Patents by Inventor Wei-Jan Chen

Wei-Jan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973425
    Abstract: A power converter includes a power stage circuit, a ramp generator circuit, and a control circuit. The power stage circuit generates an output signal according to an input signal and a control signal. The ramp generator circuit generates a ramp signal according to the control signal, the input signal, and the output signal. The control circuit generates the control signal according to the output signal, a reference signal, and the ramp signal.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: April 30, 2024
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Chieh-Ju Tsai, Ching-Jan Chen, Zhen-Guo Ding, Zhe-Hui Lin, Wei-Ling Chen
  • Patent number: 11968856
    Abstract: Exemplary subpixel structures include a directional light-emitting diode structure characterized by a full-width-half-maximum (FWHM) of emitted light having a divergence angle of less than or about 10°. The subpixel structure further includes a lens positioned a first distance from the light-emitting diode structure, where the lens is shaped to focus the emitted light from the light-emitting diode structure. The subpixel structure still further includes a patterned light absorption barrier positioned a second distance from the lens. The patterned light absorption barrier defines an opening in the barrier, and the focal point of the light focused by the lens is positioned within the opening. The subpixels structures may be incorporated into a pixel structure, and pixel structures may be incorporated into a display that is free of a polarizer layer.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: April 23, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Chung-Chih Wu, Po-Jui Chen, Hoang Yan Lin, Guo-Dong Su, Wei-Kai Lee, Chi-Jui Chang, Wan-Yu Lin, Byung Sung Kwak, Robert Jan Visser
  • Patent number: 11956994
    Abstract: The present disclosure is generally related to 3D imaging capable OLED displays. A light field display comprises an array of 3D light field pixels, each of which comprises an array of corrugated OLED pixels, a metasurface layer disposed adjacent to the array of 3D light field pixels, and a plurality of median layers disposed between the metasurface layer and the corrugated OLED pixels. Each of the corrugated OLED pixels comprises primary or non-primary color subpixels, and produces a different view of an image through the median layers to the metasurface to form a 3D image. The corrugated OLED pixels combined with a cavity effect reduce a divergence of emitted light to enable effective beam direction manipulation by the metasurface. The metasurface having a higher refractive index and a smaller filling factor enables the deflection and direction of the emitted light from the corrugated OLED pixels to be well controlled.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 9, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Chung-Chih Wu, Hoang Yan Lin, Guo-Dong Su, Zih-Rou Cyue, Li-Yu Yu, Wei-Kai Lee, Guan-Yu Chen, Chung-Chia Chen, Wan-Yu Lin, Gang Yu, Byung-Sung Kwak, Robert Jan Visser, Chi-Jui Chang
  • Publication number: 20240105642
    Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Patent number: 11943525
    Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: March 26, 2024
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Wei-Ping Chen, Jau-Jan Deng, Wei-Feng Lin
  • Patent number: 11942464
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20240088062
    Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Patent number: 9840563
    Abstract: Disclosed herein is a method for treating and/or preventing atrial fibrillation in a subject, comprising administering to the subject a pharmaceutical composition comprising an anti-CD44 neutralizing antibody or an antigen binding portion thereof which specifically binds to the amino-terminal domain of CD44. The anti-CD44 neutralizing antibody is a monoclonal antibody. The pharmaceutical composition further includes a pharmaceutically acceptable carrier.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: December 12, 2017
    Assignee: Chang Gung Memorial Hospital, Linkou
    Inventors: Wei-Jan Chen, Yung-Hsinn Yeh, Shang-Hung Chang
  • Publication number: 20160215057
    Abstract: Disclosed herein is a method for treating and/or preventing atrial fibrillation in a subject, comprising administering to the subject a pharmaceutical composition comprising an anti-CD44 neutralizing antibody or an antigen binding portion thereof which specifically binds to the amino-terminal domain of CD44. The anti-CD44 neutralizing antibody is a monoclonal antibody. The pharmaceutical composition further includes a pharmaceutically acceptable carrier.
    Type: Application
    Filed: October 6, 2015
    Publication date: July 28, 2016
    Inventors: Wei-Jan Chen, Yung-Hsinn Yeh, Shang-Hung Chang
  • Patent number: 6939863
    Abstract: The present application concerns pharmaceutical compositions, methods of use thereof and medical devices for preventing or treating atherosclerosiss or restenosis or both. The present invention discloses a pharmaceutical composition, including a pharmaceutically acceptable carrier and PTU in an amount sufficient to prevent atherosclerosis or restenosis in a subject. The present invention further discloses a method of inhibiting atherosclerosis or restenosis in a subject, including identifying a subject suspected of needing inhibition of atherosclerosis or restenosis and administering to the subject PTU in an amount sufficient to prevent atherosclerosis or restenosis in the subject. The present invention further discloses an article of manufacture including a medical device and PTU.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: September 6, 2005
    Inventor: Wei-Jan Chen
  • Publication number: 20030130228
    Abstract: The present application concerns pharmaceutical compositions, methods of use thereof and medical devices for preventing or treating atherosclerosiss or restenosis or both. The present invention discloses a pharmaceutical composition, including a pharmaceutically acceptable carrier and PTU in an amount sufficient to prevent atherosclerosis or restenosis in a subject. The present invention further discloses a method of inhibiting atherosclerosis or restenosis in a subject, including identifying a subject suspected of needing inhibition of atherosclerosis or restenosis and administering to the subject PTU in an amount sufficient to prevent atherosclerosis or restenosis in the subject. The present invention further discloses an article of manufacture including a medical device and PTU.
    Type: Application
    Filed: October 16, 2002
    Publication date: July 10, 2003
    Inventor: Wei-Jan Chen