Patents by Inventor Wei Lee Lim

Wei Lee Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device comprising a can housing a semiconductor die which is embedded by an encapsulant
    Patent number: 11817418
    Abstract: A semiconductor device includes a conductive can include a flat portion and at least one peripheral rim portion extending from an edge of the flat portion, a semiconductor die comprising a first main face and a second main face opposite to the first main face, a first contact pad disposed on the first main face and a second contact pad disposed on the second main face, wherein the first contact pad is electrically connected to the flat portion of the can, an electrical interconnector connected with the second contact pad, and an encapsulant disposed under the semiconductor die so as to surround the electrical interconnector, wherein an external surface of the electrical interconnector is recessed from an external surface of the encapsulant.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: November 14, 2023
    Assignee: Infineon Technologies AG
    Inventors: Wei Lee Lim, Run Hong Toh, Peng Liang Yeap
  • Semiconductor Device Comprising a Can Housing a Semiconductor Die which is Embedded by an Encapsulant
    Publication number: 20210159204
    Abstract: A semiconductor device includes a conductive can include a flat portion and at least one peripheral rim portion extending from an edge of the flat portion, a semiconductor die comprising a first main face and a second main face opposite to the first main face, a first contact pad disposed on the first main face and a second contact pad disposed on the second main face, wherein the first contact pad is electrically connected to the flat portion of the can, an electrical interconnector connected with the second contact pad, and an encapsulant disposed under the semiconductor die so as to surround the electrical interconnector, wherein an external surface of the electrical interconnector is recessed from an external surface of the encapsulant.
    Type: Application
    Filed: November 24, 2020
    Publication date: May 27, 2021
    Inventors: Wei Lee Lim, Run Hong Toh, Peng Liang Yeap
  • Adhesion Enhancing Structures for a Package
    Publication number: 20200043876
    Abstract: A package includes an electronic chip having a pad. The pad is at least partially covered with adhesion enhancing structures. The pad and the adhesion enhancing structures have at least aluminium in common.
    Type: Application
    Filed: July 24, 2019
    Publication date: February 6, 2020
    Inventors: Evelyn Napetschnig, Wei Cheat Lee, Wei Lee Lim, Frank Renner, Michael Rogalli