Patents by Inventor Wei Ling Wang

Wei Ling Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11542274
    Abstract: There are provided new heterobifunctional agents designed to mediated formation of protein-protein dimers and promote ubiquitination of a protein of the dimer. Also provided are methods of synthesizing the agents, pharmaceutical formulations including the agents, and methods of using the agents to treat, ameliorate or cure diseases characterized by protein over-expression or malfunction.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: January 3, 2023
    Assignee: Agency for Science, Technology and Research (A*STAR)
    Inventors: Wei Hung, Thomas Hugo Keller, Wei Ling Wang, Gang Wang, Congbao Kang
  • Patent number: 11532533
    Abstract: In an embodiment, a device includes: a processor die including circuit blocks, the circuit blocks including active devices of a first technology node; a power gating die including power semiconductor devices of a second technology node, the second technology node larger than the first technology node; and a first redistribution structure including first metallization patterns, the first metallization patterns including power supply source lines and power supply ground lines, where a first subset of the circuit blocks is electrically coupled to the power supply source lines and the power supply ground lines through the power semiconductor devices, and a second subset of the circuit blocks is permanently electrically coupled to the power supply source lines and the power supply ground lines.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: December 20, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Fong-yuan Chang, Chieh-Yen Chen
  • Publication number: 20220367267
    Abstract: Systems, devices and methods of manufacturing a system on silicon wafer (SoSW) device and package are described herein. A plurality of functional dies is formed in a silicon wafer. Different sets of masks are used to form different types of the functional dies in the silicon wafer. A first redistribution structure is formed over the silicon wafer and provides local interconnects between adjacent dies of the same type and/or of different types. A second redistribution structure may be formed over the first redistribution layer and provides semi-global and/or global interconnects between non-adjacent dies of the same type and/or of different types. An optional backside redistribution structure may be formed over a second side of the silicon wafer opposite the first redistribution layer. The optional backside redistribution structure may provide backside interconnects between functional dies of different types.
    Type: Application
    Filed: July 21, 2022
    Publication date: November 17, 2022
    Inventors: Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Tin-Hao Kuo, Che-Wei Hsu
  • Publication number: 20220359467
    Abstract: In an embodiment, a device includes: a first die array including first integrated circuit dies, orientations of the first integrated circuit dies alternating along rows and columns of the first die array; a first dielectric layer surrounding the first integrated circuit dies, surfaces of the first dielectric layer and the first integrated circuit dies being planar; a second die array including second integrated circuit dies on the first dielectric layer and the first integrated circuit dies, orientations of the second integrated circuit dies alternating along rows and columns of the second die array, front sides of the second integrated circuit dies being bonded to front sides of the first integrated circuit dies by metal-to-metal bonds and by dielectric-to-dielectric bonds; and a second dielectric layer surrounding the second integrated circuit dies, surfaces of the second dielectric layer and the second integrated circuit dies being planar.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 10, 2022
    Inventors: Chen-Hua Yu, Chuei-Tang Wang, Chieh-Yen Chen, Wei Ling Chang
  • Publication number: 20220359333
    Abstract: In an embodiment, a device includes: a processor die including circuit blocks, the circuit blocks including active devices of a first technology node; a power gating die including power semiconductor devices of a second technology node, the second technology node larger than the first technology node; and a first redistribution structure including first metallization patterns, the first metallization patterns including power supply source lines and power supply ground lines, where a first subset of the circuit blocks is electrically coupled to the power supply source lines and the power supply ground lines through the power semiconductor devices, and a second subset of the circuit blocks is permanently electrically coupled to the power supply source lines and the power supply ground lines.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 10, 2022
    Inventors: Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Fong-Yuan Chang, Chieh-Yen Chen
  • Publication number: 20220336431
    Abstract: In an embodiment, a structure includes: a processor device including logic devices; a first memory device directly face-to-face bonded to the processor device by metal-to-metal bonds and by dielectric-to-dielectric bonds; a first dielectric layer laterally surrounding the first memory device; a redistribution structure over the first dielectric layer and the first memory device, the redistribution structure including metallization patterns; and first conductive vias extending through the first dielectric layer, the first conductive vias connecting the metallization patterns of the redistribution structure to the processor device.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Inventors: Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Chieh-Yen Chen
  • Publication number: 20220319922
    Abstract: In an embodiment, a method includes forming a first conductive feature in a first inter-metal dielectric (IMD) layer; depositing a blocking film over and physically contacting the first conductive feature; depositing a first dielectric layer over and physically contacting the first IMD layer; depositing a second dielectric layer over and physically contacting the first dielectric layer; removing the blocking film; depositing an etch stop layer over any physically contacting the first conductive feature and the second dielectric layer; forming a second IMD layer over the etch stop layer; etching an opening in the second IMD layer and the etch stop layer to expose the first conductive feature; and forming a second conductive feature in the opening.
    Type: Application
    Filed: July 9, 2021
    Publication date: October 6, 2022
    Inventors: Cai-Ling Wu, Hsiu-Wen Hsueh, Wei-Ren Wang, Po-Hsiang Huang, Chii-Ping Chen, Jen Hung Wang
  • Patent number: 11434245
    Abstract: The present invention relates to compounds of formula (I), combinations and uses thereof for disease therapy, or a pharmaceutically acceptable salt, solvate or polymorph thereof, including all tautomers and stereoisomers thereof wherein.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: September 6, 2022
    Assignee: Agency for Science, Technology and Research
    Inventors: Jenefer Alam, Soo Yei Ho, Wei Ling Wang, Athisayamani Jeyaraj Duraiswamy
  • Patent number: 11404316
    Abstract: Systems, devices and methods of manufacturing a system on silicon wafer (SoSW) device and package are described herein. A plurality of functional dies is formed in a silicon wafer. Different sets of masks are used to form different types of the functional dies in the silicon wafer. A first redistribution structure is formed over the silicon wafer and provides local interconnects between adjacent dies of the same type and/or of different types. A second redistribution structure may be formed over the first redistribution layer and provides semi-global and/or global interconnects between non-adjacent dies of the same type and/or of different types. An optional backside redistribution structure may be formed over a second side of the silicon wafer opposite the first redistribution layer. The optional backside redistribution structure may provide backside interconnects between functional dies of different types.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: August 2, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Tin-Hao Kuo, Che-Wei Hsu
  • Patent number: 11387222
    Abstract: In an embodiment, a structure includes: a processor device including logic devices; a first memory device directly face-to-face bonded to the processor device by metal-to-metal bonds and by dielectric-to-dielectric bonds; a first dielectric layer laterally surrounding the first memory device; a redistribution structure over the first dielectric layer and the first memory device, the redistribution structure including metallization patterns; and first conductive vias extending through the first dielectric layer, the first conductive vias connecting the metallization patterns of the redistribution structure to the processor device.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: July 12, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Chieh-Yen Chen
  • Publication number: 20210147441
    Abstract: There are provided new heterobifuctional agents designed to mediated formation of protein-protein dimers and promote ubiqutination of a protein of the dimer. Also provided are methods of synthesizing the agents, pharmaceutical formulations including the agents, and methods of using the agents to treat, ameliorate or cure diseases characterized by protein over-expression or malfunction.
    Type: Application
    Filed: September 22, 2020
    Publication date: May 20, 2021
    Inventors: Wei Hung, Thomas Hugo Keller, Wei Ling Wang, Gang Wang, Congbao Kang
  • Publication number: 20210047336
    Abstract: The present invention relates to compounds of formula (I), combinations and uses thereof for disease therapy, or a pharmaceutically acceptable salt, solvate or polymorph thereof, including all tautomers and stereoisomers thereof wherein R1 represents H; optionally substituted alkyl (wherein optional substituents include one or more substituents each independently selected from C1-6alkoxy, NH2, —NHC1-3alkyl and —N(C1-3alkyl)2); —C(O)Oalkyl; haloalkyl; haloalkoxy; or -alkylaryl; each R2 independently represents H; optionally substituted alkyl (wherein optional substituents include one or more substituents each independently selected from C1-6alkoxy, NH2, —NHC1-3alkyl and —N(C1-3alkyl)2); -alkylaryl; optionally substituted carbocyclyl (wherein optional substituents include one or more substituents each independently selected from C1-6alkyl, C1-6alkoxy, C1-6haloalkyl, C1-6haloalkoxy and halo); optionally substituted heterocyclyl (wherein optional substituents include one or more substituents each independentl
    Type: Application
    Filed: October 29, 2020
    Publication date: February 18, 2021
    Applicant: Agency for Science, Technology and Research
    Inventors: Jenefer Alam, Soo Yei Ho, Wei Ling Wang, Athisayamani Jeyaraj Duraiswamy
  • Patent number: 10870653
    Abstract: The present invention relates to compounds of formula (I), combinations and uses thereof for disease therapy, or a pharmaceutically acceptable salt, solvate or polymorph thereof, including all tautomers and stereoisomers thereof wherein each of R1, R2, R3, R4, R5, W, X, Y, Z, and n is as defined herein.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: December 22, 2020
    Assignee: Agency for Science, Technology and Research
    Inventors: Jenefer Alam, Soo Yei Ho, Wei Ling Wang, Athisayamani Jeyaraj Duraiswamy
  • Publication number: 20190185478
    Abstract: The present invention relates to compounds of formula (I), combinations and uses thereof for disease therapy, or a pharmaceutically acceptable salt, solvate or polymorph thereof, including all tautomers and stereoisomers thereof wherein R1 represents H; optionally substituted alkyl (wherein optional substituents include one or more substituents each independently selected from C1-6alkoxy, NH2, —NHC1-3alkyl and —N(C1-3alkyl)2); —C(O)Oalkyl; haloalkyl; haloalkoxy; or -alkylaryl; each R2 independently represents H; optionally substituted alkyl (wherein optional substituents include one or more substituents each independently selected from C1-6alkoxy, NH2, —NHC1-3alkyl and —N(C1-3alkyl)2); -alkylaryl; optionally substituted carbocyclyl (wherein optional substituents include one or more substituents each independently selected from C1-6alkyl, C1-6alkoxy, C1-6haloalkyl, C1-6haloalkoxy and halo); optionally substituted heterocyclyl (wherein optional substituents include one or more substituents each independentl
    Type: Application
    Filed: December 19, 2018
    Publication date: June 20, 2019
    Applicant: Agency for Science, Technology and Research
    Inventors: Jenefer Alam, Soo Yei Ho, Wei Ling Wang, Athisayamani Jeyaraj Duraiswamy
  • Patent number: 10300586
    Abstract: A screw holding and dispensing device includes a casing, a number of elastic members latched on an inner sidewall of the casing, and a pressing member received by the elastic member. Each elastic member carries a screw, to release a screw, an external force is applied on the pressing member, the pressing member is driven to move out of the top elastic member, the pressing member moves down and drives out the lowermost screw from the bottom elastic member, and the screw slides into a corresponding screw hole.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: May 28, 2019
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Wei-Ling Wang
  • Patent number: 10189842
    Abstract: The present invention relates to dihydropyrazolo[1,5-a]pyrimidine compounds of formula I, defined herein, as WNT pathways modulators, processes for making them, and pharmaceutical compositions comprising them. Methods of treatment of conditions mediated by WNT pathway signalling including cancer, fibrosis, stem cell and diabetic retinopathy, rheumatoid arthritis, psoriasis and myocardial infarction, comprising the compounds of formula I are also provided.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: January 29, 2019
    Assignee: Agency for Science, Technology and Research
    Inventors: Jenefer Alam, Soo Yei Ho, Wei Ling Wang, Athisayamani Jeyaraj Duraiswamy
  • Patent number: 9981964
    Abstract: The present invention relates to compounds of formula (I), combinations and uses thereof for disease therapy, or a pharmaceutically acceptable salt, solvate or polymorph thereof, including all tautomers and stereoisomers thereof wherein R1 represents optionally substituted alkyl (wherein optional substituents include one or more substituents each independently selected from C1-6alkoxy); optionally substituted carbocyclyl (wherein optional substituents include one or more substituents each independently selected from C1-6alkyl, C1-6alkoxy, C1-6haloalkyl, C1-6haloalkoxy and halo); or -alkylaryl; R2 represents H; or alkyl; R3 represents H; or alkyl; U, V and W represent —(CH2)—; or U and V together represent —CH?CH— and W represents C?O; Y represents aryl; heteroaryl; optionally substituted carbocyclyl (wherein optional substituents include one or more substituents each independently selected from C1-6alkyl, C1-6alkoxy, C1-6haloalkyl, C1-6haloalkoxy and halo); or optionally substituted heterocyclyl (wherein opti
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: May 29, 2018
    Assignee: Agency for Science, Technology and Research
    Inventors: Jenefer Alam, Anders Poulsen, Soo Yei Ho, Wei Ling Wang, Athisayamani Jeyaraj Duraiswamy
  • Publication number: 20180093988
    Abstract: The present invention relates to dihydropyrazolo[1,5-a]pyrimidine compounds of formula I, defined herein, as WNT pathways modulators, processes for making them, and pharmaceutical compositions comprising them. Methods of treatment of conditions mediated by WNT pathway signalling including cancer, fibrosis, stem cell and diabetic retinopathy, rheumatoid arthritis, psoriasis and myocardial infarction, comprising the compounds of formula I are also provided.
    Type: Application
    Filed: December 17, 2014
    Publication date: April 5, 2018
    Applicant: Agency for Science, Technolgy and Research
    Inventors: Jenefer Alam, Soo Yei Ho, Wei Ling Wang, Athisayamani Jeyaraj Duraiswamy
  • Publication number: 20170341207
    Abstract: A screw holding and dispensing device includes a casing, a number of elastic members latched on an inner sidewall of the casing, and a pressing member received by the elastic member. Each elastic member carries a screw, to release a screw, an external force is applied on the pressing member, the pressing member is driven to move out of the top elastic member, the pressing member moves down and drives out the lowermost screw from the bottom elastic member, and the screw slides into a corresponding screw hole.
    Type: Application
    Filed: May 26, 2017
    Publication date: November 30, 2017
    Inventor: WEI-LING WANG
  • Publication number: 20170240550
    Abstract: The present invention relates to dihydropyrazolo[1,5-a]pyrimidine compounds of formula I, defined herein, as WNT pathways modulators, processes for making them, and pharmaceutical compositions comprising them. Methods of treatment of conditions mediated by WNT pathway signalling including cancer, fibrosis, stem cell and diabetic retinopathy, rheumatoid arthritis, psoriasis and myocardial infarction, comprising the compounds of formula I are also provided.
    Type: Application
    Filed: December 17, 2014
    Publication date: August 24, 2017
    Applicant: Agency for Science, Technolgy and Research
    Inventors: Jenefer Alam, Soo Yei Ho, Wei Ling Wang, Athisayamani Jeyaraj Duraiswamy