Abstract: Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary method of forming a semiconductor device comprises receiving a structure including a substrate and a first hard mask over the substrate, the first hard mask having at least two separate portions; forming spacers along sidewalls of the at least two portions of the first hard mask with a space between the spacers; forming a second hard mask in the space; forming a first cut in the at least two portions of the first hard mask; forming a second cut in the second hard mask; and depositing a cut hard mask in the first cut and the second cut.

Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

Abstract: Various solutions for low-power wake-up signal (LP-WUS) design with respect to user equipment and network node in mobile communications are described. An apparatus may receive a LP-WUS configuration from a network node. The apparatus may receive a LP-WUS based on the LP-WUS configuration from the network node. The apparatus may determine whether to wake up according to the LP-WUS. The LP-WUS with N subcarriers (SCs) is generated through a transformation of M-bit on-off keying (OOK) in a time domain. The transformation is a discrete Fourier transform (DFT) or least square operation. K samples are generated from the M bits with a signal modification or a signal truncation. The LP-WUS is generated through an inverse fast Fourier transform (IFFT) operation. The K is a size of the IFFT operation of cyclic-prefix orthogonal frequency-division multiple access (CP-OFDMA). The N is less than or equal to the K.

Abstract: A semiconductor structure includes a conductive feature disposed over a semiconductor substrate, a via disposed in a first interlayer dielectric (ILD) layer over the conductive feature, and a metal-containing etch-stop layer (ESL) disposed on the via, where the metal-containing ESL includes a first metal and is resistant to etching by a fluorine-containing etchant. The semiconductor structure further includes a conductive line disposed over the metal-containing ESL, where the conductive line includes a second metal different from the first metal and is etchable by the fluorine-containing etchant, and where the via is configured to interconnect the conductive line to the conductive feature. Furthermore, the semiconductor structure includes a second ILD layer disposed over the first ILD layer.

Abstract: An optical structure is provided. The optical structure includes a first substrate, a second substrate, a sealant, a light-modulating layer and a first conductive layer. The second substrate is disposed opposite to the first substrate. The sealant is disposed between the first substrate and the second substrate. The sealant is disposed around to form a visible area. The light-modulating layer is disposed in the visible region between the first substrate and the second substrate. The first conductive layer has a plurality of strip structures. The plurality of strip structures are disposed in the visible area to form an effective area. The visible area partially overlaps the effective area.

Abstract: An electronic device is provided. The electronic device includes a substrate, an optical sensing element, a light-shielding structure, and a microlens. The substrate has a normal direction. The optical sensing element is disposed on the substrate. The light-shielding structure is disposed on the optical sensing element and includes a plurality of light-shielding layers. Each light-shielding layer includes an opening, and centers of the openings are arranged along a first direction and separated from each other. The microlens is disposed on the light-shielding layers and overlaps the opening of the uppermost light-shielding layer. The microlens guides light into an optical channel formed by the openings, so that the optical sensing element has a maximum response value for light with an incident angle that is greater than or equal to 10 degrees and less than or equal to 30 degrees relative to the normal direction.

Abstract: An optical sensing module and an electronic device are provided. The optical sensing module includes a substrate, a plurality of optical sensing elements, and a light-blocking element. The substrate has a sensing region and a non-sensing region around the sensing region. The plurality of optical sensing elements is disposed on the sensing region. The light-blocking element is disposed on the non-sensing region and a portion of the sensing region. The light-blocking element overlaps a portion of the plurality of optical sensing elements in a normal direction of the substrate.

Abstract: An electronic device is provided. The electronic device includes a sensing device. The sensing device includes an anti-reflection unit, a circuit layer and a light-sensing element. The circuit layer includes a thin-film transistor and is disposed on the anti-reflection unit. The light-sensing element is disposed on the circuit layer and is electrically connected to the thin-film transistor.

Abstract: An electronic device includes a photodiode, a switching circuit, a readout circuit, and an energy storage device. The photodiode includes a first terminal and a second terminal and is configured to generate a signal according to a light. The switching circuit is electrically connected to the first terminal and the second terminal. When the electronic device operates in a sensing mode, the switching circuit electrically isolates the photodiode from the energy storage device so that the signal is provided to the readout circuit. When the electronic device operates in a charging mode, the switching circuit electrically connects the photodiode to the energy storage device so that the signal is provided to the energy storage device.

Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

Abstract: An electronic device is provided. The electronic device includes an optical sensing module that includes an optical sensor array. The optical sensor array includes at least one optical sensor, at least one transparent layer disposed on the optical sensor array, and a microlens array. The microlens array includes at least one microlens and is disposed on the transparent layer.

Abstract: A method for manufacturing a test paper is disclosed in the present invention, and at least comprises the following steps. First, a chemical precursor comprising at least a reducing agent is coated onto a substrate. The substrate is then dipped into a metal salt solution comprising a plurality of metal ions for a predetermined time to reduce the metal ions to form metal particles on the substrate. Finally, the substrate is taken out and dried to complete a manufacture of at least a test paper. In the meantime a method for using the test paper, and a chemical composition used in the abovementioned for manufacturing the test paper are also disclosed in the present invention.

Abstract: One embodiment provides a method for enzymatic treatment, including the steps of forming a closed space on a local tissue area with a device and infusing an enzyme solution into the closed space for enzymatic treatment. The method according to the embodiment is capable of treating the local tissue area with enzymes for enhancing cell proliferation in the treated tissue area and preventing damage of the adjacent normal tissues. A device and kit used for the method are also provided.

Abstract: The disclosure provides a method for crosslinking a colloid, including: (a) providing a colloid solution; (b) adding a crosslinking agent and solid particles to the colloid solution, wherein the amount of solid particles added is enough to convert the colloid solution into a solid mixture, and wherein a crosslinking reaction proceeds in the solid mixture; and (c) removing the solid particles from the solid mixture.

Abstract: A method for manufacturing a test paper is disclosed in the present invention, and at least comprises the following steps. First, a chemical precursor comprising at least a reducing agent is coated onto a substrate. The substrate is then dipped into a metal salt solution comprising a plurality of metal ions for a predetermined time to reduce the metal ions to form metal particles on the substrate. Finally, the substrate is taken out and dried to complete a manufacture of at least a test paper. In the meantime a method for using the test paper, and a chemical composition used in the abovementioned for manufacturing the test paper are also disclosed in the present invention.

Abstract: One embodiment provides a method for enzymatic treatment, including the steps of forming a closed space on a local tissue area with a device and infusing an enzyme solution into the closed space for enzymatic treatment. The method according to the embodiment is capable of treating the local tissue area with enzymes for enhancing cell proliferation in the treated tissue area and preventing damage of the adjacent normal tissues. A device and kit used for the method are also provided.

Abstract: One embodiment provides a method for enzymatic treatment, including the steps of forming a closed space on a local tissue area with a device and infusing an enzyme solution into the closed space for enzymatic treatment. The method according to the embodiment is capable of treating the local tissue area with enzymes for enhancing cell proliferation in the treated tissue area and preventing damage of the adjacent normal tissues. A device and kit used for the method are also provided.

Abstract: One embodiment provides a method for enzymatic treatment, including the steps of forming a closed space on a local tissue area with a device and infusing an enzyme solution into the closed space for enzymatic treatment. The method according to the embodiment is capable of treating the local tissue area with enzymes for enhancing cell proliferation in the treated tissue area and preventing damage of the adjacent normal tissues. A device and kit used for the method are also provided.

Abstract: The disclosure provides a method for crosslinking a colloid, including: (a) providing a colloid solution; (b) adding a crosslinking agent and solid particles to the colloid solution, wherein the amount of solid particles added is enough to convert the colloid solution into a solid mixture, and wherein a crosslinking reaction proceeds in the solid mixture; and (c) removing the solid particles from the solid mixture.