Patents by Inventor Wei-Kuo Chin

Wei-Kuo Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for preparing hydrophobic metal nanoparticles and precursors used therein
    Patent number: 8591624
    Abstract: Hydrophobic metal nanoparticles are prepared by reducing a metal precursor in a non-polar or low polar organic solvent with or without volume expansion by adding CO2.
    Type: Grant
    Filed: August 18, 2010
    Date of Patent: November 26, 2013
    Assignee: National Tsing Hua University
    Inventors: Chung-Sung Tan, Wei-Kuo Chin, Hsien-Te Hsieh
  • METHODS FOR PREPARING HYDROPHOBIC METAL NANOPARTICLES AND PRECURSORS USED THEREIN
    Publication number: 20110203414
    Abstract: Hydrophobic metal nanoparticles are prepared by reducing a metal precursor in a non-polar or low polar organic solvent with or without volume expansion by adding CO2.
    Type: Application
    Filed: August 18, 2010
    Publication date: August 25, 2011
    Applicant: National Tsing Hua University
    Inventors: Chung-Sung TAN, Wei-Kuo Chin, Hsien-Te Hsieh
  • Polymeric positive temperature coefficient thermistor and process for preparing the same
    Publication number: 20080186128
    Abstract: The present invention provides a polymeric positive temperature coefficient thermistor, which comprises a first electrode, a second electrode, and a polyimide film sandwiched in between, which comprises (A) a polyimide resin, and (B) nickel powder used to blend with the polyimide resin, wherein the polyimide film has a thickness from 10 to 100 ?m, and the filling proportion of the nickel powder within the polyimide resin reaches a critical volume fraction or above. A process for preparing the above mentioned thermistor is also provided.
    Type: Application
    Filed: July 17, 2007
    Publication date: August 7, 2008
    Inventors: Chi-Sheng Chang, Wei-Kuo Chin
  • Biodegradable cationic polymer
    Patent number: 7179874
    Abstract: A biodegradable cationic polymer is disclosed. The biodegradable cationic polymer of the invention has amino groups in the backbone and side chains, self-assembles cationic complexes with nucleic acids, and delivers nucleic acids into a cell by endocytosis. The biodegradable cationic polymer of the invention also has very low cytotoxicity. Methods of making and using the biodegradable cationic polymer are further disclosed.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: February 20, 2007
    Assignee: Chia Nan University of Pharmacy and Science
    Inventors: Min-Da Shau, Jong-Yuh Cherng, Tsung-Fu Yang, Wei-Kuo Chin
  • Biodegradable cationic polymer
    Publication number: 20050112203
    Abstract: A biodegradable cationic polymer is disclosed. The biodegradable cationic polymer of the invention has amino groups in the backbone and side chains, self-assembles cationic complexes with nucleic acids, and delivers nucleic acids into a cell by endocytosis. The biodegradable cationic polymer of the invention also has very low cytotoxicity. Methods of making and using the biodegradable cationic polymer are further disclosed.
    Type: Application
    Filed: November 21, 2003
    Publication date: May 26, 2005
    Inventors: Min-Da Shau, Jong-Yuh Cherng, Tsung-Fu Yang, Wei-Kuo Chin