Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

Abstract: A sensing device includes a substrate, a first circuit, a second circuit, a first photodetector, and a second photodetector. The first circuit is disposed on the substrate, and configured to sense a fingerprint. The second circuit is disposed on the substrate, and configured to detect a data of a living body. The first photodetector is electrically connected to the first circuit. The second photodetector is electrically connected to the second circuit. The area of the second photodetector is larger than the area of the first photodetector.

Abstract: A sensing device includes a substrate, a first circuit, a second circuit, a first photodetector, and a second photodetector. The first circuit is disposed on the substrate, and configured to sense a fingerprint. The second circuit is disposed on the substrate, and configured to detect a data of a living body. The first photodetector is electrically connected to the first circuit. The second photodetector is electrically connected to the second circuit. The area of the second photodetector is larger than the area of the first photodetector.

Abstract: A method for manufacturing a sensing device is provided. The method includes: providing a substrate; forming a sensing unit on the substrate; forming a first light-shielding layer on the sensing unit; forming a first anti-reflection layer on the sensing unit; and patterning the first light-shielding layer and the first anti-reflection layer using a single lithography process to form a first pinhole corresponding to the sensing unit.

Abstract: An optical sensing device includes a substrate; a light-sensing element disposed on the substrate; a light-shielding layer disposed on the light-sensing element, including a first opening overlapping the light-sensing element; an insulating layer disposed on the light-shielding layer, including a second opening overlapping the first opening; a light-shielding element disposed on a hole wall of the second opening; and a light-collecting element disposed on the insulating layer and overlapping the second opening.

Abstract: A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.

Abstract: A sensing device includes a substrate, a first circuit, a second circuit, a first photodetector, and a second photodetector. The substrate has a sensing region. The first circuit is disposed on the substrate and in the sensing region, and configured to sense a fingerprint. The second circuit is disposed on the substrate and in the sensing region, and configured to sense a living body. The first photodetector is electrically connected to the first circuit. The second photodetector is electrically connected to the second circuit. The area of the second photodetector is larger than the area of the first photodetector.

Abstract: A sensing device includes a substrate, a first circuit, a second circuit, a first photodetector, and a second photodetector. The substrate has a sensing region. The first circuit is disposed on the substrate and in the sensing region, and configured to sense a fingerprint. The second circuit is disposed on the substrate and in the sensing region, and configured to sense a living body. The first photodetector is electrically connected to the first circuit. The second photodetector is electrically connected to the second circuit. The area of the second photodetector is larger than the area of the first photodetector.

Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

Abstract: An electronic device is provided. The electronic device includes multiple transducer pixels. Each of the transducer pixels includes a sonic transducer, a demultiplexer electrically connected to the sonic transducer, a driving line electrically connected to the sonic transducer, a switching line electrically connected to the demultiplexer, and a reading line electrically connected to the demultiplexer. The driving line is used to provide a driving signal to the sonic transducer to emit sonic waves. The switching line is used to turn on the demultiplexer to output the sensing signal received by the sonic transducer to the reading line.

Abstract: A method for manufacturing a sensing device is provided. The method includes: providing a substrate; forming a sensing unit on the substrate; forming a first light-shielding layer on the sensing unit; forming a first anti-reflection layer on the sensing unit; and patterning the first light-shielding layer and the first anti-reflection layer using a single lithography process to form a first pinhole corresponding to the sensing unit.

Abstract: A sustained-release composition is provided in the present disclosure for producing a therapeutic gas, such as hydrogen. The sustained-release composition includes a precursor and a carrier. The precursor is magnesium, and the carrier is for carrying the precursor with an efficient amount, wherein the carrier includes a poly lactic-co-glycolic acid copolymer.

Abstract: A sustained-release composition is provided in the present disclosure for producing a therapeutic gas, such as hydrogen sulfide or hydrogen. The sustained-release composition includes a precursor and a carrier. The precursor is diallyl trisulfide or magnesium, and the carrier includes a poly lactic-co-glycolic acid copolymer for carrying the precursor with an efficient amount.

Abstract: A sustained-release composition is provided in the present disclosure for producing a therapeutic gas, such as hydrogen sulfide or hydrogen. The sustained-release composition includes a precursor and a carrier. The precursor is diallyl trisulfide or magnesium, and the carrier includes a poly lactic-co-glycolic acid copolymer for carrying the precursor with an efficient amount.

Abstract: The present disclosure provides a temperature-responsive composition including a nitric oxide donor and a carrier. The nitric oxide donor is a pH-dependent material, and the carrier is provided for carrying the nitric oxide donor with an effective amount. The carrier includes a protective agent and an organic protic acid. A transition temperature of the temperature-responsive composition is larger than or equal to 28° C. and less than or equal to 37° C.