Patents by Inventor Wei-Jhih Mao
Wei-Jhih Mao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11923331Abstract: In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a first die disposed over the substrate, a metal wire attached to a frontside of the first die, and a first plurality of die stopper bumps disposed along a backside of the first die and configured to control an angle of operation of the first die. The first plurality of die stopper bumps directly contacts a backside surface of the first die.Type: GrantFiled: February 25, 2021Date of Patent: March 5, 2024Inventors: Wei-Jhih Mao, Kuei-Sung Chang, Shang-Ying Tsai
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Publication number: 20240021567Abstract: In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a first die disposed over the substrate, a metal wire attached to a frontside of the first die, and a first plurality of die stopper bumps disposed along a backside of the first die and configured to control an angle of operation of the first die. The first plurality of die stopper bumps directly contacts a backside surface of the first die.Type: ApplicationFiled: August 7, 2023Publication date: January 18, 2024Inventors: Wei-Jhih Mao, Kuei-Sung Chang, Shang-Ying Tsai
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Publication number: 20230382720Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.Type: ApplicationFiled: August 9, 2023Publication date: November 30, 2023Inventors: Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng
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Publication number: 20230257256Abstract: Various embodiments of the present disclosure are directed towards an integrated chip (IC) including a substrate. A plurality of adhesive structures is disposed on the substrate. A microelectromechanical systems (MEMS) structure is disposed on the adhesive structures. The MEMS structure comprises a movable element disposed within a cavity. A first plurality of stopper bumps is disposed between the movable element and the substrate.Type: ApplicationFiled: March 9, 2022Publication date: August 17, 2023Inventors: Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng
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Patent number: 11661333Abstract: A semiconductor structure includes a substrate; a sensing device disposed over the substrate and including a plurality of protruding members protruded from the sensing device; a sensing structure disposed adjacent to the sensing device and including a plurality of sensing electrodes protruded from the sensing structure towards the sensing device; and an actuating structure disposed adjacent to the sensing device and configured to provide an electrostatic force on the sensing device based on a feedback from the sensing structure. Further, a method of manufacturing the semiconductor structure is also disclosed.Type: GrantFiled: October 14, 2020Date of Patent: May 30, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng
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Publication number: 20220306454Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) structure including a composite spring. A first substrate underlies a second substrate. A third substrate overlies the second substrate. The first, second, and third substrates at least partially define a cavity. The second substrate comprises a moveable mass in the cavity and between the first and third substrates. The composite spring extends from a peripheral region of the second substrate to the moveable mass. The composite spring is configured to suspend the moveable mass in the cavity. The composite spring includes a first spring layer comprising a first crystal orientation, and a second spring layer comprising a second crystal orientation different than the first crystal orientation.Type: ApplicationFiled: June 15, 2022Publication date: September 29, 2022Inventors: Kuei-Sung Chang, Shang-Ying Tsai, Wei-Jhih Mao
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Publication number: 20220270999Abstract: In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a first die disposed over the substrate, a metal wire attached to a frontside of the first die, and a first plurality of die stopper bumps disposed along a backside of the first die and configured to control an angle of operation of the first die. The first plurality of die stopper bumps directly contacts a backside surface of the first die.Type: ApplicationFiled: February 25, 2021Publication date: August 25, 2022Inventors: Wei-Jhih Mao, Kuei-Sung Chang, Shang-Ying Tsai
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Patent number: 11420866Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) structure including a composite spring. A first substrate underlies a second substrate. A third substrate overlies the second substrate. The first, second, and third substrates at least partially define a cavity. The second substrate comprises a moveable mass in the cavity and between the first and third substrates. The composite spring extends from a peripheral region of the second substrate to the moveable mass. The composite spring is configured to suspend the moveable mass in the cavity. The composite spring includes a first spring layer comprising a first crystal orientation, and a second spring layer comprising a second crystal orientation different than the first crystal orientation.Type: GrantFiled: March 23, 2020Date of Patent: August 23, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuei-Sung Chang, Shang-Ying Tsai, Wei-Jhih Mao
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Publication number: 20220162058Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.Type: ApplicationFiled: March 8, 2021Publication date: May 26, 2022Inventors: Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng
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Publication number: 20220112074Abstract: A semiconductor structure includes a substrate, a sensing device disposed over the substrate and including a plurality of protruding members protruded from the sensing device; a sensing structure disposed adjacent to the sensing device and including a plurality of sensing electrodes protruded from the sensing structure towards the sensing device; and an actuating structure disposed adjacent to the sensing device and configured to provide an electrostatic force on the sensing device based on a feedback from the sensing structure. Further, a method of manufacturing the semiconductor structure is also disclosed.Type: ApplicationFiled: October 14, 2020Publication date: April 14, 2022Inventors: WEI-JHIH MAO, SHANG-YING TSAI, KUEI-SUNG CHANG, CHUN-WEN CHENG
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Patent number: 11235969Abstract: The integrated CMOS-MEMS device includes a CMOS structure, a cap structure, and a MEMS structure. The CMOS structure, fabricated on a first substrate, includes at least one conducting layer. The cap structure, including vias passing through the cap structure, has an isolation layer deposited on its first side and has a conductive routing layer deposited on its second side. The MEMS structure is deposited between the first substrate and the cap structure. The integrated CMOS-MEMS device also includes a conductive connector that passes through one of the vias and through an opening in the isolation layer on the cap structure. The conductive connector conductively connects a conductive path in the conductive routing layer on the cap structure with the at least one conducting layer of the CMOS structure.Type: GrantFiled: May 23, 2019Date of Patent: February 1, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Wen Cheng, Chia-Hua Chu, Wen Cheng Kuo, Wei-Jhih Mao
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Publication number: 20210292157Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) structure including a composite spring. A first substrate underlies a second substrate. A third substrate overlies the second substrate. The first, second, and third substrates at least partially define a cavity. The second substrate comprises a moveable mass in the cavity and between the first and third substrates. The composite spring extends from a peripheral region of the second substrate to the moveable mass. The composite spring is configured to suspend the moveable mass in the cavity. The composite spring includes a first spring layer comprising a first crystal orientation, and a second spring layer comprising a second crystal orientation different than the first crystal orientation.Type: ApplicationFiled: March 23, 2020Publication date: September 23, 2021Inventors: Kuei-Sung Chang, Shang-Ying Tsai, Wei-Jhih Mao
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Publication number: 20200131028Abstract: The integrated CMOS-MEMS device includes a CMOS structure, a cap structure, and a MEMS structure. The CMOS structure, fabricated on a first substrate, includes at least one conducting layer. The cap structure, including vias passing through the cap structure, has an isolation layer deposited on its first side and has a conductive routing layer deposited on its second side. The MEMS structure is deposited between the first substrate and the cap structure. The integrated CMOS-MEMS device also includes a conductive connector that passes through one of the vias and through an opening in the isolation layer on the cap structure. The conductive connector conductively connects a conductive path in the conductive routing layer on the cap structure with the at least one conducting layer of the CMOS structure.Type: ApplicationFiled: May 23, 2019Publication date: April 30, 2020Inventors: Chun-Wen Cheng, Chia-Hua Chu, Wen Cheng Kuo, Wei-Jhih Mao