Abstract: An image sensor package with low light-sensing noise has a chip body having a photosensitive area and non-sensitive area. The photosensitive area includes a photosensitive layer having a plurality of photosensitive units. A color filter is disposed on the photosensitive layer and has a plurality of filter units corresponding to the photosensitive units and a black matrix. A black adhesive layer is disposed on the non-sensitive area for mounting a glass cover. A gap is kept between the glass cover and the first surface of the chip body. When an incident light passes through the glass cover and emits to the photosensitive area, the black matrix absorbs the light traveling through the filter unit toward the photosensitive units adjacent to the filter unit. Furthermore, a light emitting to the non-sensitive area can be absorbed by the black adhesive layer. Thus, a light-sensing noise of the chip can be effectively decreased.