Abstract: A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure is formed in the first substrate. The method includes bonding the first substrate to a carrier. The method includes thinning down the first substrate. The method also includes forming a dielectric material in the recess and over a top surface of the thinned first substrate. The method further includes performing a planarization process to remove the dielectric material and expose the conductive structure over the top surface. In addition, the method includes removing the carrier from the first substrate.

Abstract: The wall fastener for a wireless transmission module includes a supporting frame and a case. The supporting frame has a front face, a rear face, a first engagement portion and a slot. The case has a rear plate which has an outer face, an inner face, a second engagement portion and a stopper. The stopper partially projects out of the outer face. The first and second engagement portions mate and the stopper is received by the slot. The wireless transmission module and the supporting frame are tightly engaged and easily disengaged by a tool.

Abstract: The wall fastener for a wireless transmission module includes a supporting frame and a case. The supporting frame has a front face, a rear face, a first engagement portion and a slot. The case has a rear plate which has an outer face, an inner face, a second engagement portion and a stopper. The stopper partially projects out of the outer face. The first and second engagement portions mate and the stopper is received by the slot. The wireless transmission module and the supporting frame are tightly engaged and easily disengaged by a tool.