Abstract: Provided are conductive structures located within dielectric material, and methods for fabricating such structures and devices. An exemplary method includes providing a substrate having a conductive feature in a first dielectric layer; depositing a second dielectric layer over the conductive feature and the first dielectric layer; etching the second dielectric layer to form a cavity through the second dielectric layer, wherein the cavity has a bottom with a convex profile; depositing a barrier layer along the bottom of the cavity; and depositing a conductive material in the cavity to form a structure electrically connected to the conductive feature.

Abstract: A number of eyeglass frames with resilient structures and shields that have wide applicability are described. In one embodiment, an auxiliary frame has a resilient structure at its bridge area, and non-uniform shields. The shields have openings at their sides and retaining mechanisms. Due to its resilient nature, the auxiliary frame is adaptable to after-market sales for primary frames. In yet another embodiment, a primary frame has a resilient structure at its bridge area and has shields. Such a primary frame again allows it to be comfortably fitted to people whose heads are of different sizes and shapes.

Abstract: A number of eyeglass frames with resilient structures and shields that have wide applicability are described. In one embodiment, an auxiliary frame has a resilient structure at its bridge area, and non-uniform shields. The shields have openings at their sides and retaining mechanisms. Due to its resilient nature, the auxiliary frame is adaptable to after-market sales for primary frames. In yet another embodiment, a primary frame has a resilient structure at its bridge area and has shields. Such a primary frame again allows it to be comfortably fitted to people whose heads are of different sizes and shapes.