patterned electrode layer. The wiring layer includes a plurality of wires. One of the wires includes a trace part and a terminal part connected to the trace part. The patterned electrode layer is disposed opposite to the wiring layer. The trace part and the patterned electrode layer have a first overlapping area, the terminal part and the patterned electrode layer have a second overlapping area, and a ratio of the first overlapping area to the second overlapping area is between 0.7 and 1.3.
    Type: Application
    Filed: September 4, 2019
    Publication date: April 16, 2020
    Inventors: Yu-Hsin FENG, Wei-Hsin CHAIO, Yu-Tse LU, Wei-Ting CHOU