Patents by Inventor Wei-Jung Cheng

Wei-Jung Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure and method of forming the same
    Patent number: 12237320
    Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.
    Type: Grant
    Filed: November 21, 2023
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii
  • CHIP PACKAGE AND METHOD FOR FORMING THE SAME
    Publication number: 20250054849
    Abstract: A chip package is provided. The chip package includes a device substrate, a first redistribution layer (RDL), a carrier base, and at least one conductive connection structure. The device substrate has at least one first through-via opening extending from the backside surface of the device substrate to the active surface of the device substrate. The first RDL is disposed on the backside surface of the device substrate and extends in the first through-via opening. The carrier base carries the device substrate, and has a first surface facing the backside surface of the device substrate and a second surface opposite the first surface. The conductive connection structure is disposed on the second surface of the carrier base and is electrically connected to the first RDL.
    Type: Application
    Filed: July 22, 2024
    Publication date: February 13, 2025
    Inventors: Wei-Luen SUEN, Po-Jung CHEN, Chia-Ming CHENG, Po-Shen LIN, Jiun-Yen LAI, Tsang-Yu LIU, Shu-Ming CHANG
  • Backlight module with heat dispersing member and liquid crystal display device using same
    Patent number: 8054406
    Abstract: An exemplary backlight module (200) used for liquid crystal display device (20) includes a first frame (261), a light source (240), a heat dispersing member (280) disposed along the light source, and a second frame (270) defining a window at a middle portion thereof. The second frame cooperative with the first frame to form a space receiving the light source and the heat dispersing member therein.
    Type: Grant
    Filed: June 2, 2008
    Date of Patent: November 8, 2011
    Assignee: Chimei Innolux Corporation
    Inventor: Wei-Jung Cheng
  • Backlight module with heat dispersing member and liquid crystal display device using same
    Publication number: 20080297688
    Abstract: An exemplary backlight module (200) used for liquid crystal display device (20) includes a first frame (261), a light source (240), a heat dispersing member (280) disposed along the light source, and a second frame (270) defining a window at a middle portion thereof. The second frame cooperative with the first frame to form a space receiving the light source and the heat dispersing member therein.
    Type: Application
    Filed: June 2, 2008
    Publication date: December 4, 2008
    Inventor: Wei-Jung Cheng