Abstract: A heat pipe (20) includes a pipe (21), a wick (22) formed on an inner wall (23) of the pipe, and a working fluid (not shown) sealed in the pipe and soaked in the wick. The wick is formed by sintering nano-size metal powder disposed inside the pipe. First through holes (25) are defined in the wick in an evaporator section (20a) of the heat pipe. A central one of the first through holes is aligned along an axis 20c of the heat pipe, and other first through holes are parallel to the axis 20c. A second through hole (26) is defined in the wick in a condenser section (20b) of the heat pipe. The second through hole communicates with the first through holes, whereby the working fluid flows through the first and second through holes. These characteristics give the wick low thermal resistance, a high evaporator surface area, and high capillary force.

Abstract: A method for forming silicon dioxide layer on a silicon substrate by anodic oxidation includes: providing a silicon substrate which has a polished face; providing an anodic oxidation apparatus which is filled with an electrolyte; providing a platinum piece and placing the platinum piece in the electrolyte as a cathode; placing the silicon substrate in the electrolyte as an anode with the polished surface of the silicon substrate facing to the cathode; applying a direct current to the cathode and the anode and irradiating the electrolyte with ultraviolet light for a predetermined period of time; taking out the silicon substrate and getting a finished silicon dioxide layer formed on the silicon substrate after cleaning, drying and cooling. The method can increase the reaction rate, and the silicon dioxide layer so formed has a uniform thickness and high purity.

Abstract: A heat pipe (20) includes a pipe (21), a wick (22) formed on an inner wall (23) of the pipe, and a working fluid (not shown) sealed in the pipe and soaked in the wick. The wick is formed by sintering nano-size metal powder disposed inside the pipe. First through holes (25) are defined in the wick in an evaporator section (20a) of the heat pipe. A central one of the first through holes is aligned along an axis 20c of the heat pipe, and other first through holes are parallel to the axis 20c. A second through hole (26) is defined in the wick in a condenser section (20b) of the heat pipe. The second through hole communicates with the first through holes, whereby the working fluid flows through the first and second through holes. These characteristics give the wick low thermal resistance, a high evaporator surface area, and high capillary force.