Patents by Inventor Wei-Lun Tsai

Wei-Lun Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11944412
    Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: April 2, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Ying-Lun Chang, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee, Chun-Yi Kuo, Tsung-I Lin
  • Patent number: 11922844
    Abstract: An integrated driving device is provided. The integrated driving device includes a touch sensing circuit and an optical sensing circuit. The touch sensing circuit is configured to perform touch sensing in a plurality of touch sensing periods during a first frame period. The optical sensing circuit is configured to perform optical sensing during at least one optical sensing period during the first frame period to obtain optical sensing signals for generating first ambient light information. The touch sensing periods and the optical sensing period are non-overlapping. Correspondingly, an operation method of an integrated driving device is also provided.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: March 5, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventors: Wei-Lun Shih, Wu-Wei Lin, Jiun-Jie Tsai, Huang-Chin Tang, Ching-Chun Lin
  • Publication number: 20240037092
    Abstract: The disclosed technology is generally directed to a distributed query-and-command system. In one example of the technology, in a trusted execution environment (TEE) of a first node, database code of the first node and distributed ledger code of the first node is executed, such that execution of the distributed ledger code of the first node instantiates a first instance of a distributed ledger of a consortium blockchain, and such that execution of the query-and-command code of the first node instantiates a first instance of a query-and-command system. The consortium blockchain is distributed among a plurality of nodes, and the query-and-command system is distributed among the plurality of nodes. A first transaction that is associated with modifying the query-and-command system is received. The first transaction is executed. Changes associated with the first transaction to the distributed ledger are persisted.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 1, 2024
    Inventors: Ronald John Kamiel Euphrasia BJONES, Wei-Lun TSAI, Mark Eugene RUSSINOVICH, Sylvan W. CLEBSCH, Amaury Pierre Paul CHAMAYOU
  • Patent number: 11855006
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Patent number: 11827477
    Abstract: A medium passage switching mechanism disposed on a casing of an image forming device, includes a medium tray, a guiding component and a resilient component. An entrance passage, a first exit passage and a second exit passage are formed inside the casing. The medium tray is pivoted to the casing and can pivot between a first position and a second position. The guiding component is pivoted to the casing and can pivot between a third position and a fourth position. The resilient component abuts against the guiding component and the casing. When the medium tray pivots between the first position and the second position, the guiding component can be driven by cooperation of the resilient component and the medium tray to pivot between the third position and the fourth position for guiding a medium to enter into the first exit passage or the second exit passage from the entrance passage.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: November 28, 2023
    Assignee: AVISION INC.
    Inventors: Wei-Lun Tsai, Min-Hao Chang
  • Patent number: 11827483
    Abstract: A medium passage switching mechanism disposed on a casing of an image forming device, includes a medium tray, a guiding component and a linking component. An entrance passage, a first exit passage and a second exit passage are formed inside the casing. The medium tray is pivoted to the casing. The guiding component is pivoted to the casing. The linking component is a one-piece structure and movably connected to the medium tray and the guiding component. When the medium tray pivots relative to the casing, the medium tray drives the linking component to drive the guiding component to pivot relative to the casing, so that the guiding component can guide a medium to enter into the first exit passage or the second exit passage selectively from the entrance passage.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: November 28, 2023
    Assignee: AVISION INC.
    Inventor: Wei-Lun Tsai
  • Patent number: 11673412
    Abstract: An image forming device with a collapsible paper guide is provided. The image forming device includes a casing, a first tray structure and a paper guide. A medium gateway opening is formed on the casing. The first tray structure is disposed on the casing and adjacent to the medium gateway opening. The paper guide includes a first base disposed on the first tray structure and a first guiding component pivotally connected to the first base. The paper guide is switchable relative to the first tray structure between a used position and a stored position. A first included angle included between the first guiding component and the first base is less than 90 degrees when the paper guide is located at the used position, so that the first guiding component can be interfered and driven to pivotally fold for preventing the paper guide from being broken or damaged.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: June 13, 2023
    Assignee: AVISION INC.
    Inventors: Wei-Lun Tsai, Min-Hao Chang
  • Publication number: 20230154764
    Abstract: A method includes forming a first metal mesh over a carrier, forming a first dielectric layer over the first metal mesh, and forming a second metal mesh over the first dielectric layer. The first metal mesh and the second metal mesh are staggered. The method further includes forming a second dielectric layer over the second metal mesh, attaching a device die over the second dielectric layer, with the device die overlapping the first metal mesh and the second metal mesh, encapsulating the device die in an encapsulant, and forming redistribution lines over and electrically connecting to the device die.
    Type: Application
    Filed: March 21, 2022
    Publication date: May 18, 2023
    Inventors: Tzu-Sung Huang, Tsung-Hsien Chiang, Ming Hung Tseng, Hao-Yi Tsai, Yu-Hsiang Hu, Chih-Wei Lin, Lipu Kris Chuang, Wei Lun Tsai, Kai-Ming Chiang, Ching Yao Lin, Chao-Wei Li, Ching-Hua Hsieh
  • Publication number: 20230035212
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: July 29, 2021
    Publication date: February 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20220177243
    Abstract: A medium passage switching mechanism disposed on a casing of an image forming device, includes a medium tray, a guiding component and a linking component. An entrance passage, a first exit passage and a second exit passage are formed inside the casing. The medium tray is pivoted to the casing. The guiding component is pivoted to the casing. The linking component is a one-piece structure and movably connected to the medium tray and the guiding component. When the medium tray pivots relative to the casing, the medium tray drives the linking component to drive the guiding component to pivot relative to the casing, so that the guiding component can guide a medium to enter into the first exit passage or the second exit passage selectively from the entrance passage.
    Type: Application
    Filed: September 13, 2021
    Publication date: June 9, 2022
    Applicant: AVISION INC.
    Inventor: Wei-Lun Tsai
  • Publication number: 20220177254
    Abstract: A medium passage switching mechanism disposed on a casing of an image forming device, includes a medium tray, a guiding component and a resilient component. An entrance passage, a first exit passage and a second exit passage are formed inside the casing. The medium tray is pivoted to the casing and can pivot between a first position and a second position. The guiding component is pivoted to the casing and can pivot between a third position and a fourth position. The resilient component abuts against the guiding component and the casing. When the medium tray pivots between the first position and the second position, the guiding component can be driven by cooperation of the resilient component and the medium tray to pivot between the third position and the fourth position for guiding a medium to enter into the first exit passage or the second exit passage from the entrance passage.
    Type: Application
    Filed: September 14, 2021
    Publication date: June 9, 2022
    Applicant: AVISION INC.
    Inventors: Wei-Lun Tsai, Min-Hao Chang
  • Publication number: 20220072880
    Abstract: An image forming device with a collapsible paper guide is provided. The image forming device includes a casing, a first tray structure and a paper guide. A medium gateway opening is formed on the casing. The first tray structure is disposed on the casing and adjacent to the medium gateway opening. The paper guide includes a first base disposed on the first tray structure and a first guiding component pivotally connected to the first base. The paper guide is switchable relative to the first tray structure between a used position and a stored position. A first included angle included between the first guiding component and the first base is less than 90 degrees when the paper guide is located at the used position, so that the first guiding component can be interfered and driven to pivotally fold for preventing the paper guide from being broken or damaged.
    Type: Application
    Filed: August 24, 2021
    Publication date: March 10, 2022
    Applicant: AVISION INC.
    Inventors: Wei-Lun Tsai, Min-Hao Chang
  • Patent number: 11257795
    Abstract: A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: February 22, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Tien-Yu Lee, Chih-Yuan Chen, Wei-Lun Tsai, Chien-Tung Huang, Wei-Hsun Hsu, Wei-Chien Hung
  • Publication number: 20200235079
    Abstract: A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.
    Type: Application
    Filed: December 18, 2019
    Publication date: July 23, 2020
    Inventors: TIEN-YU LEE, CHIH-YUAN CHEN, WEI-LUN TSAI, CHIEN-TUNG HUANG, WEI-HSUN HSU, WEI-CHIEN HUNG
  • Patent number: 10679357
    Abstract: An image-based object tracking system including a photographic device and a computing equipment is provided. The photographic device captures a first image of a scene at a first time and a second image of the scene at a second time subsequent to the first time. The computing equipment determines an area of the scene in the first and second images, which includes a midline of the scene in the first and second images, overlaps the first and second images for determining whether a distance between a first object in the first image and a second object in the second image is less than a predetermined threshold in response to the first object being in the area and the second object not being in the area, and updates an entry object count or an exit object count in response to the distance being less than the predetermined threshold.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: June 9, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chen-Chung Lee, Chia-Hung Lin, Ming-Jen Chen, Ching-Wen Lin, Wei-Lun Tsai, Jui-Sen Tuan, You-Dian Lin
  • Publication number: 20200176648
    Abstract: A light emitting package structure includes: a light emitting chip, an encapsulant covering the light emitting chip and having an anti-adhesion upper surface and an anti-adhesion surrounding surface. A method of manufacturing a light emitting package structure is further provided and includes: configuring a plurality of light emitting chips on a temporary carrier; forming an encapsulant to cover the plurality of light emitting chips; cutting the encapsulant to form the independent light emitting package structure; and surface treating the cut encapsulant such that the encapsulant has an anti-adhesion upper surface and an anti-adhesion surrounding surface.
    Type: Application
    Filed: October 4, 2019
    Publication date: June 4, 2020
    Inventors: CHIH-YUAN CHEN, TIEN-YU LEE, CHIEN-TUNG HUANG, WEI-LUN TSAI
  • Publication number: 20200020110
    Abstract: An image-based object tracking system including a photographic device and a computing equipment is provided. The photographic device captures a first image of a scene at a first time and a second image of the scene at a second time subsequent to the first time. The computing equipment determines an area of the scene in the first and second images, which includes a midline of the scene in the first and second images, overlaps the first and second images for determining whether a distance between a first object in the first image and a second object in the second image is less than a predetermined threshold in response to the first object being in the area and the second object not being in the area, and updates an entry object count or an exit object count in response to the distance being less than the predetermined threshold.
    Type: Application
    Filed: October 25, 2018
    Publication date: January 16, 2020
    Inventors: Chen-Chung Lee, Chia-Hung Lin, Ming-Jen Chen, Ching-Wen Lin, Wei-Lun Tsai, Jui-Sen Tuan, You-Dian Lin
  • Publication number: 20190331047
    Abstract: A vehicle throttle locking circuit and method are provided. A control unit receives detection voltages from a pedal sensor and, when a clamping actuation signal is ON, digital clamping voltages are gradually reduced according to the detection voltages. A D/A conversion unit converts the digital clamping voltages to analog clamping voltages. A variable voltage clamping unit clamps the detection voltages according to the analog clamping voltages. The gradual reduction of the digital clamping voltages are stopped when the detection voltages are already clamped at an idle condition so that the pedal is effectively locked at the idle condition. As such, the present invention not only provides anti-theft function, but also avoids traffic accident and hazard to the safety of the driver or passers due to the vehicle's sudden loss of power.
    Type: Application
    Filed: July 10, 2019
    Publication date: October 31, 2019
    Inventor: William Wei-Lun Tsai
  • Patent number: 10075344
    Abstract: A dynamic resource management method for remote management of resources of resources devices by a cloud server is provided. The method includes: detecting resource-using-statuses of the resource devices to generate using-load parameters for the resources devices according to the resource-using-statuses of the resources devices by control devices installed on the resources devices; timely collecting, by the cloud server, the using-load parameters for the resources devices outputted by the control devices via a network; and upon receiving a using request corresponding to the resources devices from at least one smart device, performing, by the cloud server, a comparison according to the using-load parameters for the resources devices and the using request and performing resource using distribution on the resources devices to obtain resource-use planning based on the comparison result, thereby controlling the operation of the resource devices and replying to the using request of the smart device.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: September 11, 2018
    Assignee: QUANTA COMPUTER INC.
    Inventors: Tien-Chin Fang, Chen-Chung Lee, Ping-Chi Lai, Chia-Hung Lin, Ming-Jen Chen, Wei-Lun Tsai
  • Publication number: 20170126504
    Abstract: A dynamic resource management method for remote management of resources of resources devices by a cloud server is provided. The method includes: detecting resource-using-statuses of the resource devices to generate using-load parameters for the resources devices according to the resource-using-statuses of the resources devices by control devices installed on the resources devices; timely collecting, by the cloud server, the using-load parameters for the resources devices outputted by the control devices via a network; and upon receiving a using request corresponding to the resources devices from at least one smart device, performing, by the cloud server, a comparison according to the using-load parameters for the resources devices and the using request and performing resource using distribution on the resources devices to obtain resource-use planning based on the comparison result, thereby controlling the operation of the resource devices and replying to the using request of the smart device.
    Type: Application
    Filed: February 1, 2016
    Publication date: May 4, 2017
    Inventors: Tien-Chin FANG, Chen-Chung LEE, Ping-Chi LAI, Chia-Hung LIN, Ming-Jen CHEN, Wei-Lun TSAI