Patents by Inventor Wei Hsin Laio

Wei Hsin Laio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High speed pick and place apparatus
    Patent number: 6758113
    Abstract: A pick and place apparatus comprises a bond arm adapted for rotation about an axis between a pick location and a place location. The bond arm is formed with a cavity at an end of the arm remote from the axis, within which cavity are located a plurality of damping particles for damping unwanted vibrations of the bond arm. The particles may be irregular tungsten granules with a diameter between 0.3 and 1.2 mm and a filling ratio of about 75%.
    Type: Grant
    Filed: July 10, 2001
    Date of Patent: July 6, 2004
    Assignee: ASM Assembly Automation Limited
    Inventors: Ping Kong Choy, Chou Kee Liu, Wei Hsin Laio, Yu Wang