Patents by Inventor Wei-Ja Shong

Wei-Ja Shong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9112218
    Abstract: The present invention relates to a solid oxide fuel cell stack modular structure, in that, being an integration of a plurality of fuel cell modules, it can determine the amount of fuel cell modules to be stacked in the modular structure according to an actual power output demand while ensuring airtightness in the modular structure, and moreover, with the modularization design, each fuel cell module in the modular structure that is malfunctioning can be detached and removed easily from the stack individually so as to be replaced by another operative fuel cell module.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: August 18, 2015
    Assignee: INSTITUTE OF NUCLEAR ENERGY RESEARCH ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN
    Inventors: Wei-Ja Shong, Chien-Kuo Liu, Szu-Han Wu, Peng Yang, Chien-Hsiung Lee
  • Patent number: 7663384
    Abstract: A simple method and apparatus for measuring the low area specific resistance of a metal plate, particularly in high temperature (<962° C.) environment, are provided. The metal plate, which may include a coating, is used in high temperature environment for electric conduction. Silver paste is applied on the metal surface. Paste sintering processes to minimize contact resistance are described. These sintering processes cause negligible change to the original metal condition, thus accurate and precise area specific resistivity of the metal plate can be obtained.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: February 16, 2010
    Assignee: Atomic Energy Council
    Inventor: Wei-Ja Shong
  • Publication number: 20090051375
    Abstract: To measure the area specific resistance of a metallic surface, silver paste is applied on a first surface of a metal plate. The silver paste is dried and molded into a desired shape; then it is sintered at a temperature close to the melting point of silver and turned into a silver foil, forming non-porous contact with the first surface. The second surface (reverse surface) is polished. First and second wires are connected to the silver foil by a silver drop. Third and fourth wires are spot welded to the second surface of the metal plate within the covered area right under the silver foil. The first and third wires are connected to the positive and negative electrodes of a power supply, and the second and fourth wires to the positive and negative electrodes of a voltmeter. A current I is provided. The temperature of the metal plate is first raised to a suitable point not close to the melting point of silver for sintering the silver drop attaching the first and second wires.
    Type: Application
    Filed: August 22, 2007
    Publication date: February 26, 2009
    Applicant: ATOMIC ENERGY COUNCIL-INSTITUTE OF NUCLEAR ENERGY RESEARCH
    Inventor: Wei-Ja Shong