Patents by Inventor Wei-Hua Liou

Wei-Hua Liou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Implanted photoresist stripping process
    Patent number: 10078266
    Abstract: Processes for removing a photoresist from a substrate after, for instance, ion implantation are provided. In one example implementation, a process can include placing a substrate having a bulk photoresist and a crust formed on the bulk photoresist in a processing chamber. The process can include initiating a first strip process in the processing chamber. The process can include accessing an optical emission signal associated with a plasma during the first strip process. The process can include identifying an endpoint for the first strip process based at least in part on the optical emission signal. The process can include terminating the first strip process based at least in part on the endpoint. The process can include initiating a second strip process to remove the photoresist from the substrate.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: September 18, 2018
    Assignee: Mattson Technology, Inc.
    Inventors: Wei-Hua Liou, Chun-Yen Kang, Vijay M. Vaniapura, Hai-Au M. Phan-Vu, Shawming Ma
  • Implanted Photoresist Stripping Process
    Publication number: 20170248849
    Abstract: Processes for removing a photoresist from a substrate after, for instance, ion implantation are provided. In one example implementation, a process can include placing a substrate having a bulk photoresist and a crust formed on the bulk photoresist in a processing chamber. The process can include initiating a first strip process in the processing chamber. The process can include accessing an optical emission signal associated with a plasma during the first strip process. The process can include identifying an endpoint for the first strip process based at least in part on the optical emission signal. The process can include terminating the first strip process based at least in part on the endpoint. The process can include initiating a second strip process to remove the photoresist from the substrate.
    Type: Application
    Filed: February 24, 2017
    Publication date: August 31, 2017
    Inventors: Wei-Hua Liou, Chun-Yen Kang, Vijay M. Vaniapura, Hai-Au M. Phan-Vu, Shawming Ma