Patents by Inventor Wei Lin

Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210165273
    Abstract: A display device includes a sub-pixel unit, the sub-pixel unit includes: a reflective liquid crystal display unit with a reflective display region, including a liquid crystal layer and a reflective layer; and a electroluminescent display unit with a light-emitting display region, wherein the light-emitting display region is overlapped with the reflective display region; wherein the reflective layer and the electroluminescent display unit are located on both sides of the liquid crystal layer respectively.
    Type: Application
    Filed: December 15, 2017
    Publication date: June 3, 2021
    Inventors: Wei Lin LAI, Guanyin WEN, Zhengyin XU, Chien Pang HUANG
  • Publication number: 20210168842
    Abstract: A method of wireless communication includes receiving, at a communication device, an interrupt indication indicating an interruption to occur on a first transmission resource, interrupting, based on the interrupt indication, a transmission scheduled to occur using a second transmission resource on a channel, where the first transmission resource and the second transmission resource at least partially overlap, and transmitting, in case that the transmission included a control information, the control information, using a third transmission resource.
    Type: Application
    Filed: February 8, 2021
    Publication date: June 3, 2021
    Inventors: Chunli LIANG, Shuqiang XIA, Xianghui HAN, Jing SHI, Min REN, Wei LIN
  • Publication number: 20210167016
    Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 3, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Jr-Wei LIN
  • Publication number: 20210159790
    Abstract: A buck converter includes an output stage, a FCVB control circuit and a driver. The output stage includes a plurality of switches and a flying capacitor, wherein the switches are connected in series, the flying capacitor is coupled between two of the switches, and the output stage is configured to receive an input voltage to generate an output voltage. The FCVB control circuit is configured to compare a voltage of the flying capacitor with half of the input voltage to generate a comparison result, and the FCVB control circuit further responds to the comparison result to generate a first control signal and a second control signal based on a first PWM signal and a second PWM signal. The driver is configured to generate a plurality of diving signals according to the first control signal and the second control signal, wherein the driving signals are arranged to control the switches, respectively.
    Type: Application
    Filed: October 25, 2020
    Publication date: May 27, 2021
    Inventors: Chun-Yen Tseng, Hao-Ping Hong, Chih-Wei Lin
  • Publication number: 20210159756
    Abstract: A motor comprises a housing having a space, a stator including a spool casing arrayed in the space, a rotor containing an axle and a magnet located inside the spool casing, the axle penetrating the magnet and having two ends protruding out of the housing, wherein the axle has two ends respectively allocated with an end-shield bearing integrating with the spool casing and an bottom-plate bearing detachably mounting on the bottom side of the housing in order to improve the concentricity of the motor.
    Type: Application
    Filed: April 23, 2020
    Publication date: May 27, 2021
    Inventors: CHIA-WEI LIN, TSUNG-YU HUNG
  • Publication number: 20210159196
    Abstract: The present disclosure provides an integrated circuit (IC) structure. The IC structure includes a semiconductor substrate; an interconnection structure formed on the semiconductor substrate; and a redistribution layer (RDL) metallic feature formed on the interconnection structure. The RDL metallic feature further includes a barrier layer disposed on the interconnection structure; a diffusion layer disposed on the barrier layer, wherein the diffusion layer includes metal and oxygen; and a metallic layer disposed on the diffusion layer.
    Type: Application
    Filed: February 8, 2021
    Publication date: May 27, 2021
    Inventors: Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin
  • Publication number: 20210156399
    Abstract: A liquid-cooling heat dissipation device including a base and two pumps. The base has a first inlet and a first outlet. The two pumps are disposed on the base and connected to the first inlet and the first outlet in a parallel arrangement.
    Type: Application
    Filed: April 20, 2020
    Publication date: May 27, 2021
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Tsung-Wei LIN, Shui-Fa TSAI
  • Publication number: 20210146163
    Abstract: A neutron capture therapy system includes a neutron generating device and a beam shaping assembly. The neutron capture therapy system further includes a concrete wall accommodating the neutron generating device and the beam shaping assembly and shielding radiations generated by the neutron generating device and the beam shaping assembly, the concrete wall and a reinforcing portion at least partially disposed in the concrete wall are provided to support the beam shaping assembly, and more than 90% of weight of a material of the reinforcing portion is composed of at least one element of C, H, O, N, Si, Al, Mg, Li, B, Mn, Cu, Zn, S, Ca, and Ti. In the neutron capture therapy system, the reinforcing portion disposed in the concrete wall has good anti-activation performance. Therefore, compared with a conventional reinforced concrete structure, the radiation is further attenuated.
    Type: Application
    Filed: January 11, 2021
    Publication date: May 20, 2021
    Inventors: Tao JIANG, Wei-Lin CHEN
  • Publication number: 20210150950
    Abstract: Electronic devices and methods for compensating for aging or other effects in a display during a non-transmitting state (off state) of the display. Sensing may include emissive element sensing of the display and/or thin film transistor sensing of the display. Compensating for the effects may preserve or increase a uniformity of transmission of the display.
    Type: Application
    Filed: August 31, 2018
    Publication date: May 20, 2021
    Inventors: Chin-Wei Lin, Hung Sheng Lin, Hyunsoo Kim, Hyunwoo Nho, Injae Hwang, Jesse A. Richmond, Jie Won Ryu, Junhua Tan, Kavinaath Murugan, Kingsuk Brahma, Shengkui Gao, Shiping Shen, Sun-Il Chang, Myung-Je Cho, Yafei Bi
  • Publication number: 20210153227
    Abstract: Provided are an information transmission method and apparatus, a storage medium and an electronic apparatus. The method includes the following step: a PDSCH traffic with a length of a second TTI is received after an error of receiving a PDSCH traffic with a length of a first TTI is made; where a first transmission unit is supported in the first TTI, a second transmission unit and a third transmission unit are supported in the second TTI, and a transmission unit of the second TTI corresponds to a transmission unit of the first TTI.
    Type: Application
    Filed: April 12, 2019
    Publication date: May 20, 2021
    Inventors: Jing SHI, Shuqiang XIA, Chunli LIANG, Xianghui HAN, Min REN, Wei LIN
  • Publication number: 20210149838
    Abstract: Provided is a device for writing image files into memories, which includes a memory and a processor. The memory is configured to store an instruction. The processor is coupled to the memory, a hardware database and a software database. The processor is configured to access and execute the instruction from the memory to: confirm a production condition of a product, wherein the production condition includes a hardware component characteristic and a software component characteristic; generate an image file by comparing the hardware component characteristic with a plurality of hardware characteristic data in the hardware database, and comparing the software component characteristic with a plurality of software characteristic data in the software database; and write the image file into a product flash memory.
    Type: Application
    Filed: September 23, 2020
    Publication date: May 20, 2021
    Applicant: PEGATRON CORPORATION
    Inventor: Chiang-Wei Lin
  • Patent number: 11011414
    Abstract: A method includes forming a first conductive line and a second conductive line in a dielectric layer, etching a portion of the dielectric layer to form a trench between the first conductive line and the second conductive line, and forming a first etch stop layer. The first etch stop layer extends into the trench. A second etch stop layer is formed over the first etch stop layer. The second etch stop layer extends into the trench, and the second etch stop layer is more conformal than the first etch stop layer. A dielectric material is filled into the trench and over the second etch stop layer. An air gap is formed in the dielectric material.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: May 18, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Hsiang-Wei Lin
  • Publication number: 20210138358
    Abstract: Disclosed is a swirl generator for an evaporator, having: a body that extends along a body-center axis between opposing inlet and outlet ends, and includes: a fluid inlet at the inlet end; an outer surface that, at that the outlet end, defines an outlet region with a curved outer boundary forming a convex curve that extends radially inward from an outer diameter surface of the body to an outer axial surface of the body; a center passage formed within the body that extends from the inlet towards the outlet along the body-center axis; and a swirl passage formed at the outlet end of the body, the swirl passage extending between the center passage and the curved outer boundary along a swirl passage axis, whereby a fluid entering from the inlet exits the body at the curved outer boundary, the swirl passage axis forming an acute angle with the body-center axis.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 13, 2021
    Inventor: Wei-Lin Cho
  • Publication number: 20210134751
    Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.
    Type: Application
    Filed: November 4, 2019
    Publication date: May 6, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Chi-Han CHEN, Chang-Yu LIN, Jr-Wei LIN, Chih-Pin HUNG
  • Publication number: 20210134707
    Abstract: A semiconductor package includes a die attach pad; a plurality of lead terminals disposed around the die attach pad; a semiconductor die mounted on the die attach pad; a molding compound encapsulating the plurality of lead terminals, the semiconductor die, and the die attach pad; and a step cut sawn into the molding compound along a perimeter of a bottom surface of the semiconductor package. The step cut penetrates through an entire thickness of each of the plurality of lead terminals, whereby each of the plurality of lead terminals has at least an exposed outer end at the step cut.
    Type: Application
    Filed: October 14, 2020
    Publication date: May 6, 2021
    Inventors: You-Wei Lin, Chih-Feng Fan
  • Publication number: 20210135024
    Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes a first doped region having a first doping type disposed in a semiconductor substrate. A second doped region having a second doping type different than the first doping type is disposed in the semiconductor substrate and laterally spaced from the first doped region. A waveguide structure is disposed in the semiconductor substrate and laterally between the first doped region and the second doped region. A photodetector is disposed at least partially in the semiconductor substrate and laterally between the first doped region and the second doped region. The waveguide structure is configured to guide one or more photons into the photodetector. The photodetector has an upper surface that continuously arcs between opposite sidewalls of the photodetector. The photodetector has a lower surface that continuously arcs between the opposite sidewalls of the photodetector.
    Type: Application
    Filed: June 24, 2020
    Publication date: May 6, 2021
    Inventors: Chen-Hao Chiang, Shih-Wei Lin, Eugene I-Chun Chen, Yi-Chen Chen
  • Publication number: 20210132462
    Abstract: Various embodiments of the present disclosure are directed towards a modulator device including a first waveguide and a heater structure. An input terminal is configured to receive impingent light. The first waveguide has a first output region and a first input region coupled to the input terminal. A second waveguide is optically coupled to the first waveguide. The second waveguide has a second output region and a second input region coupled to the input terminal. An output terminal is configured to provide outgoing light that is modulated based on the impingent light. The output terminal is coupled to the first output region and the second output region. The heater structure overlies the first waveguide. A bottom surface of the heater structure is aligned with a bottom surface of the first waveguide. The first waveguide is spaced laterally between sidewalls of the heater structure.
    Type: Application
    Filed: January 3, 2020
    Publication date: May 6, 2021
    Inventors: Shih-Wei Lin, Ming Chyi Liu
  • Patent number: 10997836
    Abstract: A security device and a security system are provided. The security system includes the security device. The security device includes a first I/O module and a processing unit. The first I/O module is configured to detect an identification within a detection coverage. The processing unit is configured to: determine that the identification is registered with the security device; set the security device as an unalarmed mode when the identification is enabled within the detection coverage of the first I/O module; and set the security device as an alarmed mode when the identification is disabled within the detection coverage of the first I/O module.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: May 4, 2021
    Assignee: ARTIFICIAL INTELLIGENCE CO., LTD.
    Inventor: Che Wei Lin
  • Patent number: 10997917
    Abstract: A display may have an array of pixels each of which has a light-emitting diode such as an organic light-emitting diode. A drive transistor and an emission transistor may be coupled in series with the light-emitting diode of each pixel between a positive power supply and a ground power supply. The pixels may include first and second switching transistors. A data storage capacitor may be coupled between a gate and source of the drive transistor in each pixel. Signal lines may be provided in columns of pixels to route signals such as data signals, sensed drive currents from the drive transistors, and predetermined voltages between display driver circuitry and the pixels. The switching transistors, emission transistors, and drive transistors may include semiconducting-oxide transistors and silicon transistors and may be n-channel transistors or p-channel transistors.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: May 4, 2021
    Assignee: Apple Inc.
    Inventors: Chin-Wei Lin, Hung Sheng Lin, Shih Chang Chang, Shinya Ono
  • Patent number: 10999728
    Abstract: A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device, and the auxiliary Bluetooth circuit does not sniff packets transmitted from the remote Bluetooth device. But the auxiliary Bluetooth circuit switches from the relay mode to a sniffing mode if the data type of packets transmitted from the remote Bluetooth device changes. In the period during which the auxiliary Bluetooth circuit operates at the sniffing mode, the auxiliary Bluetooth circuit sniffs packets issued from the remote Bluetooth device while the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: May 4, 2021
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yi-Cheng Chen, Kuan-Chung Huang, Chia Chun Hung, Hou Wei Lin