Abstract: A plurality of small copper-filled TSV (through silicon via) interposer slivers dispersed in a fan-out wafer level package (FOWLP) for wire bonding interconnections forms a hybrid FOWLP/interposer multichip package that avoids the use of expensive large 2.5D TSV interposer modules for heterogeneous integration and for chiplets. Package fabrication on reconstituted wafers or panels can follow either the chip-first or RDL-first process.

Abstract: An oar propulsion system having an oarlock attached to the rear of a standup paddle board (SUP) is used for manual propulsion of the board. The oarlock is structurally attached to the paddle board in a first embodiment, or remains removable in a second embodiment as a conversion kit. The oar shaft has a blade on one end and an exchangeable handle on the other end; the exchangeable handle may be replaced by a waist strap that is tied the paddler’s body for better stability and for steering while paddling.

Abstract: A sectioned tablet smartphone device that is bendable for use as a wearable for carrying around or hands-free applications; the device is comprised of a plurality of short body sections linked by bendable hinges that are integrated to device casing, a bendable and slidable front touchscreen display connected to an extension stored in a rotating end scroll, and a detachable strap on casing backside as a protective cover when device is in tablet mode and as a wristband when device is in wearable mode.

Abstract: A wearable electronics device having a removable thin top touchscreen that is interchangeable to other touchscreens having different sizes and shapes to convert the device form factor and functions from a fitness-tracker to a smartwatch or a handheld smartphone, using an applications processor in the underlying electronics housing unit capable of running the device in various form factors. The smartphone touchscreen further provides additional power and memory/storage for smartphone-level functions and performance.

Abstract: A handheld electronic device comprises of a lower slat having a top surface touchscreen and an upper slat having a top surface touchscreen. A plurality of multiple-foldable sectional touchscreens in between the said slats has one end connected to the upper slat surface touchscreen and the other end connected to the lower slat surface touchscreen. A fan-out embodiment has a plurality of tapered sectional screens each supported by a rib, and a pivoting rivet linking upper and lower slats for fan-out opening. A pull-out embodiment has rectangular sectional screens supported by stiffening backing and expandable side frame supports for opening and closing the device slats. Another pull-out device embodiment has no foldable screens in between slats to form a two-screen, parallel slat device when opened.

Abstract: A mobile electronic smartphone device having a wedge-shaped body comprised of a curved and slanted display gradually tapered towards the thin end, and a thick head section comprised of a battery compartment and a modular, rotatable or replaceable camera module. The display may be rigid LCD, OLED, microLED with a rigid glass cover. Optionally, flexible, bendable display with stretch-rigid circuit backing and flexible cover screen may be used for a foldable or rollable device, comprised of a bending hinge located at or below the mid-section of the display body, wherein the thinner display section is bendable against the thicker section of the front display. Another embodiment of the wedge body is comprised of rollable housing slats and a flexible display in the lower half thinner display section that can be rolled up like a scroll or lie-flat against the thicker part of the device body.

Abstract: This present disclosure combines a data storage drive, such as flash-based USB drive or a SSD drive with redundant, multiple levels of security protection. In an embodiment, the security protection includes password protection, fingerprint recognition, and real-time data encryption. The biometric sensors may be integrated into the storage device without substantially adding weight and size. Further, the secured device may have a built-in internal power source to self-sustain the protection without having to connect to a host device or an external power source. Thus, it is possible to remotely track the location of the secured device and disable or enable the security protection or manage the security setups.

Abstract: High-density memory assemblies and related methods for manufacturing and using such memory assemblies are included in the present disclosure. According to one exemplary embodiment, a high-density memory assembly includes stacked first and second panels. The first and second panels each comprise a substrate and at least one chip disposed on the substrate. The first and second panels each further comprise connecting tabs extending from the substrates of the first and second panels.

Abstract: This disclosure pertains to a flexible circuit module and related methods of manufacturing and applications for such a flexible circuit module. In one exemplary embodiment, the flexible circuit module comprises a flexible substrate, at least one flexible chip element, and a flexible top layer disposed over the flexible substrate and the flexible chip element. According to an aspect, a flexible circuit module is used in flexible electronic devices. According to another aspect, a flexible circuit module is attached to the inner surface of an electronic device and connected to the device main board. According to another aspect, a flexible circuit module is used in the place of a current PCB in a PCBA. According to another aspect, a flexible circuit module is rolled up and used inside an electronic device. According to another aspect, a flexible circuit module is molded.