Patents by Inventor Wei-Kun CHANG

Wei-Kun CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145379
    Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.
    Type: Application
    Filed: February 23, 2023
    Publication date: May 2, 2024
    Inventors: Yen-Kun Lai, Wei-Hsiang Tu, Ching-Ho Cheng, Cheng-Nan Lin, Chiang-Jui Chu, Chien Hao Hsu, Kuo-Chin Chang, Mirng-Ji Lii
  • Patent number: 11935935
    Abstract: A thin film transistor includes a gate electrode embedded in an insulating layer that overlies a substrate, a gate dielectric overlying the gate electrode, an active layer comprising a compound semiconductor material and overlying the gate dielectric, and a source electrode and drain electrode contacting end portions of the active layer. The gate dielectric may have thicker portions over interfaces with the insulating layer to suppress hydrogen diffusion therethrough. Additionally or alternatively, a passivation capping dielectric including a dielectric metal oxide material may be interposed between the active layer and a dielectric layer overlying the active layer to suppress hydrogen diffusion therethrough.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Min-Kun Dai, Wei-Gang Chiu, I-Cheng Chang, Cheng-Yi Wu, Han-Ting Tsai, Tsann Lin, Chung-Te Lin
  • Patent number: 11073477
    Abstract: An epi-cone shell light-sheet super-resolution system and an epi-fluorescence microscope are provided. The epi-cone shell light-sheet super-resolution system includes a light-emitting element, a lens set, and an objective lens. After passing through the lens set, the excitation light emitted by the light-emitting element is refracted into ring-shaped light and focused on the objective-lens back-focal plane. The objective lens focuses the ring-shaped light to form a ring-shaped light cone which is then focused on the sample position. The ring-shaped light cone has a fixed thickness. In addition, the same objective lens is used for both excitation and imaging, thus achieving an epi-fluorescence microscope.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: July 27, 2021
    Assignee: National Tsing Hua University
    Inventors: Ann-Shyn Chiang, Li-An Chu, Wei-Kun Chang, Yen-Yin Lin
  • Publication number: 20200284729
    Abstract: An epi-cone shell light-sheet super-resolution system and an epi-fluorescence microscope are provided. The epi-cone shell light-sheet super-resolution system includes a light-emitting element, a lens set, and an objective lens. After passing through the lens set, the excitation light emitted by the light-emitting element is refracted into ring-shaped light and focused on the objective-lens back-focal plane. The objective lens focuses the ring-shaped light to form a ring-shaped light cone which is then focused on the sample position. The ring-shaped light cone has a fixed thickness. In addition, the same objective lens is used for both excitation and imaging, thus achieving an epi-fluorescence microscope.
    Type: Application
    Filed: August 29, 2019
    Publication date: September 10, 2020
    Inventors: Ann-Shyn CHIANG, Li-An CHU, Wei-Kun CHANG, Yen-Yin LIN