Patents by Inventor Wei Jie
Wei Jie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240143455Abstract: A virtual machine backup method, performed by a first host, includes: capturing a request to write data from a virtual machine to a hard disk image file, wherein the request includes written data and input and output location information, copying the written data to a temporary storage area, calculating a first key of the written data, storing the first key, the input and output location information into a first resource location structure, pausing an operation of the virtual machine and generating a second resource location structure according to the first resource location structure, the first key and a second key, and outputting a backup data set to a second host according to the second resource location structure, wherein the backup data set includes the second resource location structure and only one of existing data and the written data when the first key and the second key are the same.Type: ApplicationFiled: May 15, 2023Publication date: May 2, 2024Applicant: INSTITUTE FOR INFORMATION INDUSTRYInventors: Lee Chung CHEN, Li Hao CHIANG, Gin CHI, Wei Jie HSU, Jiann Wen WANG, Wen Dwo HWANG
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Patent number: 11968293Abstract: Context information of a handshake between a source entity and a target entity is obtained at a security proxy. The context information is transmitted from the security proxy to a key manager. The key manager maintains a first private key of the security proxy. A first handshake message is received from the key manager. The first handshake message is generated at least based on the context information and signed with the first private key. The first handshake message is then transmitted to the target entity.Type: GrantFiled: November 18, 2020Date of Patent: April 23, 2024Assignee: International Business Machines CorporationInventors: Wei-Hsiang Hsiung, Chun-Shuo Lin, Wei-Jie Liau, Cheng-Ta Lee
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Publication number: 20240109544Abstract: A method and device for collision predicting and readable computer storage medium. The method for collision predicting includes: obtaining a host vehicle motion track of a host vehicle; obtaining at least one host vehicle track point on the host vehicle motion track; establishing a collision prediction area around the host vehicle track point, and matching the collision prediction area to a time point where the host vehicle is located at the host vehicle track point; obtaining a target vehicle motion track of a target vehicle; obtaining at least one target vehicle track point on the target vehicle motion track, and matching the target vehicle track point to a time point where the target vehicle is located at the target vehicle track point; and calculating a projected collision time between the host vehicle and the target vehicle when a preset condition is met.Type: ApplicationFiled: December 14, 2022Publication date: April 4, 2024Inventors: CHIEN-HUNG YU, WEI-JIE CHEN
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Patent number: 11947694Abstract: A method, a computer program product, and a system for implementing a dynamic virtual database honeypot. The method includes relaying a query request received from a database client to a database and receiving, from the database, a response relating to the query request. The method also includes determining the query request is an attack on the database based on session information relating to the database and the database client, generating a honey token based on information contained within the response, generating an alternate response formatted in a same format as the response and containing artificial information that masks the information contained within the response. The method further includes inserting the honey token into the alternate response and transmitting the alternate response to the database client.Type: GrantFiled: June 29, 2021Date of Patent: April 2, 2024Assignee: International Business Machines CorporationInventors: Galia Diamant, Richard Ory Jerrell, Chun-Shuo Lin, Wei-Hsiang Hsiung, Cheng-Ta Lee, Wei-Jie Liau
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Patent number: 11923454Abstract: An epitaxial structure includes a substrate, a lower super-lattice laminate, a middle super-lattice laminate, an upper super-lattice laminate and a channel layer. The lower super-lattice laminate includes a plurality of first lower film layers and a plurality of second lower film layers stacked alternately. The first lower film layer includes aluminum nitride. The second lower film layer includes aluminum gallium nitride. The middle super-lattice laminate includes a plurality of first middle film layers and a plurality of second middle film layers stacked alternately. The first middle film layer includes aluminum nitride. The second middle film layer includes gallium nitride doped with a doping material. The upper super-lattice laminate includes a plurality of first upper film layers and a plurality of second upper film layers stacked alternately. The first upper film layer includes gallium nitride doped with the doping material. The second upper film layer includes gallium nitride.Type: GrantFiled: April 23, 2021Date of Patent: March 5, 2024Assignee: GLOBALWAFERS CO., LTD.Inventors: Wei-Jie Sie, Jia-Zhe Liu, Ying-Ru Shih
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Patent number: 11922844Abstract: An integrated driving device is provided. The integrated driving device includes a touch sensing circuit and an optical sensing circuit. The touch sensing circuit is configured to perform touch sensing in a plurality of touch sensing periods during a first frame period. The optical sensing circuit is configured to perform optical sensing during at least one optical sensing period during the first frame period to obtain optical sensing signals for generating first ambient light information. The touch sensing periods and the optical sensing period are non-overlapping. Correspondingly, an operation method of an integrated driving device is also provided.Type: GrantFiled: April 27, 2021Date of Patent: March 5, 2024Assignee: Novatek Microelectronics Corp.Inventors: Wei-Lun Shih, Wu-Wei Lin, Jiun-Jie Tsai, Huang-Chin Tang, Ching-Chun Lin
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Publication number: 20240066494Abstract: The present invention provides a microplasma device and system thereof. The microplasma device comprises a reaction tank carrying with a reaction solution. A nanomaterial and its precursors are contained in the reaction solution. A first electrode is at least partially immersed in the reaction solution. A second electrode comprises a microplasma array component to eject microplasma array to the surface of the reaction solution. A power source is electrically connected between the first electrode and the second electrode. The present invention provides a novel microplasma array device to produce nanomaterial with increased yield rate. The microplasma array device can be multiplied by adding the outlet of the microplasma as desired to produce nanomaterial including but not limited to nano-metal particles, carbon quantum dots, silicon quantum dots and plasma-activated water with higher yield rate.Type: ApplicationFiled: November 28, 2022Publication date: February 29, 2024Inventors: Ren-Jie Weng, Wei-Hung Chiang
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Audio acquisition device positioning method and apparatus, and speaker recognition method and system
Patent number: 11915447Abstract: An audio acquisition device positioning method is provided. In the method, a first image that includes an audio acquisition device is obtained. The audio acquisition device in the first image is identified. First coordinate data of the identified audio acquisition device in the first image is obtained. First displacement data is determined according to the first coordinate data and historical coordinate data of the audio acquisition device. First coordinates of the audio acquisition device are determined according to the first displacement data.Type: GrantFiled: July 15, 2021Date of Patent: February 27, 2024Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventors: Zequn Jie, Zheng Ge, Wei Liu -
Publication number: 20240063048Abstract: A workpiece chuck includes a supporting platform, a vacuum system, and a gas permeable buffer layer. The supporting platform has a supporting surface for holding a workpiece thereon. The vacuum system is disposed under and in gas communication with the supporting platform. The gas permeable buffer layer is disposed over the supporting platform and covers the supporting surface, wherein a hardness scale of the gas permeable buffer layer is smaller than a hardness scale of the supporting platform.Type: ApplicationFiled: August 16, 2022Publication date: February 22, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Ching Lo, Ching-Pin Yuan, Wei-Jie Huang, Cheng-Yu Kuo, Yi-Yang Lei, Ching-Hua Hsieh
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Publication number: 20240044072Abstract: The present disclosure is relates to an environmental-friendly artificial leather and a method of manufacturing the same. The manufacturing method of the environmental-friendly artificial leather includes steps in which a first fiber web is formed by meltblown. The method continues with step in which a filament fabric is disposed on the first fiber web. The method continues with step in which a second fiber web is meltblown on the filament fabric, so as to form a multilayer fiber structure. The method continues with step in which the multilayer fiber structure is heat pressed to form the environmental-friendly artificial leather.Type: ApplicationFiled: October 20, 2023Publication date: February 8, 2024Inventors: CHIH-YI LIN, KUO-KUANG CHENG, YUNG-YU FU, WEI-JIE LIAO, KAO-LUNG YANG
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Patent number: 11882658Abstract: A printed circuit board system includes a plurality of printed circuit board (PCB) assemblies that includes at least three PCB assemblies and a connecting module. The connecting module is coupled to each of the PCB assemblies. The connecting module is adapted to provide electrical and signal communications between each of the PCB assemblies. The connecting module is on different planes with respect to at least one of the PCB assemblies.Type: GrantFiled: January 10, 2022Date of Patent: January 23, 2024Assignee: QUANTA COMPUTER INC.Inventors: Yaw-Tzorng Tsorng, Tung-Hsien Wu, Wei-Jie Chen
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Publication number: 20240017538Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.Type: ApplicationFiled: August 2, 2023Publication date: January 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Jie Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo, Yi-Yang Lei, Ching-Hua Hsieh
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Patent number: 11871667Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume, a carrier disposed in the first processing volume, comprising a first thermoelectric module (TEM), and configured to support the substrate while the substrate is being heated or cooled, a chuck disposed within the second processing volume, comprising a second TEM, and configured to receive the substrate from the carrier and to support the substrate while the substrate is being heated or cooled, and a system controller configured to monitor a temperature of at least one of the substrate, the carrier, or the chuck during operation, and based on the temperature of the at least one of the substrate, the carrier, or the chuck, supply current to at least one of the first TEM or the second TEM.Type: GrantFiled: September 17, 2020Date of Patent: January 9, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Sriskantharajah Thirunavukarasu, Puay Han Tan, Karrthik Parathithasan, Jun-Liang Su, Fang Jie Lim, Chin Wei Tan, Wei Jie Dickson Teo
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Publication number: 20240006473Abstract: A semiconductor device includes a substrate, a lower supporting layer, an upper supporting layer, and a lower electrode. The lower supporting layer is disposed on the substrate. The upper supporting layer is disposed on the lower supporting layer. The upper supporting layer defines an opening. The lower electrode is disposed within the opening of the upper supporting layer. The lower electrode has a first portion with a first vertical length and a second portion with a second vertical length different from the first vertical length.Type: ApplicationFiled: July 1, 2022Publication date: January 4, 2024Inventor: WEI-JIE LIN
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Publication number: 20240006474Abstract: The present disclosure provides a method of manufacturing a semiconductor device. The method includes providing a substrate; forming a lower supporting layer on the substrate; forming an upper supporting layer on the lower supporting layer, wherein the upper supporting layer defines an opening; and forming a lower electrode within the opening of the upper supporting layer, wherein the lower electrode has a first portion with a first vertical length and a second portion with a second vertical length different from the first vertical length.Type: ApplicationFiled: July 1, 2022Publication date: January 4, 2024Inventor: Wei-Jie LIN
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Publication number: 20230394581Abstract: An analysis method of a financial securities product value model based on artificial intelligence includes performing a determining step, a data acquiring step, an analyzing step and a strategy generating step. The determining step is performed to determine that the customer is one of a long-term investing customer and a short-term investing customer. The data acquiring step is performed to acquire one of a plurality of long-term trading parameters and a short-term trading data. The analyzing step includes dividing the financial securities products into a plurality of groups, and calculate a plurality of classify conditions and analyzing a product relevance and a purchasing sequence of the financial securities products. The strategy generating step is performed to generate a purchasing strategy according to the groups, the classify conditions, the importance value of each of the long-term trading parameters, the product relevance and the purchasing sequence.Type: ApplicationFiled: November 23, 2022Publication date: December 7, 2023Inventors: Chi-Tung CHEN, Wei-Jie HAN
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Patent number: 11829546Abstract: The disclosure provides a border touch module, including a cover plate, a shielding layer, a first adhesive layer, a sensing electrode layer, a second adhesive layer, an opaque adhesive, and a backlight layer. The shielding layer is disposed below the cover plate. The first adhesive layer is disposed below the shielding layer. The sensing electrode layer is disposed below the first adhesive layer. The second adhesive layer is disposed below the sensing electrode layer. The opaque adhesive is disposed below the sensing electrode layer. The backlight layer is disposed below the opaque adhesive and is in the same plane as the second adhesive layer. The shielding layer has a backlight pattern, and the opaque adhesive has a light source hole. When the backlight layer is in the state of driving backlight, the light illuminates the backlight pattern of the shielding layer through the light source hole.Type: GrantFiled: January 13, 2023Date of Patent: November 28, 2023Assignee: TPK Touch Solutions (Xiamen) Inc.Inventors: Ching-Kai Cho, Zhi Juan Lin, Ting-Chieh Chien, Wei Jie Lin, Hua Li Luo
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Publication number: 20230307404Abstract: A package structure includes a die, a first redistribution circuit structure, a first redistribution circuit structure, a second redistribution circuit structure, an enhancement layer, first conductive terminals, and second conductive terminals. The first redistribution circuit structure is disposed on a rear side of the die and electrically coupled to thereto. The second redistribution circuit structure is disposed on an active side of the die and electrically coupled thereto. The enhancement layer is disposed on the first redistribution circuit structure. The first redistribution circuit structure is disposed between the enhancement layer and the die. The first conductive terminals are connected to the first redistribution circuit structure. The first redistribution circuit structure is between the first conductive terminals and the die. The second conductive terminals are connected to the second redistribution circuit structure.Type: ApplicationFiled: March 28, 2022Publication date: September 28, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Yu Kuo, Yu-Ching Lo, Wei-Jie Huang, Ching-Pin Yuan, Yi-Che Chiang, Kris Lipu Chuang, Hsin-Yu Pan, Yi-Yang Lei, Ching-Hua Hsieh, Kuei-Wei Huang
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Patent number: 11755814Abstract: A method for determining a training pattern in a layout patterning process. The method includes generating a plurality of features from patterns in a pattern set; grouping the patterns in the pattern set into individual groups based on similarities in the plurality of generated features; and selecting representative patterns from the individual groups to determine the training pattern. In some embodiments, the method is a method for training a machine learning model in a layout patterning process. The method may include, for example, providing representative patterns from the individual groups to the machine learning model to train the machine learning model to predict a continuous transmission mask (CTM) map for optical proximity correction (OPC) in the layout patterning process.Type: GrantFiled: January 10, 2020Date of Patent: September 12, 2023Assignee: ASML NETHERLANDS B.V.Inventor: Wei-jie Chen
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Publication number: 20230257444Abstract: The present invention relates to a soluble dimeric fusion protein comprising a first and second polypeptides, wherein the first and second polypeptides each comprises a Dectin-1 receptor polypeptide fused to a human Fc domain via a dimerization linker. Methods of using the soluble dimeric fusion protein for immunizing a subject against a fungal infection, preventing or treating a fungal infection in a subject and detecting a fungal infection in a subject are also provided. In one embodiment, a chimeric molecule comprising the fusion protein and a payload is provided. In one embodiment, the payload is Amphotericin B.Type: ApplicationFiled: July 15, 2021Publication date: August 17, 2023Inventors: Linus Wei Jie Lim, Yue Wang, Say Kong Ng, Kong Peng Lam