Abstract: An integrated circuit includes a plurality of first layer deep lines, a plurality of first layer shallow lines, a plurality of second layer deep lines, and a plurality of second layer shallow lines. The integrated circuit also includes a first active device and a second active device coupled between a conducting path that has a low resistivity portion and a low capacitivity portion. The first active device has an output coupled to a first layer deep line that is in the low resistivity portion. The second active device has an input coupled to a first layer shallow line that is in the low capacitivity portion. The low resistivity portion excludes the first layer shallow lines and the second layer shallow lines, and the low capacitivity portion excludes the first layer deep lines and the second layer deep lines.

Abstract: Various embodiments of the present application are directed to an IC, and associated forming methods. In some embodiments, the IC comprises a memory region and a logic region integrated in a substrate. A plurality of memory cell structures is disposed on the memory region. Each memory cell structure of the plurality of memory cell structures comprises a control gate electrode disposed over the substrate, a select gate electrode disposed on one side of the control gate electrode, and a spacer between the control gate electrode and the select gate electrode. A contact etch stop layer (CESL) is disposed along an upper surface of the substrate, extending upwardly along and in direct contact with a sidewall surface of the select gate electrode within the memory region. A lower inter-layer dielectric layer is disposed on the CESL between the plurality of memory cell structures within the memory region.

Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.

Abstract: A semiconductor device includes a semiconductor substrate, a control gate, a select gate, a charge trapping structure, and a dielectric structure. The semiconductor substrate has a drain region, a source region, and a channel region between the drain region and the source region. The control gate is over the channel region of the semiconductor substrate. The select gate is over the channel region of the semiconductor substrate and separated from the control gate. The charge trapping structure is between the control gate and the semiconductor substrate. The dielectric structure is between the select gate and the semiconductor substrate. The dielectric structure has a first part and a second part, the first part is between the charge trapping structure and the second part, and the second part is thicker than the first part.

Abstract: An integrated circuit includes a set of power rails on a back-side of a substrate, a first flip-flop, a second flip-flop and a third flip-flop. The set of power rails extend in a first direction. The first flip-flop includes a first set of conductive structures extending in the first direction. The second flip-flop abuts the first flip-flop at a first boundary, and includes a second set of conductive structures extending in the first direction. The third flip-flop abuts the second flip-flop at a second boundary, and includes a third set of conductive structures extending in the first direction. The first, second and third flip-flop are on a first metal layer and are on a front-side of the substrate opposite from the back-side. The second set of conductive structures are offset from the first boundary and the second boundary in a second direction.

Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.

Abstract: A method for forming a semiconductor device includes receiving a substrate having a first opening and a second opening formed thereon, wherein the first opening has a first width, and the second opening has a second width less than the first width; forming a protecting layer to cover the first opening and expose the second opening; performing a wet etching to widen the second opening with an etchant, wherein the second opening has a third width after the performing of the wet etching, and the third width of the second opening is substantially equal to the first width of the first opening; and performing a photolithography to transfer the first opening and the second opening to a target layer.

Abstract: A method for forming a photomask includes receiving a substrate having a first layer formed thereon, wherein a patterned second layer exposing portions of the first layer is disposed over the substrate, removing the exposed portions of the first layer through the patterned second layer to form a plurality of openings in the first layer, removing the patterned second layer, and performing a wet etching to remove portions of the first layer to widen the plurality of openings with an etchant. The etchant is in contact with a top surface of the first layer and sidewalls of the plurality of openings. Each of the plurality of openings has a first width prior to the performing of the wet etching and a second width after the performing of the wet etching. The second width is greater than the first width.

Abstract: A computing system is provided. The computing system includes a semi-flexible printed circuit board assembly (PCBA) with a first element and a second element. The first element is configured to move in a non-planar direction with respect to the second element. The computing system also includes an internal trace connecting the first element and the second element of the semi-flexible PCBA. The computing system also includes a support mechanism, which is configured to constrain relative movements between the first element with respect to the second element of the semi-flexible PCBA.

Abstract: A computing system is provided. The computing system includes a semi-flexible printed circuit board assembly (PCBA) with a first element and a second element. The first element is configured to move in a non-planar direction with respect to the second element. The computing system also includes an internal trace connecting the first element and the second element of the semi-flexible PCBA. The computing system also includes a support mechanism, which is configured to constrain relative movements between the first element with respect to the second element of the semi-flexible PCBA.

Abstract: A method for forming a photomask includes receiving a substrate having a first layer formed thereon, wherein a patterned second layer exposing portions of the first layer is disposed over the substrate, removing the exposed portions of the first layer through the patterned second layer to form a plurality of openings in the first layer, removing the patterned second layer, and performing a wet etching to remove portions of the first layer to widen the plurality of openings with an etchant. The etchant is in contact with a top surface of the first layer and sidewalls of the plurality of openings. Each of the plurality of openings has a first width prior to the performing of the wet etching and a second width after the performing of the wet etching. The second width is greater than the first width.

Abstract: A lens sheet including a first transparent substrate, a first lens film, a second lens film, a second transparent substrate, a plurality of bonding material patterns and a plurality of buffer cavities is provided. The first lens film is disposed on the first transparent substrate, and having a plurality of first lens portions and a plurality of first carrying portions. The second lens film is disposed between the second transparent substrate and the first lens film. The bonding material patterns are disposed between the second lens film and the first carrying portions. The buffer cavities are located between the first carrying portions and the first lens portions.

Abstract: A method of manufacturing a lens sheet including following steps is provided. A first structure is provided. The first structure includes a first transparent substrate and a first lens film attached to the first transparent substrate. A second structure is provided. The second structure includes a second transparent substrate and a second lens film. The second transparent substrate has a first surface and a second surface opposite to the first surface. The second lens film is attached to the first surface. The first lens film is attached to the second lens film. A third lens film is formed on the second surface of the second substrate after the first lens film is attached to the second lens film. Moreover, a lens sheet and a wafer level lens are also provided.

Abstract: A display having pivot constraint function is disclosed in the present invention. The display includes a panel, a supporter, a pivot mechanism and a constraint mechanism. The pivot mechanism is disposed between a first bridging component of the panel and a second bridging component of the supporter. A rotation angle of the panel relative to the supporter can be adjusted via the pivot mechanism, and the constraint mechanism can constrain the rotation of the panel relative to the supporter. The constraint mechanism includes a body and a contacting portion. The body is movably disposed on the panel, and partly protrudes from a boundary of the panel. The contacting portion is connected to the body for simultaneously contacting the first bridging component and the second bridging component, so as to constrain rotation between the first bridging component and the second bridging component, and to fix a view angle of the panel.

Abstract: A buffered stylus includes a barrel that has a first end and a second end opposite to the first end, and a staff that extends through the barrel. A front end portion of the staff has a part that extends outwardly of the first end of the barrel, and further has a rear end. A staff body portion is connected to the rear end of the front end portion, and has an elastically deformable segment capable of being extended and contracted in a longitudinal direction so as to absorb shock force. A rear end portion of the staff is connected to a rear end of the staff body portion, and is secured to the second end of the barrel.

Abstract: A method of manufacturing a lens sheet including following steps is provided. A first structure is provided. The first structure includes a first transparent substrate and a first lens film attached to the first transparent substrate. A second structure is provided. The second structure includes a second transparent substrate and a second lens film. The second transparent substrate has a first surface and a second surface opposite to the first surface. The second lens film is attached to the first surface. The first lens film is attached to the second lens film. A third lens film is formed on the second surface of the second substrate after the first lens film is attached to the second lens film. Moreover, a lens sheet and a wafer level lens are also provided.

Abstract: A display having pivot constraint function is disclosed in the present invention. The display includes a panel, a supporter, a pivot mechanism and a constraint mechanism. The pivot mechanism is disposed between a first bridging component of the panel and a second bridging component of the supporter. A rotation angle of the panel relative to the supporter can be adjusted via the pivot mechanism, and the constraint mechanism can constrain the rotation of the panel relative to the supporter. The constraint mechanism includes a body and a contacting portion. The body is movably disposed on the panel, and partly protrudes from a boundary of the panel. The contacting portion is connected to the body for simultaneously contacting the first bridging component and the second bridging component, so as to constrain rotation between the first bridging component and the second bridging component, and to fix a view angle of the panel.

Abstract: A buffered stylus includes a barrel that has a first end and a second end opposite to the first end, and a staff that extends through the barrel. A front end portion of the staff has a part that extends outwardly of the first end of the barrel, and further has a rear end. A staff body portion is connected to the rear end of the front end portion, and has an elastically deformable segment capable of being extended and contracted in a longitudinal direction so as to absorb shock force. A rear end portion of the staff is connected to a rear end of the staff body portion, and is secured to the second end of the barrel.

Abstract: A protective device is used to contain a notebook computer, and includes a first cover body, a second cover body, a closure component, and a circuit board. The second cover body is coupled to the first cover body, and cooperates with the first cover body to define a containing space for containing the notebook computer. The second cover body is movable relative to the first cover body between a closing position and an open position. The closure component is disposed between the first and the second cover bodies, and is operable to retain the second cover body at the closing position relative to the first cover body. The circuit board is disposed in the containing space, is adapted to electrically connect with the notebook computer, and includes a plurality of transmission interfaces for transmission of one of data and signals.

Abstract: A packaging substrate is fabricated using two plating steps for respectively plating the gold-plating areas defined on two opposite sides of the substrate. Before plating, the gold-plating areas are defined by a layer of solder mask. By doing this, the plated gold layer will not overlap with the solder mask, thereby preventing peeling or reliability problems.