Patents by Inventor Wei Kee Chan

Wei Kee Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame with grooved lead finger
    Patent number: 9006874
    Abstract: A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: April 14, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Wai Keong Wong, Kok Leong Chan, Wei Kee Chan
  • LEAD FRAME WITH GROOVED LEAD FINGER
    Publication number: 20140120664
    Abstract: A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.
    Type: Application
    Filed: January 6, 2014
    Publication date: May 1, 2014
    Inventors: Wai Keong Wong, Kok Leong Chan, Wei Kee Chan
  • Lead frame with grooved lead finger
    Patent number: 8643159
    Abstract: A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: February 4, 2014
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Wai Keong Wong, Kok Leong Chan, Wei Kee Chan
  • LEAD FRAME WITH GROOVED LEAD FINGER
    Publication number: 20130264693
    Abstract: A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.
    Type: Application
    Filed: April 9, 2012
    Publication date: October 10, 2013
    Applicant: FREESCALE SEMICONDUCTOR, INC
    Inventors: Wai Keong WONG, Kok Leong CHAN, Wei Kee CHAN
  • Multi-chip package including die paddle with steps
    Patent number: 7982293
    Abstract: A lead frame assembly includes at least one die paddle. The die paddle includes a first landing area for receiving a first semiconductor chip and a second landing area for receiving a second semiconductor chip. One or more steps are provided between the first landing area and the second landing area.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: July 19, 2011
    Assignee: Infineon Technologies AG
    Inventors: Wei Kee Chan, Weng Shyan Aik
  • Multi-Chip Package
    Publication number: 20090250797
    Abstract: A lead frame assembly includes at least one die paddle. The die paddle includes a first landing area for receiving a first semiconductor chip and a second landing area for receiving a second semiconductor chip. One or more steps are provided between the first landing area and the second landing area.
    Type: Application
    Filed: May 1, 2009
    Publication date: October 8, 2009
    Applicant: Infineon Technologies AG
    Inventors: Wei Kee Chan, Weng Shyan Aik
  • Semiconductor Device
    Publication number: 20090230519
    Abstract: This application relates to a semiconductor device comprising: a carrier comprising a chip island and at least one first external contact element; only one semiconductor chip, wherein the semiconductor chip comprises a first electrode on a first surface and a second electrode on a second surface opposite to the first surface and wherein the first electrode is attached to the chip island; and a metal structure comprising a plate region attached to the second electrode and a connection region attached to the at least one first external contact element, wherein the plate region extends laterally beyond the edges of at least two sides of the second surface of the semiconductor chip.
    Type: Application
    Filed: March 14, 2008
    Publication date: September 17, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ralf OTREMBA, Wei Kee CHAN, Stanley JOB DORAISAMY, Stefan KRAMP, Fong LIM, Xaver SCHLOEGEL