Patents by Inventor Wei Hung Wu
Wei Hung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250067976Abstract: A head-mounted eye tracking system including a light-transmitting substrate, an eye tracker, and a signal processor is provided. The eye tracker is configured to sense eyeballs of a wearer. The eye tracker includes a plurality of light-emitting devices and a plurality of sensing devices. The plurality of light-emitting devices are configured to emit a tracking beam. The plurality of sensing devices are configured to receive the tracking beam reflected by the eyeballs of the wearer. The signal processor is electrically connected to the eye tracker. The plurality of sensing devices are embedded in grooves within the light-transmitting substrate.Type: ApplicationFiled: November 8, 2024Publication date: February 27, 2025Applicant: Industrial Technology Research InstituteInventors: Han-Kuei Fu, Meng-Han Lin, Hsu-Shih Huang, Ming-Hsien Wu, Chia-Hsin Chao, Wei-Hung Kuo
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Publication number: 20250070043Abstract: A method for depositing an electrically conductive layer on a surface of a three-dimensional (3D) electronic assembly comprising at least one electronic device embedded in a solid polymer material. The method comprises the steps of (i) providing a 3D electronic assembly, (ii) forming at least one flow barrier in the surface of the solid polymer material of the 3D electronic assembly, and (iii) depositing an electrically conductive layer on at least a portion of the surface of the solid polymer material, such that the electrically conductive layer is at least partially delimited by the flow barrier. The present invention also relates to an associated 3D electronic assembly.Type: ApplicationFiled: August 20, 2024Publication date: February 27, 2025Inventors: Ming Hung CHANG, Alan Paul STADNIK, Wei-Po HUANG, Markus REINSTÄDT, Christoph STERNKIKER, Hui Hsien WU
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Patent number: 12224108Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.Type: GrantFiled: October 5, 2023Date of Patent: February 11, 2025Assignee: TDK TAIWAN CORP.Inventors: Feng-Lung Chien, Tsang-Feng Wu, Yuan Han, Tzu-Chieh Kao, Chien-Hung Lin, Kuang-Lun Lee, Hsiang-Hui Hsu, Shu-Yi Tsui, Kuo-Jui Lee, Kun-Ying Lee, Mao-Chun Chen, Tai-Hsien Yu, Wei-Yu Chen, Yi-Ju Li, Kuei-Yuan Chang, Wei-Chun Li, Ni-Ni Lai, Sheng-Hao Luo, Heng-Sheng Peng, Yueh-Hui Kuan, Hsiu-Chen Lin, Yan-Bing Zhou, Chris T. Burket
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Publication number: 20250046734Abstract: A package includes a first package component; a second package component bonded to the first package component by a first plurality of solder connectors; and a first plurality of spacer connectors extending from the first package component to the second package component. A diameter of a spacer connector the first plurality of spacer connectors is larger than a height of a solder connector of the first plurality of solder connectors, and the first plurality of spacer connectors comprises a different material than the first plurality of solder connectors.Type: ApplicationFiled: October 19, 2023Publication date: February 6, 2025Inventors: Wei-Hung Lin, Chi-Chun Hsieh, Ming-Hua Lo, Chung-Chih Chen, Hsin-Hsien Wu
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Patent number: 12205819Abstract: A semiconductor device includes a first transistor and a second transistor. The first transistor includes: a first source and a first drain separated by a first distance, a first semiconductor structure disposed between the first source and first drain, a first gate electrode disposed over the first semiconductor structure, and a first dielectric structure disposed over the first gate electrode. The first dielectric structure has a lower portion and an upper portion disposed over the lower portion and wider than the lower portion. The second transistor includes: a second source and a second drain separated by a second distance greater than the first distance, a second semiconductor structure disposed between the second source and second drain, a second gate electrode disposed over the second semiconductor structure, and a second dielectric structure disposed over the second gate electrode. The second dielectric structure and the first dielectric structure have different material compositions.Type: GrantFiled: December 5, 2022Date of Patent: January 21, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Huan-Chieh Su, Zhi-Chang Lin, Ting-Hung Hsu, Jia-Ni Yu, Wei-Hao Wu, Yu-Ming Lin, Chih-Hao Wang
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Publication number: 20230389492Abstract: The present invention generally relates to a hydroponic culture medium and a hydroponic planting system, more particularly to a Houttuynia cordata hydroponic culture medium, a Houttuynia cordata hydroponic planting system, Houttuynia cordata extracts, a method, and applications thereof.Type: ApplicationFiled: March 14, 2023Publication date: December 7, 2023Inventors: FANG-RONG CHANG, WEI-HUNG WU, YI-HONG TSAI, CHUNG-HSIEN CHEN, YEN-CHI LOO, HSUEH-ER CHEN, YEN-CHANG CHEN, HUI-PING HSIEH, CHEN HSIEH
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Patent number: 8854340Abstract: A touch device includes a touch sensing unit, a vibrator and a vibration transmitting unit. The vibrator is used for generating vibration energy. The vibration transmitting unit is installed on a backside of the touch sensing unit and connected with the vibrator for transmitting the vibration energy to the touch sensing unit. The vibration transmitting unit includes a vibration-homogenizing plate. The rigidity of the vibration-homogenizing plate decreases as the distance from the vibrator increases.Type: GrantFiled: August 31, 2011Date of Patent: October 7, 2014Assignee: AU Optronics Corp.Inventors: Wei-Hung Wu, Hung-Chuo Lee, Kuan-Fu Huang
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Patent number: 8651690Abstract: A light-emitting diode light bar includes a printed circuit board and a light-emitting diode. The printed circuit board has a protective layer, a first signal line, and a first extension line. The LED is disposed on the first signal line and the first extension line. The protective layer is formed above the first signal line and the first extension line, and has an opening that exposes a portion of the first signal line, and a portion of the extension line, such that a first exposed length of the first signal line is substantially equal to a second exposed length of the first extension line.Type: GrantFiled: April 24, 2012Date of Patent: February 18, 2014Assignee: AU Optronics CorporationInventor: Wei-Hung Wu
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Publication number: 20130051070Abstract: A light-emitting diode light bar includes a printed circuit board and a light-emitting diode. The printed circuit board has a protective layer, a first signal line, and a first extension line. The LED is disposed on the first signal line and the first extension line. The protective layer is formed above the first signal line and the first extension line, and has an opening that exposes a portion of the first signal line, and a portion of the extension line, such that a first exposed length of the first signal line is substantially equal to a second exposed length of the first extension line.Type: ApplicationFiled: April 24, 2012Publication date: February 28, 2013Applicant: AU Optronics CorporationInventor: Wei-Hung WU
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Patent number: 8319429Abstract: A light emitting diode (LED) module including a circuit board and at least one LED package is provided. The circuit board has a plurality of driving signal wirings and at least one ground wiring. The LED package is disposed on the circuit board and is electrically connected to the driving signal wirings. The LED package includes at least one LED chip, a plurality of signal leads, and at least one ground lead. The signal leads are electrically connected to the LED chip. The ground lead is electrically insulated from the signal lead and is electrically connected to the ground wiring. The ground lead is electrically insulated from the LED chip and has favorable electrostatic discharge (ESD) protection performance.Type: GrantFiled: January 18, 2011Date of Patent: November 27, 2012Assignee: Au Optronics CorporationInventors: Wei-Hung Wu, Hung-Chuo Lee
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Patent number: 8246219Abstract: An optical engine of a light emitting diode (LED) light module comprises a heat dissipation device, an LED light bar and an optical component. The heat dissipation device comprises a base plate and a plurality of fin plates vertically welded onto a surface of the base plate. The LED light bar is disposed on an opposite surface of the base plate so that the LED light bar can dissipate heat through the fin plates. The optical component having a space for accommodating the LED light is provided to form a desired light distribution pattern.Type: GrantFiled: October 29, 2009Date of Patent: August 21, 2012Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Yen Chu Teng, Chia Chen Chang, Wei Hung Wu, Shang Te Tu
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Patent number: 8147101Abstract: An LED lamp includes an illumination apparatus and a heat-dissipating waterproof cover. The illumination apparatus includes LED modules; and the heat-dissipating waterproof cover is configured to cover the LED modules. The heat-dissipating waterproof cover includes a plurality of drain members, and a gap is formed between every two drain members so as to increase the air convection, thereby increasing heat dissipation efficiency of the LED modules. Every two adjacent drain members are partially overlapping in vertical to prevent the intrusion of water.Type: GrantFiled: August 24, 2009Date of Patent: April 3, 2012Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Shang Te Tu, Yen Chu Teng, Chia Chen Chang, Wei Hung Wu
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Publication number: 20120057358Abstract: A light emitting diode (LED) module including a circuit board and at least one LED package is provided. The circuit board has a plurality of driving signal wirings and at least one ground wiring. The LED package is disposed on the circuit board and is electrically connected to the driving signal wirings. The LED package includes at least one LED chip, a plurality of signal leads, and at least one ground lead. The signal leads are electrically connected to the LED chip. The ground lead is electrically insulated from the signal lead and is electrically connected to the ground wiring. The ground lead is electrically insulated from the LED chip and has favorable electrostatic discharge (ESD) protection performance.Type: ApplicationFiled: January 18, 2011Publication date: March 8, 2012Applicant: Au Optronics CorporationInventors: Wei-Hung Wu, Hung-Chuo Lee
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Publication number: 20120050199Abstract: A touch device includes a touch sensing unit, a vibrator and a vibration transmitting unit. The vibrator is used for generating vibration energy. The vibration transmitting unit is installed on a backside of the touch sensing unit and connected with the vibrator for transmitting the vibration energy to the touch sensing unit. The vibration transmitting unit includes a vibration-homogenizing plate. The rigidity of the vibration-homogenizing plate decreases as the distance from the vibrator increases.Type: ApplicationFiled: August 31, 2011Publication date: March 1, 2012Applicant: AU OPTRONICS CORP.Inventors: Wei-Hung WU, Hung-Chuo LEE, Kuan-Fu HUANG
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Publication number: 20100110679Abstract: An optical engine of a light emitting diode (LED) light module comprises a heat dissipation device, an LED light bar and an optical component. The heat dissipation device comprises a base plate and a plurality of fin plates vertically welded onto a surface of the base plate. The LED light bar is disposed on an opposite surface of the base plate so that the LED light bar can dissipate heat through the fin plates. The optical component having a space for accommodating the LED light is provided to form a desired light distribution pattern.Type: ApplicationFiled: October 29, 2009Publication date: May 6, 2010Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY INC.Inventors: YEN CHU TENG, CHIA CHEN CHANG, WEI HUNG WU, SHANG TE TU
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Publication number: 20100053966Abstract: An LED lamp includes an illumination apparatus and a heat-dissipating waterproof cover. The illumination apparatus includes LED modules; and the heat-dissipating waterproof cover is configured to cover the LED modules. The heat-dissipating waterproof cover includes a plurality of drain members, and a gap is formed between every two drain members so as to increase the air convection, thereby increasing heat dissipation efficiency of the LED modules. Every two adjacent drain members are partially overlapping in vertical to prevent the intrusion of water.Type: ApplicationFiled: August 24, 2009Publication date: March 4, 2010Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY INC.Inventors: SHANG TE TU, YEN CHU TENG, CHIA CHEN CHANG, WEI HUNG WU
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Publication number: 20100027255Abstract: A light box apparatus comprises at least one light source, a frame, and a light guide plate. The frame, the side frames of which are made of metallic formed bars, has an accommodation space. The light guide plate, disposed in the accommodation space, has a lateral side. The frame has at least one side frame edge, which has an inlay groove adjacent to the lateral side, and the light, emitted from the light source disposed in the inlay groove, passes through the lateral side and transmits in the light guide plate.Type: ApplicationFiled: July 24, 2009Publication date: February 4, 2010Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY INC.Inventors: CHIA CHEN CHANG, SHIH CHIEH TSENG, WEI HUNG WU
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Publication number: 20090296388Abstract: An LED lighting module comprises an array luminous element and a bar-like light guiding structure. The array luminous element comprises a plurality of illuminants of top-emitting LEDs arranged in an array form. The bar-like light guiding structure surrounds two laterals of the array luminous element. The bar-like light guiding structure comprises a first curved surface and a second curved surface. The first curved surface and the second curved surface respectively descend toward the middle of the array luminous element from the two sides of the array luminous element, and meet above the middle of the array luminous element. The first curved surface and the second curved surface connect with each other at the plane with a certain angle and in tangency where the positive optical axis exists. The positive optical axis is the direction perpendicular to the plane on which the LEDs are mounted.Type: ApplicationFiled: May 27, 2009Publication date: December 3, 2009Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY INC.Inventors: WEI HUNG WU, CHIA CHEN CHANG