Patents by Inventor Wei-Lun Wang

Wei-Lun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250028151
    Abstract: An optical element driving mechanism is provided, including a fixed part, a movable part, a metallic member and a driving assembly. The fixed part includes a base. The movable part is movably connected to the fixed part, and carries an optical element, the optical element has an optical axis. The metallic member is disposed on the base, and includes an inner electrical connection part and an outer electrical connection part, the inner electrical connection part and the outer electrical connection part are connected to each other. The driving assembly includes at least one driving magnetic element and drives the movable part to move relative to the fixed part.
    Type: Application
    Filed: October 9, 2024
    Publication date: January 23, 2025
    Inventors: Chien-Lun HUANG, Shao-Chung CHANG, Wei-Cheng WANG, Che-Hsiang CHIU, Fu-Yuan WU, Shou-Jen LIU
  • Patent number: 12048122
    Abstract: A power module and a power device are provided. The power device includes two screws, a heat dissipation components and a power module. The power module includes a substrate, a package body and two fixing structures. Each fixing structure includes a first through hole, two second through holes, an annular structure and two sinking structures. When the power module is fixed to the heat dissipation component, each sinking structure is bent toward the heat dissipation component, and each annular structure is fixed to the flat surface of the heat dissipation component by the screws. The heat dissipation surface of the substrate can be flatly attached to the flat surface of the heat dissipation component through the two fixed structures, so that the heat energy generated during the operation of the power module can be transferred out through the heat dissipation component.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: July 23, 2024
    Assignee: NIKO SEMICONDUCTOR CO., LTD.
    Inventors: Chung-Ming Leng, Chih-Cheng Hsieh, Wei-Lun Wang
  • Publication number: 20240224414
    Abstract: A circuit board includes a substrate and a first metal circuit layer. The substrate has an upper surface and a lower surface opposite to the upper surface. The first metal circuit layer is located on the upper surface, and the first metal circuit layer includes a first line area and a second line area. The first line area and the second line area are separated by a groove area, and the groove area includes a bent section. Accordingly, the risk of detachment between the first metal circuit layer and the substrate due to stress concentration on the circuit board can be reduced.
    Type: Application
    Filed: June 8, 2023
    Publication date: July 4, 2024
    Inventors: CHUNG-MING LENG, CHIH-CHENG HSIEH, Wei-Lun Wang, PIN-RUI HUANG
  • Publication number: 20230369163
    Abstract: A power module package is provided. The power module package includes an electronic assembly that includes a substrate and a power device group. The substrate includes an insulating layer, a circuit pattern layer, and a conductive heat-dissipating layer. The circuit pattern layer and the conductive heat-dissipating layer are respectively disposed at two opposite sides of the insulating layer. The power device group is disposed on the circuit pattern layer, and the power device group and the circuit pattern layer are configured to form a common circuit. A total area of the conductive heat-dissipating layer is greater than that of the circuit pattern layer, and a thickness of the circuit pattern layer is greater than that of the insulating layer.
    Type: Application
    Filed: December 21, 2022
    Publication date: November 16, 2023
    Inventors: Hui-Chiang Yang, CHUNG-MING LENG, CHIH-CHENG HSIEH, Wei-Lun Wang
  • Publication number: 20230369186
    Abstract: A power module package is provided. The power module package includes an electronic assembly, a first terminal assembly and a second terminal assembly. The electronic assembly at least includes a substrate. The first terminal assembly includes a first power device terminal, and the second terminal assembly includes a second power device terminal. The first power device terminal and the second power device terminal respectively extend from different surfaces of the substrate to form a height difference therebetween. The first power device terminal includes a first contact section and a first non-contact section. The first contact section is directly connected to the substrate, and the first non-contact section is not in contact with the substrate. The substrate protrudes from the first contact section and extends to a position under the first non-contact section.
    Type: Application
    Filed: December 21, 2022
    Publication date: November 16, 2023
    Inventors: Hui-Chiang Yang, CHUNG-MING LENG, CHIH-CHENG HSIEH, Wei-Lun Wang
  • Publication number: 20230225087
    Abstract: A power module and a power device are provided. The power device includes two screws, a heat dissipation components and a power module. The power module includes a substrate, a package body and two fixing structures. Each fixing structure includes a first through hole, two second through holes, an annular structure and two sinking structures. When the power module is fixed to the heat dissipation component, each sinking structure is bent toward the heat dissipation component, and each annular structure is fixed to the flat surface of the heat dissipation component by the screws. The heat dissipation surface of the substrate can be flatly attached to the flat surface of the heat dissipation component through the two fixed structures, so that the heat energy generated during the operation of the power module can be transferred out through the heat dissipation component.
    Type: Application
    Filed: September 9, 2022
    Publication date: July 13, 2023
    Inventors: Chung-Ming LENG, Chih-Cheng HSIEH, Wei-Lun Wang
  • Patent number: 10591688
    Abstract: An optical device package includes: (1) a waveguide, the waveguide including: a main body; and multiple forks, wherein each of the plurality of forks has a tapering end and is extended from the main body, and wherein each of the tapering ends of the forks includes a facet for receiving light; and (2) an optical fiber having a surface configured to output the light into the waveguide; wherein a lateral distance between the surface of the optical fiber and at least one of the facets is less than about 25 micrometers (?m).
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: March 17, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Mei-Ju Lu, Tai-Hsuan Tu, Yi-Min Chin, Wei Lun Wang, Jia-Hao Zhang
  • Publication number: 20190204514
    Abstract: An optical device package includes: (1) a waveguide, the waveguide including: a main body; and multiple forks, wherein each of the plurality of forks has a tapering end and is extended from the main body, and wherein each of the tapering ends of the forks includes a facet for receiving light; and (2) an optical fiber having a surface configured to output the light into the waveguide; wherein a lateral distance between the surface of the optical fiber and at least one of the facets is less than about 25 micrometers (?m).
    Type: Application
    Filed: March 11, 2019
    Publication date: July 4, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Tai-Hsuan TU, Yi-Min CHIN, Wei Lun WANG, Jia-Hao ZHANG
  • Patent number: 10268002
    Abstract: A waveguide includes a first layer and a second layer. The first layer comprises a material of a first refractive index. The second layer is surrounded by the first layer and comprises a material of a second refractive index greater than the first refractive index. The second layer comprises a main body, a first fork and a second fork. The main body has a first substantially constant thickness. The first fork is extended from the main body and has a first tapering end exposed by the first layer. The first fork has the first substantially constant thickness. The second fork is extended from the main body and has a second tapering end exposed by the first layer. The second fork has the first substantially constant thickness.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: April 23, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Mei-Ju Lu, Tai-Hsuan Tu, Yi-Min Chin, Wei Lun Wang, Jia-Hao Zhang
  • Publication number: 20180348454
    Abstract: A waveguide includes a first layer and a second layer. The first layer comprises a material of a first refractive index. The second layer is surrounded by the first layer and comprises a material of a second refractive index greater than the first refractive index. The second layer comprises a main body, a first fork and a second fork. The main body has a first substantially constant thickness. The first fork is extended from the main body and has a first tapering end exposed by the first layer. The first fork has the first substantially constant thickness. The second fork is extended from the main body and has a second tapering end exposed by the first layer. The second fork has the first substantially constant thickness.
    Type: Application
    Filed: June 6, 2017
    Publication date: December 6, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Tai-Hsuan TU, Yi-Min CHIN, Wei Lun WANG, Jia-Hao ZHANG
  • Patent number: 10025033
    Abstract: The present disclosure relates to an optical fiber structure, an optical communication apparatus and a manufacturing process for manufacturing the same. The optical fiber structure includes a core portion and a cladding portion. The cladding portion encloses the core portion, and includes a light reflection surface and a light incident surface. The light reflection surface is inclined at an angle of about 30 degrees to about 60 degrees with respect to the core portion, and the light incident surface is substantially flat and is substantially parallel with the core portion.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: July 17, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei Lun Wang, Yi-Min Chin, Mei-Ju Lu, Jia-Hao Zhang
  • Publication number: 20180052281
    Abstract: A substrate for a semiconductor device includes a polymer material filling at least one through hole extending through the substrate. and at least one optical waveguide disposed within the through hole and extending through the polymer material. A refractive index of the optical waveguide is greater than a refractive index of the polymer material.
    Type: Application
    Filed: August 16, 2016
    Publication date: February 22, 2018
    Inventors: Hung-Chun KUO, Wei Lun WANG
  • Publication number: 20170254956
    Abstract: The present disclosure relates to an optical fiber structure, an optical communication apparatus and a manufacturing process for manufacturing the same. The optical fiber structure includes a core portion and a cladding portion. The cladding portion encloses the core portion, and includes a light reflection surface and a light incident surface. The light reflection surface is inclined at an angle of about 30 degrees to about 60 degrees with respect to the core portion, and the light incident surface is substantially flat and is substantially parallel with the core portion.
    Type: Application
    Filed: March 1, 2016
    Publication date: September 7, 2017
    Inventors: Wei Lun WANG, Yi-Min CHIN, Mei-Ju LU, Jia-Hao ZHANG
  • Publication number: 20140159100
    Abstract: A patterned substrate comprises a substrate body and a plurality of solid patterns disposed on the substrate body. The pitch of at least a part of the adjacent solid patterns is between 1.5 ?m and 2.5 ?m, the space of at least a part of the adjacent solid patterns is between 0.1 ?m and 0.7 ?m, and the height of at least a part of the solid patterns is between 0.7 ?m and 1.7 ?m. An electro-optical semiconductor element containing the patterned substrate is also disclosed.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 12, 2014
    Applicant: Lucemitek Co., Ltd.
    Inventors: Cheng-Yu CHIU, Chun-Yi LEE, Chun-Hung CHEN, Chih-An CHEN, Wei-Lun WANG
  • Publication number: 20140159060
    Abstract: A patterned substrate includes a substrate body and a plurality of solid patterns. The solid patterns are set on the substrate body, and at least partial pitches between the solid patterns are different.
    Type: Application
    Filed: December 12, 2013
    Publication date: June 12, 2014
    Applicant: LUCEMITEK CO., LTD.
    Inventors: Cheng-Yu CHIU, Chun-Yi LEE, Chun-Hung CHEN, Chih-An CHEN, Wei-Lun WANG
  • Publication number: 20120212147
    Abstract: The present invention is to provide a flyback energy converter comprising a transformer having a primary winding, a secondary winding and an auxiliary winding, a load electrically connected with the secondary winding, a switch serially connected with the primary winding and a primary controlling circuit. The primary controlling circuit comprises a voltage measurement terminal and a switch controlling terminal. The voltage measurement terminal measures an output voltage wave provided from the auxiliary winding to get a part of times in the part of the output voltage wave, so as to enlarge the part of times to a total time. According to a predetermined timing transferred from the total time, the switch controlling terminal controls the switch.
    Type: Application
    Filed: February 17, 2012
    Publication date: August 23, 2012
    Applicant: ANWELL SEMICONDUCTOR CORP.
    Inventors: Chun-Chien Kuo, Shao-Wei Chiu, Ke-Horng Chen, Wei-Lun Wang