Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.

Abstract: An integrated circuit device includes a gate stack disposed over a substrate. A first L-shaped spacer is disposed along a first sidewall of the gate stack and a second L-shaped spacer is disposed along a second sidewall of the gate stack. The first L-shaped spacer and the second L-shaped spacer include silicon and carbon. A first source/drain epitaxy region and a second source/drain epitaxy region are disposed over the substrate. The gate stack is disposed between the first source/drain epitaxy region and the second source/drain epitaxy region. An interlevel dielectric (ILD) layer disposed over the substrate. The ILD layer is disposed between the first source/drain epitaxy region and a portion of the first L-shaped spacer disposed along the first sidewall of the gate stack and between the second source/drain epitaxy region and a portion of the second L-shaped spacer disposed along the second sidewall of the gate stack.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.

Abstract: An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The second electronic component is disposed adjacent to the first electronic component. The interconnection element is disposed between the first electronic component and the second electronic component. The insulation layer is disposed between the first electronic component and the second electronic component and has a side surface and a top surface connecting to the side surface. The encapsulant surrounds the interconnection element and at least partially covers the top surface of the insulation layer and has an extended portion in contact with the side surface of the insulation layer.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: An acoustic wave element includes: a substrate; a bonding structure on the substrate; a support layer on the bonding structure; a first electrode including a lower surface on the support layer; a cavity positioned between the support layer and the first electrode and exposing a lower surface of the first electrode; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer, wherein at least one of the first electrode and the second electrode includes a first layer and a second layer that the first layer has a first acoustic impedance and a first electrical impedance, the second layer has a second acoustic impedance and a second electrical impedance, wherein the first acoustic impedance is higher than the second acoustic impedance, and the second electrical impedance is lower than the first electrical impedance.

Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.

Abstract: A light emitting display unit includes a redistribution layer (RDL) and multiple light emitting elements. The RDL includes multiple electrode patterns, multiple pad patterns, an insulating layer and multiple conductive through holes. A first gap and a second gap are respectively formed between two adjacent electrode patterns and between corresponding two adjacent pad patterns. A third length of the overlapping area of an orthographic projection of the first gap on the pad patterns and the pad patterns in a first direction is less than or equal to a second length of the second gap in the first direction. The micro light emitting elements are disposed on the RDL and electrically connected with the electrode patterns.

Abstract: An electronic apparatus includes an electronic device and a base. The electronic device has an engaging portion with at least two engaging concaves. The base has an engaging mechanism which includes a main body, at least one second engaging bump and a linkage structure. The main body has a first engaging bump. The second engaging bump is movably disposed on the main body and is adapted to move between an engaging position and a releasing position. The electronic device combines with the base such that the first engaging bump and the second engaging bump are engaged with the two engaging concaves. The linkage structure on the main body is connected to the second engaging bump. The electronic device rotates relative to the base to push the linkage structure that drives the second engaging bump from the engaging position to the releasing position to disengage from the engaging portion.

Abstract: An electronic apparatus includes an electronic device and a base. The electronic device has an engaging portion with at least two engaging concaves. The base has an engaging mechanism which includes a main body, at least one second engaging bump and a linkage structure. The main body has a first engaging bump. The second engaging bump is movably disposed on the main body and is adapted to move between an engaging position and a releasing position. The electronic device combines with the base such that the first engaging bump and the second engaging bump are engaged with the two engaging concaves. The linkage structure on the main body is connected to the second engaging bump. The electronic device rotates relative to the base to push the linkage structure that drives the second engaging bump from the engaging position to the releasing position to disengage from the engaging portion.

Abstract: Disclosed is a rotary spraying device in which a fluid tube is assembled with a rotary means formed to have a channel structure. A portion of a fluid which flows through the fluid tube flows into the rotary means so as to provide a rotation applying force for rotating the rotary means when the fluid flows through the channel structure in the rotary means. Thus, the fluid is sprayed rotatably from the fluid tube which is rotated with the rotary means.

Abstract: A fluid spraying device comprises a fluid tube rotatably disposed therein and a conveying tube disposed in the fluid tube. The fluid tube has a conveying section, a bent section, and a decreasing section connected therebetween. The decreasing section has a cross section area smaller than that of the bent section. One end of the conveying tube extends through the fluid tube to the decreasing section, so as to cause Venturi effect to cause a contained fluid being sprayed out from the conveying tube when a fluid flows through the fluid tube.

Abstract: A raised floor includes a base plate, a raised plate, a support frame, and a transfer structure, in which the raised plate is parallelly disposed above the base plate; the support frame is disposed between the base plate and the raised plate; and the transfer structure that is configured with a first terminal and a second terminal is arranged by fixing the first terminal to the base plat and the second terminal to the raised plate.

Abstract: A fluid spraying device comprises a fluid tube rotatably disposed therein and a conveying tube disposed in the fluid tube. The fluid tube has a conveying section, a bend output section, and a decreasing section connected therebetween. The decreasing section has a cross section area smaller than that of the bend output section. One end of the conveying tube extends through the fluid tube to the decreasing section, so as to cause Venturi effect to cause a contained fluid being sprayed out from the conveying tube when a fluid flows through the fluid tube.

Abstract: Disclosed is a rotary spraying device in which a fluid tube is assembled with a rotary means formed to have a channel structure. A portion of a fluid which flows through the fluid tube flows into the rotary means so as to provide a rotation applying force for rotating the rotary means when the fluid flows through the channel structure in the rotary means. Thus, the fluid is sprayed rotatably from the fluid tube which is rotated with the rotary means.