Abstract: A heat-dissipating device for interface card is disposed on an interface card. The heat-dissipating device includes a heat sink, a housing, and a fan. The heat sink is disposed on the interface card. The housing is disposed on the heat sink. The housing has a top plate and two side plates connected to the top plate. The top plate has an inlet opening. An inner surface of the top plate proximate to the inlet opening has a protruding wall and an opening. The protruding wall has a curve panel. The fan is arranged in the housing and correspondingly arranged at the inlet opening. The fan has a rotational shaft, a plurality of axial fan blades, and centrifugal fan blades. The rotational shaft is pivotally disposed on a bottom seat. The assembled heat-dissipating device can optimize air flow to improve heat dissipation and effectively improve heat dissipating rate.

Abstract: A black polyimide film includes a polyimide polymer formed by reaction of diamine monomers with dianhydride monomers, and a carbon black having an oxygen-to-carbon weight ratio higher than 11%. The black polyimide film can prevent flaking of carbon black when it is subject to an etching process, and exhibit desirable characteristics of extension rate and insulation.

Abstract: A sight and methods of operation thereof are provided. In some embodiments, an image is captured via an image capture unit, and a center position is calculated according to the positions of at least three impact points in the image, and a predefined view center of a display unit is set to the center position. In some embodiments, an angle of dip of the sight to a plane is detected via a dip angle detector. A predictive impact point is calculated according to the angle of dip and at least one calculation parameter, and an impact point indication is accordingly displayed in the display unit. When the angle of dip is changed, the predictive impact point is recalculated according to the new angle of dip, and the corresponding impact point indication is displayed.

Abstract: A method of etching a trench in a substrate is provided. The method repeatedly alternates between using a fluorine-based plasma to etch a trench, which has trench sidewalls, into a selected region of the substrate; and using a fluorocarbon plasma to deposit a liner on the trench sidewalls. The liner, when formed and subsequently etched, has an exposed sidewall surface that includes scalloped recesses. The trench, which includes the scalloped recesses, is then bombarded with a molecular beam where the molecules are directed on an axis parallel to the trench sidewalls to reduce the scalloped recesses.

Abstract: An instantaneously heating water dispenser, electrically connected with an external power, includes a voltage detection module, a voltage compensation module, a water tank, a heating module, and a control module. The voltage detection module detects a voltage level of the external power. The voltage compensation module operates in coordination with the voltage detection module and stabilizes the voltage level of the external power. The heating module electrically connected with the voltage compensation module is connected with the water tank, and converts the external power compensated into a thermal energy. The control module is electrically connected with the heating module and the voltage compensation module and configured for controlling the amount of water flow injected into the heating module and the thermal power generated by the heating module according to the amount of water to be dispensed from the instantaneously heating water dispenser and the associated water temperature.

Abstract: The present disclosure relates to a method of gettering that provides for a high efficiency gettering process by increasing an area in which a getter layer is deposited, and an associated apparatus. In some embodiments, the method is performed by providing a substrate into a processing chamber having one or more residual gases. A cavity is formed within a top surface of the substrate. The cavity has a bottom surface and sidewalls extending from the bottom surface to the top surface. A getter layer, which absorbs the one or more residual gases, is deposited over the substrate at a position extending from the bottom surface of the cavity to a location on the sidewalls. By depositing the getter layer to extend to a location on the sidewalls of the cavity, the area of the substrate that is able to absorb the one or more residual gases is increased.

Abstract: A bonding layer of the first wafer article is thermally treated and a bonding layer of a second wafer article is thermally treated in accordance with first and second process parameters, respectively prior to bonding the first wafer article with the second wafer article. First and second grid distortion in the first and second wafer articles is measured and a difference is determined between the first and second grid distortions. A prediction is made for maintaining the difference within a prescribed tolerance. At least one of the first process parameters and the second process parameters can be conditionally varied in accordance with the prediction. The thermally treating of the first wafer article and the thermally treating of the second wafer article can then be performed with respect to another pair of the first and second wafer articles prior to bonding the another pair of wafer articles to one another through their respective bonding layers.

Abstract: The present invention provides an adsorbent for removing sulfur from cracking gasoline or diesel fuel. The adsorbent has excellent abrasion-resistance and desulfurization activity. The adsorbent comprises from about 5 to about 35 wt % of alumina, from about 3 to about 30 wt % of silica, from about 10 to about 80 wt % of at least one oxide of metal selected from Groups IIB and VB, from about 3 to about 30 wt % of at least one metal accelerant selected from Groups VIIB and VIII, and from about 0.5 to about 10 wt % of at least one oxide of metal selected from Groups IA and IIA, based on the total weight of the adsorbent.

Abstract: A device includes an inter-layer dielectric, a device die under the inter-layer dielectric; and a die-attach film under the inter-layer dielectric and over the device die, wherein the die-attach film is attached to the device die. A plurality of redistribution lines includes portions level with the die-attach film. A plurality of Z-interconnects is electronically coupled to the device die and the plurality of redistribution lines. A polymer-comprising material is under the inter-layer dielectric. The device die, the die-attach film, and the plurality of Z-interconnects are disposed in the polymer-comprising material.

Abstract: The invention provides a flexible base material and a flexible electronic device. The flexible base material includes a flexible substrate having a first surface and a second surface opposite to the first surface. A first organic composite barrier layer is deposited on the first surface of the flexible substrate, wherein the first organic composite barrier layer applies a first stress to the flexible substrate. An anti-curved layer is deposited on the second surface of the flexible substrate, wherein the anti-curved layer applies a second stress to the flexible substrate, and wherein the second stress applied by the anti-curved layer cancels off more than 90% of the first stress.

Abstract: A method of manufacturing a semiconductor structure includes several operations. The several operations include placing a plurality of dies on a carrier; defining a first zone and a second zone in a top surface of the carrier; calculating a first coverage ratio in the first zone; calculating a second coverage ratio in the second zone; disposing a dummy block on a specified location of the top surface of the carrier if the difference between the first coverage ratio and the second coverage ratio is greater than a predetermined value; forming a molding compound on the carrier.

Abstract: A conductive interconnect structure includes a contact pad; a conductive body connected to the contact pad at a first end; and a conductive layer positioned on a second end of the conductive body. The conductive body has a longitudinal direction perpendicular to a surface of the contact pad. The conductive body has an average grain size (a) on a cross sectional plane (Plane A) whose normal is perpendicular to the longitudinal direction of the conductive body. The conductive layer has an average grain size (b) on Plane A. The conductive body and the conductive layer are composed of same material, and the average grain size (a) is greater than the average grain size (b).

Abstract: A communication device including a ground element and an antenna element is provided. The antenna element has a first connection point, and at least includes a first branch, a second branch, and a third branch. One end of the first branch is coupled through an inductive element to the first connection point. One end of the second branch is coupled to the first connection point. A second segment of the second branch is substantially parallel to a first segment of the first branch. The second branch is disposed between the first branch and an edge of the ground element. One end of the third branch is coupled to a second connection point on the first branch. The third branch and the first branch substantially extend in opposite directions. The first connection point is further coupled through a high-pass matching circuit to a signal source.

Abstract: An electronic device includes a housing defining an opening, a circuit board mounted in the housing, and a cover capable of conducting heat and covering the opening. An element and a hollow partition portion receiving the element are mounted on the circuit board. The cover includes a block formed on an inner surface of the cover. The block enters the partition portion and contacts the element.

Abstract: The present invention discloses a water dispensing device including a water tank and at least one heating module. Each heating module includes a body and a heating plate, the body includes a groove, an input terminal located one end of the groove and connected the water tank, an output terminal located other end of the groove, and a plurality of ribs. The ribs formed on the bottom surface of the groove and the height is less than a depth of the groove, two arms of the ribs connect the sidewalls of the groove, and the density of the arrangement is decremented from the input terminal to the output terminal. The heating plate is covered the groove and doesn't contact the ribs, and the surface of the heating plate which is deviated from the groove has a plurality of heating units, be used to convert the power into the heat energy.

Abstract: A decoding method, a memory storage device and a rewritable non-volatile memory module are provided. The method includes: reading a plurality of bits from the rewritable non-volatile memory module according to a reading voltage; performing a parity check of a low density parity check (LDPC) algorithm on the bits to obtain syndromes, and each of the bits is corresponding to at least one of the syndromes; determining whether the bits have an error according to the syndromes; if the bits have the error, obtaining a syndrome weight of each of the bits according to the syndromes corresponding to each of the bits; obtaining an initial value of each of the bits according to the syndrome weight of each of the bits; and performing a first iteration decoding of the LDPC algorithm on the bits according to the initial values. Accordingly, the decoding speed is increased.

Abstract: A method for a forming three dimensional circuit is provided. A plastic base is provided. A metal layer is bonded on the plastic base by a metal coating process. The thickness of the metal layer is thickened by an electroplating process. The metal layer is trimmed to form a circuit pattern thereon by a laser engraving process, whereby, the working-hours can be reduced and the cost of material can also be reduced when the three dimensional circuit is manufactured.

Abstract: A container data center system includes a container, a plurality of servers, at least a regulation device, a first refrigeration device and a second refrigeration device. The container defines a first receiving room and a second receiving room isolated from the first receiving room. The servers are received in the first receiving room. The at least a regulation device is received in second receiving room. The at least regulation device is electrically connected to the servers for regulating the servers. The first refrigeration device is installed outside the container for cooling the first receiving room. The second refrigeration device is installed outside the container for cooling the second receiving room.

Abstract: A memory management method and a memory controller and a memory storage apparatus using the same are provided. The method includes applying different detection biases to read data stored in physical pages of a rewritable non-volatile memory module and calculating the number of error bits according the read data. The method further includes estimating a value of a wearing degree of each physical page according to the calculated number of error bits and operating the rewritable non-volatile memory module according to the value of the wearing degree of each physical page. Accordingly, the method can effectively identify the wearing degree of the rewritable non-volatile memory module and operate the rewritable non-volatile memory module by applying a corresponding management mechanism, so as to prevent data errors.