Patents by Inventor Wei-Jen LIANG

Wei-Jen LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240184198
    Abstract: Microcapsules including a color-filtering shell and a core comprising a leuco dye or dye precursor, a photoinitiator or photosensitizer, and a photohardenable or photosoftenable material are provided for use in microcapsule imaging sheets. The imaging sheets including such microcapsules reduce undesirable crosstalk among the microcapsules of various colors and provide significantly improved color fidelity of the image thus reproduced.
    Type: Application
    Filed: December 2, 2022
    Publication date: June 6, 2024
    Applicant: Polaroid IP B.V.
    Inventors: Rong-Chang Liang, Wei You, Chun-Jen Chen
  • Patent number: 12002684
    Abstract: A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin, Wei-Wei Liang, Liang-Guang Chen, Kei-Wei Chen, Hung Yen, Ting-Hsun Chang, Chi-Hsiang Shen, Li-Chieh Wu, Chi-Jen Liu
  • Publication number: 20240173819
    Abstract: A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a grinding wheel spindle of wafer processing equipment is obtained, and a grinding stability lobe diagram is generated accordingly. A grinding speed is selected based on a speed range of the grinding wheel spindle. Multiple grinding parameter combinations are determined based on the grinding speed. Multiple grinding simulation result combinations corresponding to the grinding parameter combinations are generated. A specific grinding parameter combination is selected based on each of the grinding simulation result combinations, and the wafer processing equipment is set accordingly.
    Type: Application
    Filed: September 12, 2023
    Publication date: May 30, 2024
    Applicant: GlobalWafers Co., Ltd.
    Inventors: Chih-Chun Cheng, Wen-Nan Cheng, Meng-Bi Lin, Chi-Feng Li, Tzu-Fan Chiang, Wei-Jen Chen, Chien Hung Chen, Hsiu Chi Liang, Ying-Ru Shih
  • Publication number: 20240136317
    Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu
  • Patent number: 11955807
    Abstract: A rigid wireless charging mouse pad includes a rigid board layer, a double-sided adhesive plate and a coil. The underside of the rigid board layer has a single-ring groove with an inner top groove wall. The double-sided adhesive plate is adhered to the inner top groove wall. The coil has surrounding rings arranged side by side with one another to form a coil module which is stacked on the double-sided adhesive plate in the single-ring groove and adhered by the double-sided adhesive plate to achieve a wireless charging effect by the mouse pad in the condition of having only one single-ring groove on the rigid board layer, so as to achieve the effects of reducing manufacturing difficulty, lowering manufacturing cost, and improving market competitiveness.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: April 9, 2024
    Assignee: YUHONG ELECTRONIC (SHENZHEN) CO., LTD.
    Inventor: Wei-Jen Liang
  • Patent number: 11747923
    Abstract: A flexible wireless charging mouse pad includes an anti-slip cushion layer, a double-sided adhesive layer, and a coil. The anti-slip cushion layer has a topside with a single-ring groove, and the single-ring groove has an inner bottom groove wall. The double-sided adhesive layer is adhered to the topside. The coil has multiple surrounding rings arranged side by side with one another to form a coil module, and the coil module of the coil inside the single-ring groove is stacked and connected between the double-sided adhesive layer and the inner bottom groove wall and adhered by the double-sided adhesive layer, so as to achieve a wireless charging effect by the mouse pad in the condition of having only one single-ring groove on the flexible board layer, further to achieve the effects of reducing manufacturing difficulty, lowering manufacturing cost, and improving market competitiveness.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: September 5, 2023
    Assignee: YUHONG ELECTRONIC (SHENZHEN) CO., LTD.
    Inventor: Wei-Jen Liang
  • Patent number: 11699895
    Abstract: A wiring machine includes a chassis, a shifting mechanism, a carrying mechanism and a wire leading mechanism. The chassis has a guide rail. The shifting mechanism is disposed on the guide rail and movable along the guide rail. The carrying mechanism is disposed under the guide rail and includes a tray movable along a direction perpendicular to the guide rail. The wire leading mechanism is connected to the shifting mechanism and movable in a direction perpendicular to the shifting mechanism. The wire leading mechanism includes a body, a wire conveying assembly disposed in the body and a wire leading head connected to the body. A wire is conveyed by the wire conveying assembly to be output by the wire leading head. Therefore, the wire may be rapidly and stably laid into different types and shapes depending on different requirements.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: July 11, 2023
    Assignee: YUHONG ELECTRONIC (SHENZHEN) CO., LTD.
    Inventor: Wei-Jen Liang
  • Publication number: 20230004238
    Abstract: A flexible wireless charging mouse pad includes an anti-slip cushion layer, a double-sided adhesive layer, and a coil. The anti-slip cushion layer has a topside with a single-ring groove, and the single-ring groove has an inner bottom groove wall. The double-sided adhesive layer is adhered to the topside. The coil has multiple surrounding rings arranged side by side with one another to form a coil module, and the coil module of the coil inside the single-ring groove is stacked and connected between the double-sided adhesive layer and the inner bottom groove wall and adhered by the double-sided adhesive layer, so as to achieve a wireless charging effect by the mouse pad in the condition of having only one single-ring groove on the flexible board layer, further to achieve the effects of reducing manufacturing difficulty, lowering manufacturing cost, and improving market competitiveness.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 5, 2023
    Inventor: Wei-Jen LIANG
  • Publication number: 20230006428
    Abstract: A wiring machine includes a chassis, a shifting mechanism, a carrying mechanism and a wire leading mechanism. The chassis has a guide rail. The shifting mechanism is disposed on the guide rail and movable along the guide rail. The carrying mechanism is disposed under the guide rail and includes a tray movable along a direction perpendicular to the guide rail. The wire leading mechanism is connected to the shifting mechanism and movable in a direction perpendicular to the shifting mechanism. The wire leading mechanism includes a body, a wire conveying assembly disposed in the body and a wire leading head connected to the body. A wire is conveyed by the wire conveying assembly to be output by the wire leading head. Therefore, the wire may be rapidly and stably laid into different types and shapes depending on different requirements.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 5, 2023
    Inventor: Wei-Jen LIANG
  • Publication number: 20230006471
    Abstract: A rigid wireless charging mouse pad includes a rigid board layer, a double-sided adhesive plate and a coil. The underside of the rigid board layer has a single-ring groove with an inner top groove wall. The double-sided adhesive plate is adhered to the inner top groove wall. The coil has surrounding rings arranged side by side with one another to form a coil module which is stacked on the double-sided adhesive plate in the single-ring groove and adhered by the double-sided adhesive plate to achieve a wireless charging effect by the mouse pad in the condition of having only one single-ring groove on the rigid board layer, so as to achieve the effects of reducing manufacturing difficulty, lowering manufacturing cost, and improving market competitiveness.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 5, 2023
    Inventor: Wei-Jen LIANG