Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

Abstract: An electronic includes an electronic element, an encapsulation layer surrounding the electronic element, a first circuit structure, a second circuit structure and a connecting structure. The encapsulation layer has a top surface, a bottom surface and an opening, wherein a sidewall of the opening connects the top surface and the bottom surface. The first circuit structure is disposed at the top surface of the encapsulation layer. The second circuit structure is disposed at the bottom surface of the encapsulation layer. The connecting structure is disposed in the opening, wherein the electronic element is electrically connected to the second circuit structure through the first circuit structure and the connecting structure. The connecting structure includes a first sub layer and a second sub layer, the first sub layer is located between the encapsulation layer and the second sub layer, and the first sub layer covers the sidewall of the opening.

Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.

Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A calcium phosphate-based core-shell structured material, a method for preparing the same, and an oral care composition using the same are provided. The calcium phosphate-based core-shell structured material includes an amorphous calcium phosphate (ACP) core and a ?-tricalcium phosphate (?-TCP) shell covering the core. The method includes a first sintering step and a second sintering step. The first sintering step is to sinter an ACP material at between 700° C. and 800° C. to obtain an ?-TCP shell. The second sintering step allows the ?-TCP shell to form into the ?-TCP shell by sintering at between 800° C. and 900° C. The oral care composition includes a calcium phosphate mixture and an orally receivable carrier. The calcium phosphate mixture includes a powder of the calcium phosphate-based core-shell structured material and a tricalcium phosphate powder mixed in a weight ratio from 3:5 to 3:7.

Abstract: A medicament delivery tooth covering is provided. The medicament delivery tooth covering includes a tooth covering and a carrier layer. The tooth covering has at least one attachment surface that covers a surface of teeth of a user. The carrier layer is arranged on the at least one attachment surface. The carrier layer carries a medicament, and the medicament contains powder particles. When water is introduced to an inner side of the at least one attachment surface of the tooth covering, the water is allowed to pass through the carrier layer, so that the medicament contacts the water. The powder particles are dual-structured powder particles that have a core structure and an outer layer structure that encloses an outer side of the core structure.

Abstract: The present invention discloses a method for producing the alpha-calcium sulfate hemihydrate bone graft, which comprises the following steps: mixing calcium sulfate dihydrate and deionized water to produce calcium sulfate dihydrate paste; stirring and heating the calcium sulfate dihydrate paste at least 160° C. within 100-350 psi to produce the conversion calcium sulfate hemihydrate, filtering the conversion calcium sulfate hemihydrate with high temperature to produce the filtered calcium sulfate hemihydrate, and washing the filtered calcium sulfate hemihydrate by absolute alcohol to get the alpha-calcium sulfate hemihydrate bone graft. The present invention does not use any catalyst, possesses a high purity, high mechanical strength, and good biocompatibility, facilitates bone growth and angiogenesis, requires only 31° C., the highest temperature, during the curing process. It makes the present invention more secure in the biomedical applications.

Abstract: The present invention discloses a method for three dimensional printing artificial skin. The method comprises the following steps of: printing a dermis layer by a hydrogel combined with an autologous dermal cell and; printing an epidermis layer on the dermis layer by a hydrogel combined with an autologous kerationocytes cell; implanting a plurality of progenitor cells for sweat glands and hair follicles through the epidermis layer into the dermis layer to form an artificial skin. Because all used materials are from the autologous skin, and the 3D printing technology is used to implant the progenitor cells for sweat glands and hair follicles to form the artificial skin which has sweat glands and hair follicles, the present invention can get an artificial skin with a complete skin structure.

Abstract: A bone repairing material comprises a composition including an ?-calcium sulfate hemihydrate and an autologous bone powder, wherein the bone repairing material contains 20˜60 weight percent of the autologous bone powder and 40˜80 weight percent of the ?-calcium sulfate hemihydrate. The bone repairing material has a particle size in the range of 50˜1,000 ?m. A method for producing the bone repairing material comprises the following steps: producing the ?-calcium sulfate hemihydrate from a calcium sulfate dihydrate by microwave heating; grinding an autologous bone for generating the autologous bone powder; and, mixing the ?-calcium sulfate hemihydrate and the autologous bone powder to form the bone repairing material.

Abstract: The present invention discloses a method for producing the alpha-calcium sulfate hemihydrate bone graft, which comprises the following steps: mixing calcium sulfate dihydrate and deionized water to produce calcium sulfate dihydrate paste; stirring and heating the calcium sulfate dihydrate paste at least 160° C. within 100-350 psi to produce the conversion calcium sulfate hemihydrate, filtering the conversion calcium sulfate hemihydrate with high temperature to produce the filtered calcium sulfate hemihydrate, and washing the filtered calcium sulfate hemihydrate by absolute alcohol to get the alpha-calcium sulfate hemihydrate bone graft. The present invention does not use any catalyst, possesses a high purity, high mechanical strength, and good biocompatibility, facilitates bone growth and angiogenesis, requires only 31° C., the highest temperature, during the curing process. It makes the present invention more secure in the biomedical applications.

Abstract: The disclosure is related to a method and a system for managing multiple devices within a network system. For the purpose of configuration or firmware synchronization for the devices within a network segment, the system allows an operator to optionally select the nodes operating as different roles such as a master, synchronization-source device, and slave. A selected device being the master is embedded with a web-based management mechanism, and therefore is remotely accessible. The management program provides a management interface in response to a management link. The management interface allows the operator to instruct the master to synchronize its configuration/firmware with the other selected nodes. Alternatively, through the master, one of the nodes is selected to be the synchronization-source device, and instructed to share its configuration to the other nodes. Through this management mechanism, the multiple nodes can be synchronized as applying the configuration, or/and firmware simultaneously.

Abstract: A device for controlling power to a vehicular differential speed controller is applied to control a differential speed controller inside a vehicle, and has an input voltage regulation circuit, a trigger circuit, a driving circuit and a relay. The input voltage regulation circuit converts an input voltage into an operating voltage and supplies the operating voltage to the trigger circuit. The trigger circuit generates a trigger signal after receiving a parking brake signal, such that the driving circuit activates the relay according to the trigger signal and supplies an output voltage to the differential speed controller. Accordingly, the present invention can automatically provide a sufficient power supply time to the differential speed controller to switch an operation state of a vehicle differential to a locked state when the vehicle power is switched off and the parking brake is activated.

Abstract: A built-in self-test structure for a pressure tester and a method thereof are provided. The built-in self-test structure includes a substrate, a plurality of membrane layers, a fixing portion, an electrical heating unit and a sensing circuit unit. The membrane layers are formed on the substrate. The fixing portion is configured on the membrane layers and includes a notch. The notch and the membrane layers define a cavity. The electrical heating unit is configured on one membrane layer, and the sensing circuit unit is configured on another membrane layer. The electrical heating unit heats up to increase the pressure in the cavity according to an input voltage, so that the membrane layers have a small deformation. The sensing circuit unit outputs a test signal according to the small deformation.

Abstract: A device for controlling power to a vehicular differential speed controller is applied to control a differential speed controller inside a vehicle, and has an input voltage regulation circuit, a trigger circuit, a driving circuit and a relay. The input voltage regulation circuit converts an input voltage into an operating voltage and supplies the operating voltage to the trigger circuit. The trigger circuit generates a trigger signal after receiving a parking brake signal, such that the driving circuit activates the relay according to the trigger signal and supplies an output voltage to the differential speed controller. Accordingly, the present invention can automatically provide a sufficient power supply time to the differential speed controller to switch an operation state of a vehicle differential to a locked state when the vehicle power is switched off and the parking brake is activated.

Abstract: A built-in self-test structure for a pressure tester and a method thereof are provided. The built-in self-test structure includes a substrate, a plurality of membrane layers, a fixing portion, an electrical heating unit and a sensing circuit unit. The membrane layers are formed on the substrate. The fixing portion is configured on the membrane layers and includes a notch. The notch and the membrane layers define a cavity. The electrical heating unit is configured on one membrane layer, and the sensing circuit unit is configured on another membrane layer. The electrical heating unit heats up to increase the pressure in the cavity according to an input voltage, so that the membrane layers have a small deformation. The sensing circuit unit outputs a test signal according to the small deformation.

Abstract: A flash memory device includes a Chip-On-Board (COB) type circuit board and a number of first and second contacts electrically connected to the circuit board. Each first contact includes a stiff first contact portion formed on an upper surface of the circuit board. Each second contact includes a cantilevered planar second contact portion extending along the front-to-rear direction. When the flash memory device is inserted into a USB 3.0 receptacle connector, the first and the second contact portions jointly electrically connect with the USB 3.0 receptacle connector. The planar second contact portions provide larger contacting area for mating with the corresponding contacts of the USB 3.0 receptacle connector.

Abstract: A flash memory device includes a circuit board and a contact module slidable with respect to the circuit board. The circuit board includes a plurality of first contacts each having a stiff first contact portion. The contact module includes a slider and a plurality of second contacts fixed to the slider. The slider is slidable with respect to the circuit board along a front-to-rear direction between a first position and a second position. The flash memory device is compatible to USB 2.0 and USB 3.0 receptacle connectors via the slidable contact module.