Patents by Inventor Wei-Jhen Chen

Wei-Jhen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20230361091
    Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
    Type: Application
    Filed: July 11, 2023
    Publication date: November 9, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
  • Electronic package and manufacturing method thereof
    Patent number: 11742296
    Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: August 29, 2023
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
  • ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20220148975
    Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
    Type: Application
    Filed: December 28, 2020
    Publication date: May 12, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wei-Jhen Chen, Chih-Hsun Hsu, Yuan-Hung Hsu, Chih-Nan Lin, Chang-Fu Lin, Don-Son Jiang, Chih-Ming Huang, Yi-Hsin Chen
  • Electronic package
    Patent number: 11069661
    Abstract: An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: July 20, 2021
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wei-Jhen Chen, Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu