Abstract: The disclosed technology is generally directed to a distributed query-and-command system. In one example of the technology, in a trusted execution environment (TEE) of a first node, database code of the first node and distributed ledger code of the first node is executed, such that execution of the distributed ledger code of the first node instantiates a first instance of a distributed ledger of a consortium blockchain, and such that execution of the query-and-command code of the first node instantiates a first instance of a query-and-command system. The consortium blockchain is distributed among a plurality of nodes, and the query-and-command system is distributed among the plurality of nodes. A first transaction that is associated with modifying the query-and-command system is received. The first transaction is executed. Changes associated with the first transaction to the distributed ledger are persisted.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A laser welding method for steel plates and a profile steel welded by laser welding are disclosed. The laser welding method comprises the following steps of connecting a first steel plate and a second steel plate to form a joint; and using a laser to weld the joint to form a profile steel. The laser has a laser power between 10,000 and 25,000 watts. A weld bead is formed at the joint. The weld bead has a weld depth and a weld width. The ratio of the weld depth to the weld width is between 1 and 5. Thus, the process can be simplified effectively, the welding time can be shortened, and the processing area can be reduced.

Abstract: The disclosed technology is generally directed to a distributed query-and-command system. In one example of the technology, in a trusted execution environment (TEE) of a first node, database code of the first node and distributed ledger code of the first node is executed, such that execution of the distributed ledger code of the first node instantiates a first instance of a distributed ledger of a consortium blockchain, and such that execution of the query-and-command code of the first node instantiates a first instance of a query-and-command system. The consortium blockchain is distributed among a plurality of nodes, and the query-and-command system is distributed among the plurality of nodes. A first transaction that is associated with modifying the query-and-command system is received. The first transaction is executed. Changes associated with the first transaction to the distributed ledger are persisted.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: The disclosed technology is generally directed to a distributed query-and-command system. In one example of the technology, in a trusted execution environment (TEE) of a first node, database code of the first node and distributed ledger code of the first node is executed, such that execution of the distributed ledger code of the first node instantiates a first instance of a distributed ledger of a consortium blockchain, and such that execution of the query-and-command code of the first node instantiates a first instance of a query-and-command system. The consortium blockchain is distributed among a plurality of nodes, and the query-and-command system is distributed among the plurality of nodes. A first transaction that is associated with modifying the query-and-command system is received. The first transaction is executed. Changes associated with the first transaction to the distributed ledger are persisted.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A medium passage switching mechanism disposed on a casing of an image forming device, includes a medium tray, a guiding component and a resilient component. An entrance passage, a first exit passage and a second exit passage are formed inside the casing. The medium tray is pivoted to the casing and can pivot between a first position and a second position. The guiding component is pivoted to the casing and can pivot between a third position and a fourth position. The resilient component abuts against the guiding component and the casing. When the medium tray pivots between the first position and the second position, the guiding component can be driven by cooperation of the resilient component and the medium tray to pivot between the third position and the fourth position for guiding a medium to enter into the first exit passage or the second exit passage from the entrance passage.

Abstract: A medium passage switching mechanism disposed on a casing of an image forming device, includes a medium tray, a guiding component and a linking component. An entrance passage, a first exit passage and a second exit passage are formed inside the casing. The medium tray is pivoted to the casing. The guiding component is pivoted to the casing. The linking component is a one-piece structure and movably connected to the medium tray and the guiding component. When the medium tray pivots relative to the casing, the medium tray drives the linking component to drive the guiding component to pivot relative to the casing, so that the guiding component can guide a medium to enter into the first exit passage or the second exit passage selectively from the entrance passage.

Abstract: An image forming device with a collapsible paper guide is provided. The image forming device includes a casing, a first tray structure and a paper guide. A medium gateway opening is formed on the casing. The first tray structure is disposed on the casing and adjacent to the medium gateway opening. The paper guide includes a first base disposed on the first tray structure and a first guiding component pivotally connected to the first base. The paper guide is switchable relative to the first tray structure between a used position and a stored position. A first included angle included between the first guiding component and the first base is less than 90 degrees when the paper guide is located at the used position, so that the first guiding component can be interfered and driven to pivotally fold for preventing the paper guide from being broken or damaged.

Abstract: A method includes forming a first metal mesh over a carrier, forming a first dielectric layer over the first metal mesh, and forming a second metal mesh over the first dielectric layer. The first metal mesh and the second metal mesh are staggered. The method further includes forming a second dielectric layer over the second metal mesh, attaching a device die over the second dielectric layer, with the device die overlapping the first metal mesh and the second metal mesh, encapsulating the device die in an encapsulant, and forming redistribution lines over and electrically connecting to the device die.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A medium passage switching mechanism disposed on a casing of an image forming device, includes a medium tray, a guiding component and a resilient component. An entrance passage, a first exit passage and a second exit passage are formed inside the casing. The medium tray is pivoted to the casing and can pivot between a first position and a second position. The guiding component is pivoted to the casing and can pivot between a third position and a fourth position. The resilient component abuts against the guiding component and the casing. When the medium tray pivots between the first position and the second position, the guiding component can be driven by cooperation of the resilient component and the medium tray to pivot between the third position and the fourth position for guiding a medium to enter into the first exit passage or the second exit passage from the entrance passage.

Abstract: A medium passage switching mechanism disposed on a casing of an image forming device, includes a medium tray, a guiding component and a linking component. An entrance passage, a first exit passage and a second exit passage are formed inside the casing. The medium tray is pivoted to the casing. The guiding component is pivoted to the casing. The linking component is a one-piece structure and movably connected to the medium tray and the guiding component. When the medium tray pivots relative to the casing, the medium tray drives the linking component to drive the guiding component to pivot relative to the casing, so that the guiding component can guide a medium to enter into the first exit passage or the second exit passage selectively from the entrance passage.

Abstract: An image forming device with a collapsible paper guide is provided. The image forming device includes a casing, a first tray structure and a paper guide. A medium gateway opening is formed on the casing. The first tray structure is disposed on the casing and adjacent to the medium gateway opening. The paper guide includes a first base disposed on the first tray structure and a first guiding component pivotally connected to the first base. The paper guide is switchable relative to the first tray structure between a used position and a stored position. A first included angle included between the first guiding component and the first base is less than 90 degrees when the paper guide is located at the used position, so that the first guiding component can be interfered and driven to pivotally fold for preventing the paper guide from being broken or damaged.

Abstract: A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.

Abstract: A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.

Abstract: An image-based object tracking system including a photographic device and a computing equipment is provided. The photographic device captures a first image of a scene at a first time and a second image of the scene at a second time subsequent to the first time. The computing equipment determines an area of the scene in the first and second images, which includes a midline of the scene in the first and second images, overlaps the first and second images for determining whether a distance between a first object in the first image and a second object in the second image is less than a predetermined threshold in response to the first object being in the area and the second object not being in the area, and updates an entry object count or an exit object count in response to the distance being less than the predetermined threshold.