Abstract: Detectors are situated along a tilted optical axis to receive optical radiation from a work surface. Variations in the received optical power are used to estimate a work surface positional along a work surface axis. The received optical power can be emitted from the work surface and an estimated temperature of the work surface used to adjust the received optical power. One or two single element detectors or a linear detector can be used. A position of a focused spot produced from the received optical power at the linear detector can be used to assess work surface axial position.

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component. The photonic component has a bottom surface and a lateral surface. The lateral surface of the photonic component includes a light coupling region and a non-light coupling plane. The non-light coupling plane contacts the bottom surface. The light coupling region and the non-light coupling plane are not aligned.

Abstract: A semiconductor device and method for forming the semiconductor device is provided. The semiconductor device includes an integrated circuit having through vias adjacent to the integrated circuit die, wherein a molding compound is interposed between the integrated circuit die and the through vias. The through vias have a projection extending through a patterned layer, and the through vias may be offset from a surface of the patterned layer. The recess may be formed by selectively removing a seed layer used to form the through vias.

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

Abstract: An under boat support (UBS) includes an electrostatic discharge (ESD) safe ceramic body and a conductive body. The ESD safe ceramic body is coupled to a surface of the conductive body by an adhesive, which may be resistant to high temperatures. A plurality of springs are present within the adhesive and extend from the surface of the conductive body to a surface of the ESD safe ceramic body. For example, first ends of the plurality of springs are electrically coupled to the surface of the conductive body, and second ends of the plurality of springs, which are opposite to corresponding ones of the first ends of the plurality of springs, are electrically coupled to the surface of the ESD safe ceramic body. The plurality of springs form electrical pathways such that the ESD safe ceramic body is electrically coupled to the conductive body.

Abstract: Disclosed herein are related to a device and a method for sensing a temperature. In one aspect, the device includes a first resistor including a first metal rail in a first layer. The first metal rail may have a first thermal-resistance coefficient. In one aspect, the device includes a second resistor including a second metal rail in a second layer above the first layer along a direction. The second metal rail may have a second thermal-resistance coefficient. In one aspect, the device includes a sensing circuit coupled to the first resistor and the second resistor. The sensing circuit may be configured to determine a temperature, according to the first metal rail having the first thermal-resistance coefficient and the second metal rail having the second thermal-resistance coefficient.

Abstract: A communication method includes: generating an extremely high-throughput physical layer protocol data unit (EHT PPDU) that comprises a legacy physical layer preamble and a new physical layer preamble, wherein the legacy physical layer preamble comprises a legacy short training field (L-STF), a legacy long training field (L-LTF), and a legacy signal (L-SIG) field in turn, and wherein a first field of the new physical layer preamble is a repeat of a field in the legacy physical layer preamble and is modulated by binary phase shift keying, BPSK; and sending the PPDU.

Abstract: A pixel sensor may include a layer stack to reduce and/or block the effects of plasma and etching on a photodiode and/or other lower-level layers. The layer stack may include a first oxide layer, a layer having a band gap that is approximately less than 8.8 electron-Volts (eV), and a second oxide layer. The layer stack may reduce and/or prevent the penetration and absorption of ultraviolet photons resulting from the plasma and etching processes, which may otherwise cause the formation of electron-hole pairs in the substrate in which the photodiode is included.

Abstract: The present invention features interferon-free therapies for the treatment of HCV. Preferably, the treatment is over a shorter duration of treatment, such as no more than 12 weeks. In one aspect, the treatment comprises administering at least two direct acting antiviral agents to a subject with HCV infection, wherein the treatment lasts for 12 weeks and does not include administration of either interferon or ribavirin, and said at least two direct acting antiviral agents comprise (a) Compound 1 or a pharmaceutically acceptable salt thereof and (b) Compound 2 or a pharmaceutically acceptable salt thereof.

Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.

Abstract: The present disclosure describes systems, methods, and non-transitory computer readable media for detecting user interactions to edit a digital image from a client device and modify the digital image for the client device by using a web-based intermediary that modifies a latent vector of the digital image and an image modification neural network to generate a modified digital image from the modified latent vector. In response to user interaction to modify a digital image, for instance, the disclosed systems modify a latent vector extracted from the digital image to reflect the requested modification. The disclosed systems further use a latent vector stream renderer (as an intermediary device) to generate an image delta that indicates a difference between the digital image and the modified digital image. The disclosed systems then provide the image delta as part of a digital stream to a client device to quickly render the modified digital image.

Abstract: An electronic device may have optical components that each have first and second transparent layers such as first and second glass layers. The glass layers may have outer surfaces that face away from each other and inner surfaces that face towards each other. A polymer layer is formed between the inner surfaces of the glass layers. Along the periphery of each optical component, a hermetic seal is formed to protect the polymer material of the polymer layer. The seal may have a moisture barrier layer that is attached to the first and second glass layers. The moisture barrier layer may be supported by an elastomeric buffer member. The moisture barrier layer may be formed from metal film or a polymer layer or other substrate that is coated with a moisture-impermeable coating. The moisture-impermeable coating may be formed from one or more thin-film metal layers and/or one more thin-film dielectric layers.

Abstract: A low-dropout regulator circuit includes a reference circuit, an amplifying circuit, a power switch circuit, a feedback circuit, and a control circuit. The reference circuit is configured to generate a reference voltage. The amplifying circuit is configured to generate an amplifying voltage according to the reference voltage and a feedback voltage. The power switch circuit is configured to receive the amplifying voltage and generate an output voltage at an output terminal according to an input voltage. The feedback circuit is configured to generate the feedback voltage according to the output voltage. The control circuit is configured to control the power switch circuit according to the input voltage and a signal from the reference circuit.

Abstract: A connector assembly that may be used to connect an upper circuit board to a lower circuit board is disclosed. The connector assembly includes a base, and a bracket mechanically fastened to the base. The connector assembly also has a handle rotatably coupled to the base. The connector assembly includes a link bar movably coupling the handle to the base. The connector assembly further includes a guiding feature mechanically coupled between the base and the bracket. The guiding feature is configured to direct relative motion between the base and the bracket. The link bar and the guiding feature are also configured to transfer an external force applied to the handle, the external force being transferred to the upper and lower circuit boards via the base and the bracket.

Abstract: A neutron capture therapy system is provided, including a neutron generating device and a beam shaping assembly. The neutron capture therapy system further includes a concrete wall forming a space for accommodating the neutron generating device and the beam shaping assembly and shielding radiations generated by the neutron generating device and the beam shaping assembly. A support module is disposed in the concrete wall, the support module is capable of supporting the beam shaping assembly and is used to adjust the position of the beam shaping assembly, and the support module includes concrete and a reinforcing portion at least partially disposed in the concrete. The neutron capture therapy system designs a locally adjustable support for the beam shaping assembly, so that the beam shaping assembly can meet the precision requirement, improve the beam quality, and meet an assembly tolerance of the target.

Abstract: Example implementations described herein are directed to a novel Automated Machine Learning (AutoML) framework that is generated on an AutoML library so as to facilitate functionality to incorporate multiple machine learning model libraries within the same framework through a solution configuration file. The example implementations further involve a solution generator that identifies solution candidates and parameters for machine learning models to be applied to a dataset specified by the solution configuration file.

Abstract: A memory control method, a memory storage device, and a memory control circuit unit are provided. The memory control method includes: receiving a read command from a host system; in response to a first physical erasing unit being a first type physical unit, sending a first operation command sequence to instruct a rewritable non-volatile memory module to read a first physical programming unit based on a first electronic configuration; and in response to the first physical erasing unit being a second type physical unit, sending a second operation command sequence to instruct the rewritable non-volatile memory module to read the first physical programming unit based on a second electronic configuration. The first electronic configuration is different from the second electronic configuration.

Abstract: Provided is a device for writing image files into memories, which includes a memory and a processor. The memory is configured to store an instruction. The processor is coupled to the memory, a hardware database and a software database. The processor is configured to access and execute the instruction from the memory to: confirm a production condition of a product, wherein the production condition includes a hardware component characteristic and a software component characteristic; generate an image file by comparing the hardware component characteristic with a plurality of hardware characteristic data in the hardware database, and comparing the software component characteristic with a plurality of software characteristic data in the software database; and write the image file into a product flash memory.

Abstract: Example implementations described herein are directed to management of a system comprising a plurality of apparatuses providing unlabeled sensor data, which can involve executing feature extraction on the unlabeled sensor data to generate a plurality of features; executing failure detection by processing the plurality of features with a failure detection model to generate failure detection labels, the failure detection model generated from a machine learning framework that applies supervised machine learning on unsupervised machine learning models generated from unsupervised machine learning; and providing extracted features and the failure detection label to a failure prediction model to generate failure prediction and a sequence of features.