Patents by Inventor Wei-Hung Chen

Wei-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153552
    Abstract: A memory array for computing-in-memory (CIM) is disclosed. The memory array for CIM includes a bit cell array, at least one word line and at least one bit line. The bit cell array has a plurality of bit cells, wherein each bit cell is operated at an operating voltage. The at least one word line is electrically connected to the bit cell array, wherein the at least one word line is associated with a first parameter. The at least one bit line is electrically connected to the bit cell array, wherein the bit cells extend along a specific direction, each the at least one bit line has an electrical parameter associated therewith, each the bit cell is associated with a second parameter, a first quantity of the plurality of bit cells of the bit cell array extends along the specific direction, and the memory array determines how an expansion associated with at least one of the first parameter and the second parameter is according to the specific direction.
    Type: Application
    Filed: February 28, 2023
    Publication date: May 9, 2024
    Applicant: NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Tian-Sheuan Chang, Wei-Zen Chen, Shyh-Jye Jou, Shu-Hung Kuo, Shih-Hang Kao, Li-Kai Chen
  • Patent number: 11978740
    Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Harry-Hak-Lay Chuang, Kuo-Ching Huang, Wei-Cheng Wu, Hsin Fu Lin, Henry Wang, Chien Hung Liu, Tsung-Hao Yeh, Hsien Jung Chen
  • Publication number: 20240142664
    Abstract: Two types of blue light blocking contact lenses are provided and are formed by curing different compositions. The first composition includes a blue light blocking component formed by mixing or reacting a first hydrophilic monomer and a yellow dye, a first colored dye component formed by mixing or reacting a second hydrophilic monomer and a first colored dye, at least one third hydrophilic monomer, a crosslinker, and an initiator. The first colored dye includes a green dye, a cyan dye, a blue dye, an orange dye, a red dye, a black dye, or combinations thereof. The second composition includes a blue light blocking component, at least one hydrophilic monomer, a crosslinker, and an initiator. The blue light blocking component is formed by mixing or reacting glycerol monomethacrylate and a yellow dye. Further, methods for preparing the above contact lenses are provided.
    Type: Application
    Filed: February 12, 2023
    Publication date: May 2, 2024
    Inventors: Han-Yi CHANG, Chun-Han CHEN, Tsung-Kao HSU, Wei-che WANG, Yu-Hung LIN, Wan-Ying GAO, Li-Hao LIU
  • Publication number: 20240136346
    Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.
    Type: Application
    Filed: April 17, 2023
    Publication date: April 25, 2024
    Inventors: Chien Hung LIU, Yu-Sheng CHEN, Yi Ching ONG, Hsien Jung CHEN, Kuen-Yi CHEN, Kuo-Ching HUANG, Harry-HakLay CHUANG, Wei-Cheng WU, Yu-Jen WANG
  • Publication number: 20240134256
    Abstract: A projection device includes a shell, a lens, two first ribs, two second ribs, and a sliding cover. The shell has a top plate, a left sidewall, and a right sidewall, the top plate is respectively connected to the left sidewall and the right sidewall, and the top plate has an opening. The lens is disposed in the shell and exposed by the opening. The two first ribs are disposed on the top plate, extending directions of the two first ribs are perpendicular to the left sidewall and the right sidewall, and the opening is disposed between the two first ribs. The sliding cover is slidably disposed on the shell for covering the opening. The two second ribs are disposed on a top cover body of the sliding cover, and one of the two second ribs is located between the two first ribs.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 25, 2024
    Applicant: Coretronic Corporation
    Inventors: Wei-Min Chien, Yen-Ting Lin, Yao-Hung Chen
  • Publication number: 20240136317
    Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu
  • Patent number: 11960153
    Abstract: A folding lens system includes: a polarization-dependence device, a first optical device, a first polarization controller, a second optical device and a second polarization controller. The polarization-dependence device has a first surface and a second surface opposite to the first surface. The first optical device is located at a side facing toward the first surface of the polarization-dependence device. The first polarization controller is located between the polarization-dependence device and the first optical device. The first polarization controller has the same curvature as the first surface of the polarization-dependence device. The second optical device is located at a side facing toward the second surface of the polarization-dependence device. The second polarization controller is located between the polarization-dependence device and the second optical device. The second polarization controller has the same curvature as the second surface of the polarization-dependence device.
    Type: Grant
    Filed: November 3, 2022
    Date of Patent: April 16, 2024
    Assignees: Interface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (ShenZhen) Co., Ltd., General Interface Solution Limited
    Inventors: Po Lun Chen, Yun Pei Chen, Hui-Ping Shen, Ting-Huei Chen, Wei-Hung Tsay
  • Patent number: 11955070
    Abstract: A first driver circuit is configured to cooperate with a second driver circuit to control a display panel, wherein the first driver circuit is configured to output display data to a first area of the display panel and the second driver circuit is configured to output display data to a second area of the display panel. A method used for the first driver circuit includes outputting at least one emission control signal to control the second area of the display panel when the second driver circuit is disabled.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: April 9, 2024
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Kun-Zheng Lin, Chang-Hung Chen, Wei-Chieh Lin, Po-Sheng Liao
  • Patent number: 11952690
    Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: April 9, 2024
    Assignee: TAIWAN TEXTILE RESEARCH INSTITUTE
    Inventors: Ying-Chi Lin, Wei-Hung Chen, Li-Chen Chu, Rih-Sheng Chiang
  • Patent number: 11955507
    Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: April 9, 2024
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Hsin-Hung Li, Wei-Syun Wang, Chih-Chiang Chen, Yu-Cheng Shih, Cheng-Chan Wang, Chia-Hsin Chung, Ming-Jui Wang, Sheng-Ming Huang
  • Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Publication number: 20240109544
    Abstract: A method and device for collision predicting and readable computer storage medium. The method for collision predicting includes: obtaining a host vehicle motion track of a host vehicle; obtaining at least one host vehicle track point on the host vehicle motion track; establishing a collision prediction area around the host vehicle track point, and matching the collision prediction area to a time point where the host vehicle is located at the host vehicle track point; obtaining a target vehicle motion track of a target vehicle; obtaining at least one target vehicle track point on the target vehicle motion track, and matching the target vehicle track point to a time point where the target vehicle is located at the target vehicle track point; and calculating a projected collision time between the host vehicle and the target vehicle when a preset condition is met.
    Type: Application
    Filed: December 14, 2022
    Publication date: April 4, 2024
    Inventors: CHIEN-HUNG YU, WEI-JIE CHEN
  • Patent number: 11944486
    Abstract: An analysis method and an electronic apparatus for breast image are provided. The method includes the following steps. One or more breast ultrasound images are obtained. The breast ultrasound images are used for forming a three-dimensional (3D) breast model. A volume of interest (VOI) in the breast ultrasound image is obtained by applying a detection model on the 3D breast model. The VOI is compared with a tissue segmentation result. The VOI is determined as a false positive according to a compared result between the VOI and the tissue segmentation result. The compared result includes that the VOI is located at a glandular tissue based on the tissue segmentation result. In response to the VOI being located in the glandular tissue of the tissue segmentation result, the VOI is compared with the lactiferous duct in the 3D breast model.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: April 2, 2024
    Assignee: TAIHAO MEDICAL INC.
    Inventors: Jen-Feng Hsu, Hong-Hao Chen, Rong-Tai Chen, Hsin-Hung Lai, Wei-Han Teng
  • Patent number: 11940737
    Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
  • Patent number: 11942993
    Abstract: An optical transmission device includes: a control module generate a control signal output which includes a slope adjust signal and a bias voltage offset adjust signal according to an input signal indicating a dispersion amount an electrical level adjust signal; a multi-level pulse amplitude modulator; and an asymmetrical optical modulator which is controlled by the slope adjust signal to be operated at one of a positive slope and a negative slope of a transfer function of the asymmetrical optical modulator itself, and is controlled by the bias voltage offset adjust signal of the control signal output to offset a bias voltage point of the asymmetrical optical modulator itself from a quadrature point of the transfer function, and modulates the multi-level pulse amplitude modulation signal to an optical signal to generate an optical modulate signal having a chirp.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: March 26, 2024
    Assignee: Molex, LLC
    Inventors: Kuen-Ting Tsai, Wei-Hung Chen, Zuon-Min Chuang, Yao-Wen Liang
  • Publication number: 20240088293
    Abstract: An n-type metal oxide semiconductor transistor includes a gate structure, two source/drain regions, two amorphous portions and a silicide. The gate structure is disposed on a substrate. The two source/drain regions are disposed in the substrate and respectively located at two sides of the gate structure, wherein at least one of the source/drain regions is formed with a dislocation. The two amorphous portions are respectively disposed in the two source/drain regions. The silicide is disposed on the two source/drain regions, wherein at least one portion of the silicide overlaps the two amorphous portions.
    Type: Application
    Filed: October 5, 2022
    Publication date: March 14, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Ya Chiu, Ssu-I Fu, Chin-Hung Chen, Jin-Yan Chiou, Wei-Chuan Tsai, Yu-Hsiang Lin
  • Publication number: 20240088026
    Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.
    Type: Application
    Filed: January 17, 2023
    Publication date: March 14, 2024
    Inventors: Yi Ching Ong, Wei-Cheng Wu, Chien Hung Liu, Harry-Haklay Chuang, Yu-Sheng Chen, Yu-Jen Wang, Kuo-Ching Huang
  • Patent number: 11929767
    Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: March 12, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
  • Publication number: 20230331823
    Abstract: Disclosed herein are shark-derived antibodies and binding molecules with high binding affinity for SARS-CoV-2 coronavirus and the use thereof. Some of the shark-derived antibodies and binding molecules also demonstrate cross-reactivity with and neutralization of other related sarbecoviruses. The complementarity determining region (CDR) sequences and binding characteristics for these antibodies and binding molecules are provided. Also disclosed are the use of these antibodies and binding molecules to detect SARS-CoV-2 coronavirus or other related sarbecoviruses or to prevent or treat SARS-CoV-2 coronavirus or other related sarbecovirus infections.
    Type: Application
    Filed: September 15, 2021
    Publication date: October 19, 2023
    Inventors: Michael Gordon JOYCE, Kayvon MODJARRAD, Helen DOOLEY, Agnes HAJDUCZKI, Wei-Hung CHEN
  • Publication number: 20230229620
    Abstract: Apparatus and methods for high-speed drivers are provided herein. In certain embodiments, a high-speed driver multiplexes two or more data streams. The high-speed driver is implemented with a mux-then-driver topology that provides multiplexing in a predriver circuit. Thus, the multiplexer is eliminated from the full rate output path to relax timing. Driver amplitude control schemes are also disclosed in which a controllable driver includes a group of differential series source transistor (SST) driver slices that are connected in parallel with one another to drive a pair of output terminals, and a group of attenuator slices that are connected in parallel with one another across the pair of output terminals. Additionally, the controllable driver includes a control circuit that activates an attenuator slice for each SST driver slice that is decommissioned to provide output amplitude control.
    Type: Application
    Filed: March 27, 2023
    Publication date: July 20, 2023
    Inventor: Wei-Hung Chen