Abstract: An electronic circuit includes a fingerprint sensing circuit that is configured to receive fingerprint sensing signals corresponding to a fingerprint image from fingerprint sensors via fingerprint sensing lines. The fingerprint sensing circuit is further configured to select a subset of the fingerprint sensing lines to form a fingerprint sensing zone having at least one boundary and adapted for a fingerprint sensing operation based on a fingerprint touch area. The subset of fingerprint sensing lines is selected based on the at least one boundary of the fingerprint sensing zone. The fingerprint sensing circuit is further configured to generate the fingerprint image according to the fingerprint sensing signals by a remapping operation.

Abstract: An electronic circuit including a plurality of common terminals, a first circuit, a second circuit, and a plurality of switch units is provided. The first circuit is configured to output display driving signals to data lines of a display panel via the common terminals. The second circuit is configured to receive fingerprint sensing signals from fingerprint sensing lines of the display panel via the common terminals. Each of the switch units includes a first terminal coupled to one of the common terminals and a plurality of second terminals coupled to the first circuit and the second circuit. The switch units are grouped into a plurality of groups, and each group corresponds to a fingerprint sensing channel of the second circuit.

Abstract: A method for manufacturing a semiconductor structure is provided. A substrate including a fin structure is received, provided or formed. A sacrificial gate layer is formed over the fin structure and a source/drain structure is formed adjacent to the sacrificial gate layer, wherein the sacrificial gate layer is surrounded by a dielectric structure. The sacrificial gate layer is removed, wherein a recess is defined by the dielectric structure. A work function layer is formed in the recess, wherein the work function layer includes an overhang portion at an opening of the recess. A thickness of the work function layer is reduced. A glue layer is formed over the work function layer. A semiconductor structure thereof is also provided.

Abstract: An electronic circuit for operating with a display panel including touch sensors and fingerprint sensors is provided. The electronic circuit includes a first circuit, a second circuit, a third circuit, a first switch circuit and a control circuit. The first circuit generates display driving signals for driving the display panel. The second circuit receives fingerprint sensing signals from the fingerprint sensors. The third circuit determines a touch information according to touch sensing signals from the touch sensors. The first switch circuit includes a plurality of first switch units, each of the first switch units includes a first switch element and a second switch element. The control circuit controls the first switch circuit to transmit the display driving signals in a first time interval, controls the first switch circuit to transmit the fingerprint sensing signals in a second time interval, and controls the third circuit to receive the fingerprint sensing signals in a third time interval.

Abstract: The disclosed is a physisorption-based microcontact printing process capable of controlling film thickness, primarily for creating patterns of thin film of organic molecules in micron and submicron scales, comprising an inking phase, a printing phase, and a demolding phase. The inking phase is combined with a thin-film growth approach, wherein the thin-film approach enables growth of an organic thin film with desired thickness onto a stamp, effectively controls the thickness of the pattern of the organic thin film transferred in the next printing phase. The demolding phase enables proper control of the temperature of and the printing pressure upon the transferred thin-film pattern to control the quality of surface roughness and residual internal stress in the printed pattern.

Abstract: A direct and effective method of fabricating full-color OLED arrays on the basis of microcontact printing process is disclosed. The key of the method lies in a physisorption-based microcontact printing process capable of controlling thickness of the printed films. The organic EL materials involved can be of either small or large molecular weights, as long as they are suitable for solution process.