Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A continuous deposition device comprises a first fixing chamber having a first fixing unit disposed therein; a first pump coupled with the first fixing chamber to adjust the pressure in the first fixing chamber; a second fixing chamber having a second fixing unit disposed therein, wherein ends of a roll material are fix on the first fixing unit and second fixing unit respectively; a second pump coupled with the second fixing chamber to adjust the pressure in the second fixing chamber; and a plurality of reaction chambers connected with each other, wherein the upstream of the reaction chambers couples with the first fixing chamber and the downstream of the reaction chambers couples with the second fixing chamber. The roll material passes through the reaction chambers. The reaction chambers respectively provide reactants to deposit on the roll material. The present invention also provides a method of continuous deposition.

Abstract: A keypad having a first key and a second key is provided. The first key includes a first front body and a first back body. The first back body is disposed on the backside of the first front body. The edge of the first back body has a protruding portion. The terminal of the protruding portion is wider than the junction of the protruding portion and the edge of the first back body. The second key includes a second front body and a second back body. The second back body is disposed on the backside of the second front body. The edge of the second back body has an indentation corresponding to the protruding portion. The indentation exposes a part of the backside of the second front body for buckling up with the protruding potion tightly so that the first key and the second key are fastened together firmly.

Abstract: A key fixing structure and an electronic device using the same are provided. The key fixing structure is used for fixing several keys in the electronic device having at least one fixing groove. The key fixing structure includes a planar main body and at least one fixing portion. The planar main body has several installing spaces, and the keys are correspondingly disposed in the installing spaces. The fixing portion is provided with an included angle relative to the planar main body. When the fixing portion is received in the fixing groove, the key fixing structure is firmly disposed in the electronic device.

Abstract: A keypad having a first key and a second key is provided. The first key includes a first front body and a first back body. The first back body is disposed on the backside of the first front body. The edge of the first back body has a protruding portion. The terminal of the protruding portion is wider than the junction of the protruding portion and the edge of the first back body. The second key includes a second front body and a second back body. The second back body is disposed on the backside of the second front body. The edge of the second back body has an indentation corresponding to the protruding portion. The indentation exposes a part of the backside of the second front body for buckling up with the protruding potion tightly so that the first key and the second key are fastened together firmly.