Patents by Inventor Wei Hua Cheng

Wei Hua Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030186542
    Abstract: A method and apparatus for reducing gouging during via formation. In one embodiment, the present invention is comprised of a method which includes forming an opening into a substrate. The opening is formed extending into the substrate and terminating on at least a portion of a target to which it is desired to form an electrical connection. After the formation of the opening, the present embodiment lines the opening with a liner material. In this embodiment, the liner material is adapted to at least partially fill a portion of the opening which is not landed on the target. The liner material of the present embodiment prevents substantial further etching of the substrate conventionally caused by the opening being at least partially unlanded on the target. Next, the present embodiment subjects the liner material to an etching process such that the liner material is substantially removed from that region of the target where the opening was landed on the target.
    Type: Application
    Filed: April 1, 2002
    Publication date: October 2, 2003
    Inventors: Daniel Yen, Wei Hua Cheng, Yakub Aliyu, Lee Yuan Ping
  • Patent number: 5980186
    Abstract: A semiconductor wafer carrier fork cover to prevent damage to prevent breakage of the semiconductor wafer carrier forks mounted on a robotic semiconductor wafer transfer system during preventative maintenance procedures is described. A semiconductor wafer carrier fork cover has a lower support unit. The lower support unit will fit onto the base of a robotic semiconductor wafer transfer system. An upper covering unit is integrally attached to the lower support unit and will shield the semiconductor wafer carrier forks during preventive maintenance procedures.
    Type: Grant
    Filed: September 27, 1996
    Date of Patent: November 9, 1999
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventor: Wei Hua Cheng
  • Patent number: 5743138
    Abstract: A float device is disclosed with an improved external surface having an outwardly concave curvature and a plurality of elongated grooves spirally formed on the concave surface. The concave surface provides improved clearance between the float device and the walls of the pipe that it is disposed in. Therefore, the float device is less subject to being lodged or stuck especially in highly viscous liquids. The spiral grooves provide additional passageway and stability by imparting rotational torque to the floating device when measuring flow rates in moving fluids in pipes. In another embodiment, the float device is annular in shape having an inner surface with a curvature and spiral grooves. Same improved effects are obtained as the float device rides up and down a column like a collar in measuring the fluid level or fluid flow rates.
    Type: Grant
    Filed: January 22, 1997
    Date of Patent: April 28, 1998
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventor: Wei Hua Cheng