Abstract: A system and related method identify a weakness of a workflow in a complex system. The method collects runtime data about the complex system. The complex system comprises a plurality of subcomponents, and the method identifies an abnormal operation in the complex system. The method constructs a multi-dimensional cause-and-effect relation matrix among the plurality of subcomponents, and filters one or more related operations using the multi-dimensional cause-and-effect relation matrix.

Abstract: A semiconductor device includes a substrate; a gate structure, located over the substrate, the gate structure including a first gate oxide layer, a second gate oxide layer, and a silicon layer. The first gate oxide layer is over the substrate, and the first gate oxide layer has a sloped sidewall on one side and a vertical sidewall on another side. The second gate oxide layer is over the substrate and on the sloped sidewall of the first gate oxide layer, and a thickness of the second gate oxide layer is less than a thickness of the first gate oxide layer. The silicon layer is formed over the first gate oxide layer and the second gate oxide layer.

Abstract: A semiconductor device includes a substrate; a gate structure, located over the substrate, the gate structure including a first gate oxide layer, a second gate oxide layer, and a silicon layer. The first gate oxide layer is over the substrate, and the first gate oxide layer has a sloped sidewall on one side and a vertical sidewall on another side. The second gate oxide layer is over the substrate and on the sloped sidewall of the first gate oxide layer, and a thickness of the second gate oxide layer is less than a thickness of the first gate oxide layer. The silicon layer is formed over the first gate oxide layer and the second gate oxide layer.

Abstract: A method for forming a semiconductor device includes providing a substrate, forming an oxide layer over the substrate, forming a plurality of first gate oxide layers by etching the oxide layer, forming a second gate oxide layer between adjacent first gate oxide layers, forming a silicon layer over the plurality of first gate oxide layers and the second gate oxide layer, and etching the plurality of first gate oxide layers, the silicon layer, and the second gate oxide layer to expose the substrate, thereby forming a plurality of gate structures. The first gate oxide layer of the plurality of first gate oxide layers has sloped sidewalls. A thickness of the second gate oxide layer is less than a thickness of the first gate oxide layer. Each gate structure includes an etched first oxide layer, a portion of the second gate oxide layer, and a portion of the silicon layer.

Abstract: A method for forming a semiconductor device includes providing a substrate, forming an oxide layer over the substrate, forming a plurality of first gate oxide layers by etching the oxide layer, forming a second gate oxide layer between adjacent first gate oxide layers, forming a silicon layer over the plurality of first gate oxide layers and the second gate oxide layer, and etching the plurality of first gate oxide layers, the silicon layer, and the second gate oxide layer to expose the substrate, thereby forming a plurality of gate structures. The first gate oxide layer of the plurality of first gate oxide layers has sloped sidewalls. A thickness of the second gate oxide layer is less than a thickness of the first gate oxide layer. Each gate structure includes an etched first oxide layer, a portion of the second gate oxide layer, and a portion of the silicon layer.