Abstract: An integrated circuit includes a first-type active-region structure, a second-type active-region structure on a substrate, and a plurality of gate-conductors. The integrated circuit also includes a backside horizontal conducting line in a backside first conducting layer below the substrate, a backside vertical conducting line in a backside second conducting layer below the backside first conducting layer, and a pin-connector for a circuit cell. The pin-connector is directly connected between the backside horizontal conducting line and the backside vertical conducting line. The backside horizontal conducting line extends across a vertical boundary of the circuit cell.

Abstract: Embodiments of the present disclosure provide a method for forming semiconductor device structures. The method includes forming a fin structure having a stack of semiconductor layers comprising first semiconductor layers and second semiconductor layers alternatingly arranged, forming a sacrificial gate structure over a portion of the fin structure, removing the first and second semiconductor layers in a source/drain region of the fin structure that is not covered by the sacrificial gate structure, forming an epitaxial source/drain feature in the source/drain region, removing portions of the sacrificial gate structure to expose the first and second semiconductor layers, removing portions of the second semiconductor layers so that at least one second semiconductor layer has a width less than a width of each of the first semiconductor layers, forming a conformal gate dielectric layer on exposed first and second semiconductor layers, and forming a gate electrode layer on the conformal gate dielectric layer.

Abstract: A heat dissipation module includes a fan and a thermal fin portion. The fan includes a fan body, a plurality of blade units and a plurality of blade extensions. The blade units are connected to the fan body. The blade extensions protrude from the blade units, respectively. A first surface is formed on a side of each of the blade extensions. A distance between the first surface and an axis of the fan body is increasing along an inflow direction. The thermal fin portion includes a plurality of fin units and a plurality of fin extensions respectively protruding from the fin units. A second surface is formed on a side facing the fan extension of each of the fin extension. An identical gap is formed between at least one portion of the first surface and at least one portion of the second surface.

Abstract: A heat dissipation module includes a fan and a thermal fin portion. The fan includes a fan body, a plurality of blade units and a plurality of blade extensions. The blade units are connected to the fan body. The blade extensions protrude from the blade units, respectively. A first surface is formed on a side of each of the blade extensions. A distance between the first surface and an axis of the fan body is increasing along an inflow direction. The thermal fin portion includes a plurality of fin units and a plurality of fin extensions respectively protruding from the fin units. A second surface is formed on a side facing the fan extension of each of the fin extension. An identical gap is formed between at least one portion of the first surface and at least one portion of the second surface.

Abstract: A heat-dissipating fin comprises a first longitudinal section, a second longitudinal section, a first contacting section extending transversely from the first longitudinal section, a second contacting section extending transversely from the second longitudinal section, and a third contacting section connected between the first longitudinal section and the second longitudinal section and extending transversely. When a plurality of heat-dissipating fins are assembled, contact among the first contacting sections, among the second contacting sections, and among the third contacting sections of the heat-dissipating fins are established.