Abstract: A driving apparatus and a driving method of a backlight module are provided. The backlight module includes multiple LEDs. The driving apparatus includes at least one thermal sensor, an optical sensor, and a processor. The thermal sensor is for detecting a working temperature of the LEDs. The optical sensor is for detecting brightness and color of the backlight module after a calibration function is enabled, to obtain difference values of the detected brightness and color with respect to predetermined brightness and color. The processor is for providing at least one initial thermal compensation table, to determine working currents of the LEDs associated with the working temperature. The processor further is for calibrating a content of the initial thermal compensation table corresponding with a current working temperature of the LEDs and storing the calibrated thermal compensation table as the initial thermal compensation table after the calibration function is enabled.

Abstract: A light emitting diode (LED) package module and the manufacturing method thereof are presented. A plurality of LEDs and a plurality of semiconductor elements are disposed on a silicon substrate, and then a plurality of lenses is formed above the positions of the plurality of the LEDs, and the plurality of the lenses is corresponding to the plurality of the LEDs. Then, a plurality of package units is defined on the silicon substrate, and each package unit has a semiconductor element and at least one LED. After that, the silicon substrate is cut to form a plurality of LED package modules, and each LED package module has at least one package unit.

Abstract: A light emitting diode package includes a mount, a plurality of LED chips, and a first and a second sealants made of different materials. The mount has an accommodation space and at least one partition member to divide the accommodation space into a plurality of separate cavities. The LED chips are placed in the cavities, and emitting beams of the LED chips exiting through the cavities include a first emission with a first wavelength band and a second emission with a second wavelength band, and the second wavelength band is different to the first one. The first and the second sealants are respectively used for sealing at least one of the LED chips placed in at least one of the cavities through which the first or the second emission exits. The first and the second sealants are separate from each other by the partition member.

Abstract: A surface light source structure having a circuit board, a first light emitting diode (LED) array, and a second LED array is provided. The first and second LED arrays are assembled on the circuit board. Each LED rows of the two LED arrays has a plurality of LED units connected in series. The LED rows of the first LED array are connected in parallel. The LED rows of the second LED array are connected in parallel. The LED rows of the second LED array are intersected between the LED rows of the first LED array. Positive-to-negative directions of the LED units of the first and second LED array are arranged in opposite directions.

Abstract: A light source control method and a light source control device are used for controlling a light source. The light source control device includes a position detecting sensor and a microcontroller. The light source control method includes steps of generating a first signal according to an object touching a position of the position detecting sensor, and generating a control signal according to a light source adjustable parameter set corresponding to the first signal for controlling an illuminating status of the light source. The light source adjustable parameter set includes a plurality of color value components. The control signal is generated by the microcontroller according to the color value components.

Abstract: A light emitting diode (LED) package module and the manufacturing method thereof are presented. A plurality of LEDs and a plurality of semiconductor elements are disposed on a silicon substrate, and then a plurality of lenses is formed above the positions of the plurality of the LEDs, and the plurality of the lenses is corresponding to the plurality of the LEDs. Then, a plurality of package units is defined on the silicon substrate, and each package unit has a semiconductor element and at least one LED. After that, the silicon substrate is cut to form a plurality of LED package modules, and each LED package module has at least one package unit.

Abstract: A light feedback control system can obtain a correct light feedback signal for a backlight source by using an optical sensor disposed inside a backlight unit or outside a display device after subtracting the effect of ambient light sensed by the optical sensor when a backlight element is turned off. The optical sensor senses light intensity and the ambient light source at a double frequency of the frequency at which a backlight element emits light. The light feedback control system may further control the ambient light source and the backlight element, driving them to illuminate alternately, while the optical sensor synchronizes with the backlight element and senses light signals of the backlight element. Accordingly, exact information about the light intensity or color of the backlight element can be obtained for feedback control of the display device.

Abstract: A driving apparatus and a driving method of a backlight module are provided. The backlight module includes multiple LEDs. The driving apparatus includes at least one thermal sensor, an optical sensor, and a processor. The thermal sensor is for detecting a working temperature of the LEDs. The optical sensor is for detecting brightness and color of the backlight module after a calibration function is enabled, to obtain difference values of the detected brightness and color with respect to predetermined brightness and color. The processor is for providing at least one initial thermal compensation table, to determine working currents of the LEDs associated with the working temperature. The processor further is for calibrating a content of the initial thermal compensation table corresponding with a current working temperature of the LEDs and storing the calibrated thermal compensation table as the initial thermal compensation table after the calibration function is enabled.

Abstract: A light-emitting device includes a package housing, at least one light-emitting element, a plurality miniature elements, and a package filler. The package housing includes a recess. The light-emitting element is disposed in the recess. The miniature elements are formed on the light-emitting element. Light from the light-emitting element is output to the exterior of the recess in a predetermined direction by adjustment of the miniature elements. The package filler is filled in the recess and covers the light-emitting element and miniature elements.

Abstract: A light source control method and a light source control device are used for controlling a light source. The light source control device includes a position detecting sensor and a microcontroller. The light source control method includes steps of generating a first signal according to an object touching a position of the position detecting sensor, and generating a control signal according to a light source adjustable parameter set corresponding to the first signal for controlling an illuminating status of the light source. The light source adjustable parameter set includes a plurality of color value components. The control signal is generated by the microcontroller according to the color value components.

Abstract: A light emitting device including a substrate, a plurality of light sources and a lens array is provided. The light sources and the lens array are disposed on the substrate, and the light sources are arranged to a polygon. The lens array includes a plurality of first lenses and a plurality of second lenses. The first lenses surrounded by the second lenses cover the light sources and respectively correspond to one of the light sources.

Abstract: A LED package structure including a carrier, LED chips, and a package body is provided. The carrier defines a cave with two opposite first side walls, two opposite second side walls and a rectangular bottom surface. An included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface. The LED chips are disposed in a straight-line arrangement on a center line of the bottom surface and electrically connected to the carrier. The center line is parallel to a long side of the bottom surface. The package body is formed on the carrier to cover the LED chips. Since the included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface, light provided by the LED package structure has different spatial radiation patterns in different directions.

Abstract: A light-emitting device includes a package housing, at least one light-emitting element, a plurality miniature elements, and a package filler. The package housing includes a recess. The light-emitting element is disposed in the recess. The miniature elements are formed on the light-emitting element. Light from the light-emitting element is output to the exterior of the recess in a predetermined direction by adjustment of the miniature elements. The package filler is filled in the recess and covers the light-emitting element and miniature elements.

Abstract: A liquid crystal display module and an integrated driving board thereof are disclosed. The driving board includes a substrate, a circuit pattern, a timing clock driver, a light emitting diode (LED) driving module, a color management module and a photosensitive chip. The circuit pattern is disposed on the surface of the substrate. The timing clock driver, the LED driving module, the color management module and the photosensitive chip are disposed on the substrate and electrically coupled to the circuit pattern. The LED driving module is electrically coupled to the timing clock driver. The color management module is electrically coupled to the LED driving module. The photosensitive chip is electrically coupled to the color management module.

Abstract: A backlight module includes a light box, at least one light guide tube, and at least one light source. The light box has a light exit side. The light guide tube has a plurality of microstructures which are spaced apart along a length of the light guide tube. The light guide tube and the microstructures are disposed in the light box in a particular arrangement so that the microstructures are placed substantially in a matrix array within the light box. The light source is disposed adjacent to the light guide tube, and is operable so as to emit a light beam to the light guide tube. The microstructures disperse the light beam from the light guide tube.

Abstract: A light emitting diode package includes a mount, a plurality of LED chips, and a first and a second sealants made of different materials. The mount has an accommodation space and at least one partition member to divide the accommodation space into a plurality of separate cavities. The LED chips are placed in the cavities, and emitting beams of the LED chips exiting through the cavities include a first emission with a first wavelength band and a second emission with a second wavelength band, and the second wavelength band is different to the first one. The first and the second sealants are respectively used for sealing at least one of the LED chips placed in at least one of the cavities through which the first or the second emission exits. The first and the second sealants are separate from each other by the partition member.

Abstract: A surface light source structure having a circuit board, a first light emitting diode (LED) array, and a second LED array is provided. The first and second LED arrays are assembled on the circuit board. Each LED rows of the two LED arrays has a plurality of LED units connected in series. The LED rows of the first LED array are connected in parallel. The LED rows of the second LED array are connected in parallel. The LED rows of the second LED array are intersected between the LED rows of the first LED array. Positive-to-negative directions of the LED units of the first and second LED array are arranged in opposite directions.

Abstract: A LED package structure including a carrier, LED chips, and a package body is provided. The carrier defines a cave with two opposite first side walls, two opposite second side walls and a rectangular bottom surface. An included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface. The LED chips are disposed in a straight-line arrangement on a center line of the bottom surface and electrically connected to the carrier. The center line is parallel to a long side of the bottom surface. The package body is formed on the carrier to cover the LED chips. Since the included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface, light provided by the LED package structure has different spatial radiation patterns in different directions.

Abstract: A lens defines central axis, and includes a light receiving surface, a light reflecting surface, and a light exiting surface. The light reflecting surface is opposite to the light receiving surface along the central axis. The light exiting surface extends between the light receiving surface and the light reflecting surface. When a light source emits a light, a portion of the light emitted by the light source passes through the light receiving surface, and is incident on and is reflected at a plurality of reflections angles by the light reflecting surface to the light exiting surface so as to exit the lens in directions perpendicular to the light exiting surface for all said plurality of reflection angles.

Abstract: An illumination assembly includes a first diode row having first and second multi-chip LED units, and a second diode row having third and fourth multi-chip LED units. The first through fourth multi-chip LED units each includes red, green, and blue LEDs. Light of the red, green, and blue LEDs of the first through fourth multi-chip LED units has a respective primary emission direction (PED). The PEDs of same colored ones of the LEDs of the first and second multi-chip LED units are oriented along one direction. The PEDs of the remaining two LEDs of the first and second multi-chip LED units are oriented in opposite directions from each other. The PEDs of the LEDs of the third and fourth multi-chip LED units are oriented in opposite directions as compared to those of the LEDs of the first and second multi-chip LED units, respectively.