Abstract: A display panel includes a first substrate, a second substrate, a display medium layer, pixel units, and a light-shielding conductive pattern layer. The first substrate has a first inner surface and a first outer surface, and the first outer surface serves as a display surface of the display panel. The second substrate is disposed opposite to the first substrate and has a second inner surface and a second outer surface. The display medium layer is disposed between the first inner surface and the second inner surface. The pixel units are disposed between the display medium layer and the first inner surface, and at least one of the pixel units includes an active element. The light-shielding conductive pattern layer is disposed between the display medium layer and the second inner surface, at least partially overlaps the active element in a vertical projection direction, and includes a first patterned light-shielding conductive layer and a first patterned low-reflection layer.

Abstract: A device for producing semiconductor bump metal layer includes a front end transfer module including a normal pressure transfer chamber, a base material carrier, a heating and carrying interlock vacuum chamber, and a cooling interlock vacuum chamber; a pre-cooking device for receiving the plurality of base materials, forming high vacuum, and baking the base materials; a rear end cleaning sputtering module for receiving the plurality of base materials and cleaning the plurality of base materials and sputtering metal layers; then the plurality of base materials being transferred to the cooling interlock vacuum chamber. The robot in the normal pressure transfer chamber transfers the base materials to the pre-cooking device so as to bake the base materials in high vacuum to remove vapors in the plurality of base materials; then the base materials are transferred to the heating and carrying interlock vacuum chamber for baking again to a predetermined level.

Abstract: An aluminum adhering process and a vacuum transfer chamber for a metal thin film plating machine. The vacuum transfer chamber includes a vacuum transfer chamber and a pre etching reacting cavity installed in a periphery of and communicated to the vacuum transfer chamber. The pre etching reacting cavity is in a very high vacuum state. The vacuum transfer chamber is installed with a robot. The aluminum adhering process includes steps of: installing a locating frame in the vacuum transfer chamber and for storing an aluminum sheet; taking the aluminum sheet from the locating sheet then transferring the aluminum sheet to the pre etching reaction chamber; plasma bombarding the aluminum sheet in the pre etching reaction chamber; and transferring the aluminum sheet back to the locating frame after a layer of aluminum is plated on an inner wall of the pre etching reacting cavity.

Abstract: A display panel includes a first substrate, a second substrate, a display medium layer, pixel units, and a light-shielding conductive pattern layer. The first substrate has a first inner surface and a first outer surface, and the first outer surface serves as a display surface of the display panel. The second substrate is disposed opposite to the first substrate and has a second inner surface and a second outer surface. The display medium layer is disposed between the first inner surface and the second inner surface. The pixel units are disposed between the display medium layer and the first inner surface, and at least one of the pixel units includes an active element. The light-shielding conductive pattern layer is disposed between the display medium layer and the second inner surface, at least partially overlaps the active element in a vertical projection direction, and includes a first patterned light-shielding conductive layer and a first patterned low-reflection layer.