Abstract: An electronic package and a substrate structure thereof are provided, in which an electronic element is disposed on the substrate structure having a circuit layer, and an insulating protective layer of the substrate structure has an opening that exposes the circuit layer. A plurality of extension portions protruding toward the inside of the opening and spaced apart are formed on the edge of the opening of the insulating protective layer, so that when an underfill material is filled into a space between the electronic element and the substrate structure, the space between the electronic element and the substrate structure can be evenly filled up to prevent the underfill material from forming voids.

Abstract: A carrier substrate is provided and has a first circuit structure and a second circuit structure on opposing sides of the carrier substrate, where on one routing region, a difference between a routing ratio of a first circuit layer of the first circuit structure and a routing ratio of a second circuit layer of the second circuit structure is within 10%. Therefore, the difference between the routing ratios of the two opposing outermost circuit layers of the carrier substrate in specific target regions can be reduced, so as to avoid a warpage of the carrier substrate due to a great difference in metal distribution areas.

Abstract: A wireless communication circuit and an electronic device are provided. The wireless communication circuit used for an electronic device includes a wireless transceiver unit used to generate a transmitting signal, an impedance matching unit electronically coupled to the wireless transceiver unit, a coupling unit and a system grounding surface. The impedance matching unit includes at least one impedance, the impedance matching unit is used to convert the transmitting signal to a feeding signal according to the impedance value of at least one impedance. The coupling unit is electronically coupled to the impedance matching unit, to radiate the energy of the feeding signal. The system grounding surface is used to transmit a first electromagnetic wave signal via resonance on the plane of the system grounding surface after receiving the energy of the feeding signal.

Abstract: A wireless communication circuit and an electronic device are provided. The wireless communication circuit used for an electronic device includes a wireless transceiver unit used to generate a transmitting signal, an impedance matching unit electronically coupled to the wireless transceiver unit, a coupling unit and a system grounding surface. The impedance matching unit includes at least one impedance, the impedance matching unit is used to convert the transmitting signal to a feeding signal according to the impedance value of at least one impedance. The coupling unit is electronically coupled to the impedance matching unit, to radiate the energy of the feeding signal. The system grounding surface is used to transmit a first electromagnetic wave signal via resonance on the plane of the system grounding surface after receiving the energy of the feeding signal.

Abstract: An electronic device includes a conducting element, a supporting element, and a multiband antenna is disclosed. The conducting element is connected to the ground of the electronic device by a high impedance connection. The supporting element has a supporting surface, and the supporting surface and the conducting element are perpendicular. The multiband antenna is disposed at the supporting surface and includes a radiating element, and the radiating element and the conducting element form a coupling capacitor.

Abstract: An electronic device includes a first conducting element, a second conducting element and a multihand antenna. The multihand antenna includes a first radiating part and a first coupling metal part. At least a part of the first radiating part is disposed between the first conducting element and the second conducting element. The first coupling metal part parallels to the first radiating part and is connected to a ground. The electronic device can reduce the affection of metal components in a portable device on the antenna, and enables the antenna to operate at more and wider frequency bands.

Abstract: An electronic device includes a conducting element, a supporting element, and a multiband antenna is disclosed. The conducting element is connected to the ground of the electronic device by a high impedance connection. The supporting element has a supporting surface, and the supporting surface and the conducting element are perpendicular. The multiband antenna is disposed at the supporting surface and includes a radiating element, and the radiating element and the conducting element form a coupling capacitor.

Abstract: A portable electronic system includes a first electronic device, a carrying element and a second electronic device. The first electronic device has a casing. The casing has an accommodating portion located at one side of the casing. The carrying element is connected with the casing and capable of relatively moving between a first position and a second position of the casing. The second electronic device is disposed at the carrying element and coupled to the first electronic device. When the carrying element is located at the first position, the second electronic device is received within the accommodating portion by the carrying element. When the carrying element is located at the second position, the second electronic device is departed from the accommodating portion by the carrying element.