Patents by Inventor Wei-Kuo Han
Wei-Kuo Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11776867Abstract: A chip package including a heat-dissipating device, a first thermal interface material layer disposed on the heat-dissipating device, a patterned circuit layer disposed on the first thermal interface material layer, a chip disposed on the patterned circuit layer and electrically connected to the patterned circuit layer, and an insulating encapsulant covering the chip, the patterned circuit layer, and the first thermal interface material layer is provided. The first thermal interface material layer has a thickness between 100 ?m and 300 ?m. The first thermal interface material layer is located between the patterned circuit layer and the heat-dissipating device.Type: GrantFiled: June 14, 2022Date of Patent: October 3, 2023Assignee: Industrial Technology Research InstituteInventors: Kuo-Shu Kao, Tao-Chih Chang, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin, Wei-Kuo Han
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Patent number: 11756858Abstract: A power module including a main housing, a power element, and at least one assembling component is provided. The main housing has at least one side wall and at least two ribs extending from the side wall. The power element is disposed in the main housing and is closely pressed against a heat dissipation structure by the side wall. The assembling component includes a main section and two bending sections. The main section is located between the two ribs and includes a central portion, at least one movable component, and a peripheral portion. The central portion has a fastening portion, the peripheral portion surrounds the central portion, and the movable component is connected between the central portion and the peripheral portion. The two bending sections are respectively connected to two opposite sides of the peripheral portion and are respectively embedded in the two ribs.Type: GrantFiled: January 4, 2021Date of Patent: September 12, 2023Assignees: Industrial Technology Research Institute, DIODES TAIWAN S.A R.L.Inventors: Wei-Kuo Han, Chia-Yen Lee, Jing-Yao Chang, Tao-Chih Chang
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Publication number: 20220310473Abstract: A chip package including a heat-dissipating device, a first thermal interface material layer disposed on the heat-dissipating device, a patterned circuit layer disposed on the first thermal interface material layer, a chip disposed on the patterned circuit layer and electrically connected to the patterned circuit layer, and an insulating encapsulant covering the chip, the patterned circuit layer, and the first thermal interface material layer is provided. The first thermal interface material layer has a thickness between 100 ?m and 300 ?m. The first thermal interface material layer is located between the patterned circuit layer and the heat-dissipating device.Type: ApplicationFiled: June 14, 2022Publication date: September 29, 2022Applicant: Industrial Technology Research InstituteInventors: Kuo-Shu Kao, Tao-Chih Chang, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin, Wei-Kuo Han
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Patent number: 11387159Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.Type: GrantFiled: March 4, 2020Date of Patent: July 12, 2022Assignee: Industrial Technology Research InstituteInventors: Kuo-Shu Kao, Tao-Chih Chang, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin, Wei-Kuo Han
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Patent number: 11239211Abstract: An electronic device package structure including a substrate, a first circuit layer, a second circuit layer, an electronic device and an input/output device is provided. The first circuit layer includes a first conductive portion, a second conductive portion and a first curve portion located between the first conductive portion and the second conductive portion. At least a partial thickness of the first curve portion is greater than a thickness of the first conductive portion. The electronic device disposed on the second circuit layer is electrically connected to the second conductive portion of the first circuit layer. The input/output device disposed corresponding to the first conductive portion is electrically connected to the first conductive portion of the first circuit layer.Type: GrantFiled: January 7, 2020Date of Patent: February 1, 2022Assignee: Industrial Technology Research InstituteInventors: Wei-Kuo Han, Jing-Yao Chang, Tao-Chih Chang
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Patent number: 11114387Abstract: An electronic package structure is provided. The electronic packaging structure includes a substrate, a conductive layer disposed on the substrate, an intermetallic compound disposed on the conductive layer, a stress buffering material disposed on the substrate and adjacent to the conductive layer, and an electronic device disposed on the conductive layer and the stress buffering material. The intermetallic compound is disposed between the electronic device and the conductive layer, between the electronic device and the stress buffering material, between the substrate and the stress buffering material, and between the conductive layer and the stress buffering material.Type: GrantFiled: August 22, 2018Date of Patent: September 7, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jing-Yao Chang, Tao-Chih Chang, Fang-Jun Leu, Wei-Kuo Han, Kuo-Shu Kao
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Publication number: 20210210409Abstract: A power module including a main housing, a power element, and at least one assembling component is provided. The main housing has at least one side wall and at least two ribs extending from the side wall. The power element is disposed in the main housing and is closely pressed against a heat dissipation structure by the side wall. The assembling component includes a main section and two bending sections. The main section is located between the two ribs and includes a central portion, at least one movable component, and a peripheral portion. The central portion has a fastening portion, the peripheral portion surrounds the central portion, and the movable component is connected between the central portion and the peripheral portion. The two bending sections are respectively connected to two opposite sides of the peripheral portion and are respectively embedded in the two ribs.Type: ApplicationFiled: January 4, 2021Publication date: July 8, 2021Applicants: Industrial Technology Research Institute, Lite-On Semiconductor CorporationInventors: Wei-Kuo Han, Chia-Yen Lee, Jing-Yao Chang, Tao-Chih Chang
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Publication number: 20210066257Abstract: An electronic device package structure including a substrate, a first circuit layer, a second circuit layer, an electronic device and an input/output device is provided. The first circuit layer includes a first conductive portion, a second conductive portion and a first curve portion located between the first conductive portion and the second conductive portion. At least a partial thickness of the first curve portion is greater than a thickness of the first conductive portion. The electronic device disposed on the second circuit layer is electrically connected to the second conductive portion of the first circuit layer. The input/output device disposed corresponding to the first conductive portion is electrically connected to the first conductive portion of the first circuit layer.Type: ApplicationFiled: January 7, 2020Publication date: March 4, 2021Applicant: Industrial Technology Research InstituteInventors: Wei-Kuo Han, Jing-Yao Chang, Tao-Chih Chang
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Publication number: 20200203246Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.Type: ApplicationFiled: March 4, 2020Publication date: June 25, 2020Applicant: Industrial Technology Research InstituteInventors: Kuo-Shu Kao, Tao-Chih Chang, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin, Wei-Kuo Han
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Patent number: 10622274Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.Type: GrantFiled: May 11, 2018Date of Patent: April 14, 2020Assignee: Industrial Technology Research InstituteInventors: Kuo-Shu Kao, Tao-Chih Chang, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin, Wei-Kuo Han
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Publication number: 20190109064Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.Type: ApplicationFiled: May 11, 2018Publication date: April 11, 2019Applicant: Industrial Technology Research InstituteInventors: Kuo-Shu Kao, Tao-Chih Chang, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin, Wei-Kuo Han
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Publication number: 20180358307Abstract: An electronic package structure is provided. The electronic packaging structure includes a substrate, a conductive layer disposed on the substrate, an intermetallic compound disposed on the conductive layer, a stress buffering material disposed on the substrate and adjacent to the conductive layer, and an electronic device disposed on the conductive layer and the stress buffering material. The intermetallic compound is disposed between the electronic device and the conductive layer, between the electronic device and the stress buffering material, between the substrate and the stress buffering material, and between the conductive layer and the stress buffering material.Type: ApplicationFiled: August 22, 2018Publication date: December 13, 2018Inventors: Jing-Yao Chang, Tao-Chih Chang, Fang-Jun Leu, Wei-Kuo Han, Kuo-Shu Kao
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Publication number: 20180233477Abstract: An electronic package structure is provided. The electronic packaging structure includes a substrate, a conductive layer disposed on the substrate, an intermetallic compound disposed on the conductive layer, a stress buffering material and an electronic device. The stress buffering material is disposed on the substrate and adjacent to the conductive layer. The electronic device is disposed on the intermetallic compound and the stress buffering material, and the electronic device is in contact with the intermetallic compound. The stress buffering material is adjacent to the conductive layer to have the conductive layer and the stress buffering material together serving as a stress buffer, so as to enhance the effect of stress buffering, thereby preventing a wafer from cracking due to stress.Type: ApplicationFiled: April 14, 2017Publication date: August 16, 2018Inventors: Jing-Yao Chang, Tao-Chih Chang, Fang-Jun Leu, Wei-Kuo Han, Kuo-Shu Kao
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Patent number: 9915184Abstract: A waste heat exchanger may include an inner tube, an outer tube, a fin assembly and a plurality of heat electric modules The inner tube has a plurality of holes. Disposed inside the inner tube is a plurality of inlet channels and a plurality of outlet channels. The plurality of inlet channels and the plurality of outlet channels are disposed to correspond to each other. The plurality of inlet channels and the plurality of outlet channels are connected to the plurality of holes. A fluid flows through the plurality of inlets and the plurality of holes to get into the outlet channels. The outer tube is disposed outside the inner tube. The conductive assembly is positioned between the inner tube and the outer tube. The conductive assembly is disposed on an outside surface of the inner tube and an inside surface of the outer tube.Type: GrantFiled: December 15, 2014Date of Patent: March 13, 2018Assignee: Industrial Technology Research InstituteInventors: Wei-Kuo Han, Chun-Kai Liu
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Publication number: 20160053653Abstract: A waste heat exchanger may include an inner tube, an outer tube, a fin assembly and a plurality of heat electric modules The inner tube has a plurality of holes. Disposed inside the inner tube is a plurality of inlet channels and a plurality of outlet channels. The plurality of inlet channels and the plurality of outlet channels are disposed to correspond to each other. The plurality of inlet channels and the plurality of outlet channels are connected to the plurality of holes. A fluid flows through the plurality of inlets and the plurality of holes to get into the outlet channels. The outer tube is disposed outside the inner tube. The conductive assembly is positioned between the inner tube and the outer tube. The conductive assembly is disposed on an outside surface of the inner tube and an inside surface of the outer tube.Type: ApplicationFiled: December 15, 2014Publication date: February 25, 2016Inventors: Wei-Kuo Han, Chun-Kai Liu
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Patent number: 8300859Abstract: A speaker device including a transparent speaker and a light source module is provided. The transparent speaker is thin, soft, and has a low driving voltage. Light is emitted from a front side of the speaker panel, and transmitted in the same direction as the sound. Thus, the light is emitted along with the sound. The speaker device can be used as an indoor wall-painting or as a large advertisement poster for more visual effects to the viewer.Type: GrantFiled: April 22, 2009Date of Patent: October 30, 2012Assignee: Industrial Technology Research InstituteInventors: Wei-Kuo Han, Ming-Daw Chen
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Publication number: 20120227684Abstract: An internal combustion engine system including an electric power generating device, a container, a set of positive and negative electrodes and an internal combustion engine is provided. The container contains an electrolytic solution and has a gas outlet. The set of positive and negative electrodes are disposed within the electrolytic solution in the container, wherein the set of positive and negative electrodes are electrically connected to a first power output end and a second power output end of the electric power generating device, respectively. The internal combustion engine is connected to the gas outlet, wherein a gas product directed from the gas outlet is used as a fuel of the internal combustion engine. Further, the electric power generating device can be applied on a hydrogen/oxygen gas generating apparatus and integrated into the internal combustion engine system of a motor vehicle.Type: ApplicationFiled: May 21, 2012Publication date: September 13, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ra-Min Tain, Yao-Shun Chen, Wei-Kuo Han, Chun-Kai Liu
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Patent number: 8138034Abstract: A flexible electret transducer assembly including an electrical backplate and a membrane made of an electret material is disclosed. A plurality of spacers is formed on a surface of the electrical backplate in a longitudinal or latitudinal direction, and the spacers are used for supporting a vibrating room of the membrane. A working area of the membrane is formed between adjacent spacers, and in each of the working area, the space between the electrical backplate and the membrane is smaller than that in a conventional electrostatic speaker. The spacers between the electrical backplate and the membrane are mass produced through a stamping process. Thereby, an accurate space between the electrical backplate and the membrane can be maintained and accordingly the audio quality can be improved. In addition, a speaker including the flexible electret transducer assembly and a method for fabricating the flexible electret transducer assembly are also disclosed.Type: GrantFiled: August 5, 2008Date of Patent: March 20, 2012Assignee: Industrial Technology Research InstituteInventors: Wei-Kuo Han, Ming-Daw Chen
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Publication number: 20100067720Abstract: A speaker device including a transparent speaker and a light source module is provided. The transparent speaker is thin, soft, and has a low driving voltage. Light is emitted from a front side of the speaker panel, and transmitted in the same direction as the sound. Thus, the light is emitted along with the sound. The speaker device can be used as an indoor wall-painting or as a large advertisement poster for more visual effects to the viewer.Type: ApplicationFiled: April 22, 2009Publication date: March 18, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wei-Kuo Han, Ming-Daw Chen
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Publication number: 20090304212Abstract: A flexible electret transducer assembly including an electrical backplate and a membrane made of an electret material is disclosed. A plurality of spacers is formed on a surface of the electrical backplate in a longitudinal or latitudinal direction, and the spacers are used for supporting a vibrating room of the membrane. A working area of the membrane is formed between adjacent spacers, and in each of the working area, the space between the electrical backplate and the membrane is smaller than that in a conventional electrostatic speaker. The spacers between the electrical backplate and the membrane are mass produced through a stamping process. Thereby, an accurate space between the electrical backplate and the membrane can be maintained and accordingly the audio quality can be improved. In addition, a speaker including the flexible electret transducer assembly and a method for fabricating the flexible electret transducer assembly are also disclosed.Type: ApplicationFiled: August 5, 2008Publication date: December 10, 2009Applicant: Industrial Technology Research InstituteInventors: Wei-Kuo Han, Ming-Daw Chen