Patents by Inventor Wei Jun Wan

Wei Jun Wan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11922058
    Abstract: Embodiments of a three-dimensional (3D) memory device and a method of operating the 3D memory device are provided. The 3D memory device includes an array of 3D NAND memory cells, an array of static random-access memory (SRAM) cells, and a peripheral circuit. The array of SRAM cells and the peripheral circuit arranged at one side are bonded with the array of 3D NAND memory cells at another side to form a chip. Data is received from a host through the peripheral circuit, buffered in the array of SRAM cells, and transmitted from the array of SRAM cells to the array of 3D NAND memory cells. The data is programmed into the array of 3D NAND memory cells.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: March 5, 2024
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Yue Ping Li, Wei Jun Wan, Chun Yuan Hou
  • Publication number: 20220091781
    Abstract: Embodiments of a three-dimensional (3D) memory device and a method of operating the 3D memory device are provided. The 3D memory device includes an array of 3D NAND memory cells, an array of static random-access memory (SRAM) cells, and a peripheral circuit. The array of SRAM cells and the peripheral circuit arranged at one side are bonded with the array of 3D NAND memory cells at another side to form a chip. Data is received from a host through the peripheral circuit, buffered in the array of SRAM cells, and transmitted from the array of SRAM cells to the array of 3D NAND memory cells. The data is programmed into the array of 3D NAND memory cells.
    Type: Application
    Filed: December 1, 2021
    Publication date: March 24, 2022
    Inventors: Yue Ping Li, Wei Jun Wan, Chun Yuan Hou
  • Patent number: 11221793
    Abstract: Embodiments of three-dimensional (3D) memory devices with a 3D NAND memory array having a plurality of pages and an on-die data buffer coupled to the memory array on a same chip and configured to buffer a plurality of batches of program data between a host and the memory array. The on-die data buffer may include SRAM cells. The 3D memory device also includes a controller coupled to the on-die data buffer on the same chip. The controller may be configured to receive control instructions for performing a first pass program and a second pass program on memory cells in a page. The controller may also be configured to buffer, in the on-die data buffer, first program data for a first pass program and second program data for a second pass program from a host and retrieve the first program data from the on-die data buffer.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: January 11, 2022
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Yue Ping Li, Wei Jun Wan, Chun Yuan Hou
  • Patent number: 10937514
    Abstract: A method of programming a NAND flash memory device includes: a programming voltage generation circuit applying an initial programming voltage pulse to a predetermined page of NAND flash memory; a controller verifying a plurality of verification levels of the predetermined page, the plurality of verification levels being less than a first-state verification voltage of verifying a lowest program state of the predetermined page; the controller determining a magnitude of a subsequent programming voltage pulse upon one of the plurality of verification levels of the predetermined page passing a verification; and the programming voltage generation circuit applying the subsequent programming voltage pulse to the predetermined page.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: March 2, 2021
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventor: Wei Jun Wan
  • Publication number: 20200372963
    Abstract: A method of programming a NAND flash memory device includes: a programming voltage generation circuit applying an initial programming voltage pulse to a predetermined page of NAND flash memory; a controller verifying a plurality of verification levels of the predetermined page, the plurality of verification levels being less than a first-state verification voltage of verifying a lowest program state of the predetermined page; the controller determining a magnitude of a subsequent programming voltage pulse upon one of the plurality of verification levels of the predetermined page passing a verification; and the programming voltage generation circuit applying the subsequent programming voltage pulse to the predetermined page.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 26, 2020
    Inventor: Wei Jun Wan
  • Publication number: 20200363983
    Abstract: Embodiments of three-dimensional (3D) memory devices with a 3D NAND memory array having a plurality of pages and an on-die data buffer coupled to the memory array on a same chip and configured to buffer a plurality of batches of program data between a host and the memory array. The on-die data buffer may include SRAM cells. The 3D memory device also includes a controller coupled to the on-die data buffer on the same chip. The controller may be configured to receive control instructions for performing a first pass program and a second pass program on memory cells in a page. The controller may also be configured to buffer, in the on-die data buffer, first program data for a first pass program and second program data for a second pass program from a host and retrieve the first program data from the on-die data buffer.
    Type: Application
    Filed: August 16, 2019
    Publication date: November 19, 2020
    Inventors: Yue Ping Li, Wei Jun Wan, Chun Yuan Hou