Abstract: A semiconductor assembly includes a face-to-face semiconductor sub-assembly electrically coupled to a circuit board by bonding wires. The face-to-face semiconductor sub-assembly includes top and bottom devices assembled on opposite sides of a routing circuitry, and is disposed in a through opening of the circuit board. The bonding wires provide electrical connections between the routing circuitry and the circuit board to interconnect the devices face-to-face assembled in the sub-assembly with the circuit board for next-level connection from two opposite sides of the circuit board.

Abstract: A semiconductor assembly includes a face-to-face semiconductor sub-assembly electrically coupled to a circuit board by bonding wires. The face-to-face semiconductor sub-assembly includes top and bottom devices assembled on opposite sides of a routing circuitry, and is disposed in a through opening of the circuit board. The bonding wires provide electrical connections between the routing circuitry and the circuit board to interconnect the devices face-to-face assembled in the sub-assembly with the circuit board for next-level connection from two opposite sides of the circuit board.

Abstract: A thermally enhanced wiring board with thermal pad and electrical post includes a metal slug, a metal pillar, a patterned interconnect substrate, an adhesive, a build-up circuitry and optionally a plated through hole. The metal slug and the metal pillar extend into apertures of the patterned interconnect substrate and are electrically connected to the build-up circuitry. The build-up circuitry covers the metal slug, the metal pillar and the patterned interconnect substrate and can provide signal routing. The metal slug can provide thermal contact surface, and the metal pillar can serve as power/ground plane or signal vertical transduction pathway.

Abstract: A wiring board with built-in metal slugs includes a dielectric hybrid core and build-up circuitries. The metal slugs extend into apertures of a stiffener of the hybrid core and are electrically connected to the build-up circuitry. The build-up circuitry covers the metal slugs and the stiffener and provides signal routing. The metal slugs can serve as power and ground planes for the wiring board.

Abstract: A memory module has a good heat sinking effect. Each chip on the memory module has a surface exposed in the air. Or, a thermal pad can further adhere to the surface of the chips. Thus, the heat sinking effect of the memory module is improved; and an easy and convenient producing method is obtained.