Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.

Abstract: A cholesteric liquid crystal display device is disclosed. The cholesteric liquid crystal display device includes a substrate, a light absorbing layer, and a cholesteric liquid crystal layer. The cholesteric liquid crystal layer includes plural rows of left-handed cholesteric liquid crystals and plural rows of right-handed cholesteric liquid crystals which are arranged alternately. The left-handed cholesteric liquid crystals and the right-handed cholesteric liquid crystals respectively reflect left-handed light and right-handed light in the cholesteric liquid crystal display device of the present invention, whereby both eyes of an observer can see different images and thus a 3D effect is formed.

Abstract: A package structure including a first substrate, a second substrate and a light emitting diode is provided. The first substrate has at least a first annular engaged portion. The second substrate is disposed above the first substrate and has at least a second annular engaged portion. The light emitting diode is disposed on the first substrate. The second annular engaged portion is infixed to the first annular engaged portion so as to form an airtight space. The light emitting diode is located in the airtight space.