Patents by Inventor WEI-HSUN CHEN

WEI-HSUN CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145650
    Abstract: A package comprises a substrate including a first surface, and an upper conductive layer arranged on the first surface, a first light-emitting unit arranged on the upper conductive layer, and comprises a first semiconductor layer, a first substrate, a first light-emitting surface and a first side wall, a second light-emitting unit, which is arranged on the upper conductive layer, and comprises a second light-emitting surface and a second side wall, a light-transmitting layer arranged on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit, a light-absorbing layer, which is arranged between the substrate and the light-transmitting layer in a continuous configuration of separating the first light-emitting unit and the second light-emitting unit from each other, and a reflective wall arranged on the first side wall, wherein a height of the reflective wall is lower than that of the light-absorbing layer.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Inventors: Shau-Yi CHEN, Tzu-Yuan LIN, Wei-Chiang HU, Pei-Hsuan LAN, Min-Hsun HSIEH
  • Publication number: 20240130038
    Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 18, 2024
    Applicants: UNIMICRON TECHNOLOGY CORP., National Taiwan University
    Inventors: Chin-Hsun WANG, Ruey-Beei Wu, Ching-Sheng Chen, Chun-Jui Hung, Wei-Yu Liao, Chi-Min Chang
  • Patent number: 11961777
    Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao
  • Patent number: 11929767
    Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: March 12, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
  • Publication number: 20240069431
    Abstract: In a method of manufacturing an attenuated phase shift mask, a photo resist pattern is formed over a mask blank. The mask blank includes a transparent substrate, an etch stop layer on the transparent substrate, a phase shift material layer on the etch stop layer, a hard mask layer on the phase shift material layer and an intermediate layer on the hard mask layer. The intermediate layer is patterned by using the photo resist pattern as an etching mask, the hard mask layer is patterned by using the patterned intermediate layer as an etching mask, and the phase shift material layer is patterned by using the patterned hard mask layer as an etching mask. The intermediate layer includes at least one of a transition metal, a transition metal alloy, or a silicon containing material, and the hard mask layer is made of a different material than the intermediate layer.
    Type: Application
    Filed: February 16, 2023
    Publication date: February 29, 2024
    Inventors: Wei-Che HSIEH, Chien-Cheng Chen, Ping-Hsun Lin, Ta-Cheng Lien, Hsin-Chang Lee
  • Patent number: 11774012
    Abstract: A conduit suitable for use in a high temperature, high pressure environment, the conduit having an elongate portion made of a first refractory metal and a fitting portion made of a second refractory metal attached to an axial end of the elongate portion. The attachment may be made by welding and the second refractory metal may have a greater yield strength than the first refractory metal.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: October 3, 2023
    Assignee: ASML Netherlands B.V.
    Inventors: Jon David Tedrow, David Bessems, Wei-Hsun Chen
  • Publication number: 20210262593
    Abstract: A conduit suitable for use in a high temperature, high pressure environment, the conduit having an elongate portion made of a first refractory metal and a fitting portion made of a second refractory metal attached to an axial end of the elongate portion. The attachment may be made by welding and the second refractory metal may have a greater yield strength than the first refractory metal.
    Type: Application
    Filed: August 12, 2019
    Publication date: August 26, 2021
    Inventors: Jon David TEDROW, David BESSEMS, Wei-Hsun CHEN
  • Publication number: 20110257877
    Abstract: The present invention provides a guidance system and a guidance method for taking public transportation, which comprise a mobile device having a mobile positioning unit and a mobile interface unit. After the mobile interface unit receives destination information, the mobile positioning unit produces text guidance information according to location information and the destination information. The mobile interface unit displays the text guidance information for guiding people the way to the platform of the public transportation and helping people to confirm the public transportation to take.
    Type: Application
    Filed: November 16, 2010
    Publication date: October 20, 2011
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: HUNG-HUAN LIU, KAI-CHIH CHAN, YU-JEN CHANG, YUNG-JU CHEN, WEI-HSUN CHEN, YAO-JEN CHANG