Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the movable part relative to the fixed part.

Abstract: A thermoelectric cooler (TEC) is positioned to move heat away from a hot spot on a semiconductor chip and toward a dielectric substrate. This approach to thermal management is particularly effective when used in conjunction with a buried rail and back side power delivery. The TEC may be in a layer that contains solder connections be between two device layers an IC package. Alternatively, the TEC may be in a metal interconnect structure over the semiconductor substrate such as in a passivation stack at the top of the metal interconnect structure. TECs at either of these locations may be formed by wafer-level processing.

Abstract: A biomimetic turtle includes a trunk, a head movably connected with a front end of the trunk in the front-rear direction, two front limbs disposed on a front section of the trunk and each rotatable relative to the trunk to sway in an up-down direction, and a driving module to drive the head and the front limbs. Each front limb has a curve-shaped rigid portion with a recess, and a deformable flipper portion engaged in the recess and extending rearwardly. With the deformable flipper portion deformed and bent during swaying of the front limbs, a forward propelling force is generated to propel the biomimetic turtle forwardly. The head is operably movable to vary the center of gravity of 10 the biomimetic turtle 100 in the water, and thus the front portion of the biomimetic turtle is inclined upwardly or downwardly to facilitate ascending or descending of the biomimetic turtle.

Abstract: A method for handling a display control of a microprocessor in an electronic device includes: receiving a display trigger signal; and controlling a panel device in the electronic device to display a content, in response to the display trigger signal; wherein a central processing unit (CPU) in the electronic device is in a power off state, when controlling the panel device to display the content.

Abstract: A method includes following steps. A target layer is formed over a substrate. A first hard mask layer is formed over the target layer by a plasma generated using a first radio frequency generator and a second radio frequency generator. The first radio frequency generator and the second radio frequency generator have different powers. A second hard mask layer is formed over the first hard mask layer by a plasma generated using the first radio frequency generator without using the second radio frequency generator. A photoresist layer is formed over the second hard mask layer. The photoresist layer is exposed. The photoresist layer is developed. The first hard mask layer and the second hard mask layer are patterned using the photoresist layer as an etch mask. The target layer is patterned using the first hard mask layer and the second hard mask layer as an etch mask.

Abstract: A camera device with a quick-release function includes a camera lens, a circuit board and a bridging module. The camera lens has an optical axis. The circuit board has an optical sensor aligning with the optical axis of the camera lens. The bridging module is used to assemble the camera lens with the circuit board. The bridging module includes a lens holder and a glue holder. The lens holder is used to hold the camera lens. The glue holder is detachably disposed on the circuit board, and can be adhered to the lens holder via glue so as to constrain a relative movement between the camera lens and the circuit board.

Abstract: A heat dissipation module includes an airflow generator, a heat dissipation substrate connected to a heat source, a heat dissipation member, a baffle, and a heat conductive member connected to the heat dissipation substrate. The heat dissipation member includes a main body and first fins arranged around an outer periphery of the main body and forming an accommodation space with the main body. The airflow generator has a rotation axis, and is accommodated in the accommodation space and connected to the main body. The baffle is connected to the first fins and has an opening corresponded to an air inlet surface of the airflow generator. On a reference plane perpendicular to the rotation axis, at least a part of an orthographic projection of each first fin does not overlap an orthographic projection of the airflow generator, and an orthographic projection of the baffle overlaps the orthographic projections of the first fins.

Abstract: A hydrocarbon resin polymer including a repeating unit (A) is derived from dicyclopentadiene (DCPD). The hydrocarbon resin polymer has a fluorine substituent, and the content of the fluorine substituent is 100 to 4500 ppm based on the total weight of the hydrocarbon resin polymer. A manufacturing method of the above hydrocarbon resin polymer. The manufacturing method includes polymerizing a mixture in the presence of a fluorine-containing compound, wherein the fluorine-containing compound is a boron trifluoride complex and the mixture includes a dicyclopentadiene. A substrate structure includes a resin layer, and a conductive layer disposed on the resin layer. The resin layer is formed from a resin composition including the above hydrocarbon resin polymer using a cross-linking process.

Abstract: A semiconductor structure includes a first conductive line, a first conductive segment, a second conductive segment, and a third conductive segment. The first conductive segment is electrically coupled to the first conductive line. The second conductive segment is electrically coupled the first conductive segment. The second conductive segment is disposed between the first conductive segment and the third conductive segment. A top surface of the first conductive segment is aligned with a top surface of the second conductive segment in a same layer.

Abstract: An antenna module, a metamaterial structure and an electronic device are provided. The electronic device includes a housing, a glass material layer and an antenna module. The antenna module includes a substrate, at least one radiating element and a metamaterial structure. The metamaterial structure includes a metamaterial substrate, a plurality of first metal conductors, and a plurality of second metal conductors. The first metal conductors are disposed on the first surface of the metamaterial substrate and are spaced apart at intervals from each other, and the second metal conductors are disposed on the second surface of the metamaterial substrate and are spaced apart at intervals from each other. The first metal conductors respectively correspond to the second metal conductors. Shapes of the first metal conductors are different from shapes of the second metal conductors.

Abstract: A multilayer light-filtering structure includes a substrate, a light-filtering layer and a patterned light-blocking layer. The light-filtering layer is disposed on a surface of the substrate, in which the light-filtering layer has a first surface away from the substrate, and the light-filtering layer includes a plurality of high refractive index films and a plurality of low refractive index films. The low refractive index films are correspondingly overlapped with the high refractive index films. The patterned light-blocking layer is disposed on the first surface and includes a plurality of metal material films and a plurality of dielectric films. The dielectric films are correspondingly overlapped with the metal material films.

Abstract: The present invention generally relates to a hydroponic culture medium and a hydroponic planting system, more particularly to a Houttuynia cordata hydroponic culture medium, a Houttuynia cordata hydroponic planting system, Houttuynia cordata extracts, a method, and applications thereof. The Houttuynia cordata hydroponic culture medium includes a plant fertilizer and a Houttuynia cordata growth-promoting additive. The Houttuynia cordata growth-promoting additive is selected from the group consisting of: vitamin B complex, seaweed essence, amino acid, microorganism, and a combination thereof. An electronic conductivity of the Houttuynia cordata hydroponic culture medium is between 0.4 ms/cm and 2.0 ms/cm.

Abstract: A method of forming a semiconductor device includes: forming a via in a first dielectric layer disposed over a substrate; forming a second dielectric layer over the first dielectric layer; forming an opening in the second dielectric layer, where the opening exposes an upper surface of the via; selectively forming a capping layer over the upper surface of the via, where the capping layer has a curved upper surface that extends above a first upper surface of the first dielectric layer distal from the substrate; after forming the capping layer, forming a barrier layer in the opening over the capping layer and along sidewalls of the second dielectric layer exposed by the opening; and filling the opening by forming an electrically conductive material over the barrier layer.

Abstract: A head-mounted display, which includes a case body, a heat source, and a thermally conductive material layer. The heat source and the thermally conductive material layer are disposed in the case body. The heat source is connected to the case body through the thermally conductive material layer. The case body has a first surface connected to the thermally conductive material layer and an opposite second surface. The thermally conductive material layer has a third surface connected to the heat source and an opposite fourth surface. A first distance is greater than a second distance, in which the first distance is a distance from the third surface adjacent to the heat source toward the second surface, and the second distance is a distance from the third surface away from the heat source toward the second surface. In this way, the internal heat of the head-mounted display can be uniformly distributed.

Abstract: An electronic package and a heat dissipation structure thereof are provided, in which a supporting member of the heat dissipation structure is disposed around an outer periphery of a central area and has grooves at corner areas. In this way, the grooves can avoid stress concentration in the corner areas, and the rest of the supporting member can well connect and fix the heat dissipation structure and a carrying structure, so as to suppress warpage of the entire electronic package and prevent delamination.

Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.

Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.

Abstract: A semiconductor device includes a first conductive layer, a second conductive layer, a third conductive layer, a first organic layer, a first inorganic layer and a first silicon-containing layer. The third conductive layer is disposed between and electrically isolated from the first conductive layer and the second conductive layer. The first organic layer continuously covers the first conductive layer and the third conductive layer. The first inorganic layer is disposed over the first organic layer. The first silicon-containing layer is inserted between the first organic layer and the first inorganic layer, wherein the second conductive layer is disposed on and disposed in the first organic layer, the first silicon-containing layer and the first inorganic layer, to electrically connect to the first conductive layer.