Patents by Inventor Wei Meng Pee

Wei Meng Pee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170290212
    Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one cavity extending from the second major surface toward the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.
    Type: Application
    Filed: June 19, 2017
    Publication date: October 5, 2017
    Inventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin II Agacaoili Narag, Siang Sin Foo, Fong Liang Tan, Wei Meng Pee, Andrew J. Ouderkirk, Justine A. Mooney
  • Patent number: 9716061
    Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semi-conductor device to the conductive layer.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: July 25, 2017
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Il Agcaoili Narag, Siang Sin Foo, Fong Liang Tan, Wei Meng Pee, Andrew J. Ouderkirk, Justine A. Mooney
  • Publication number: 20130320390
    Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semi-conductor device to the conductive layer.
    Type: Application
    Filed: February 17, 2012
    Publication date: December 5, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Ravi Palaniswamy, Arokiaraj Jesudoss, Alejandro Aldrin Agcaoili Narag, II, Siang Sin Foo, Fong Liang Tan, Wei Meng Pee, Andrew J. Ouderkirk, Justine A. Mooney