Patents by Inventor Wei-Min Su

Wei-Min Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260234862
    Abstract: The present disclosure provides a functional fabric, including a base fabric layer, a multilayer metallic layer and a heat insulation layer. The base fabric layer has a first surface and a second surface opposite to the first surface. The multilayer metallic layer is formed on the first surface of the base fabric layer, and includes a high-heat-conductivity metallic layer and a low-heat-conductivity metallic layer, and a heat transfer coefficient of the high-heat-conductivity metallic layer is 5 times or more of a heat transfer coefficient of the low-heat-conductivity metallic layer. The heat insulation layer is formed on the multilayer metallic layer. A garment made of the functional fabric may achieve the effects of temperature equalization, fast temperature rising and warm keeping.
    Type: Application
    Filed: January 5, 2026
    Publication date: August 13, 2026
    Inventors: Cheng-Yi Tai, Ching-Hsiang Hsu, Wei-Min Su
  • Patent number: 7499031
    Abstract: A keypad having a first key and a second key is provided. The first key includes a first front body and a first back body. The first back body is disposed on the backside of the first front body. The edge of the first back body has a protruding portion. The terminal of the protruding portion is wider than the junction of the protruding portion and the edge of the first back body. The second key includes a second front body and a second back body. The second back body is disposed on the backside of the second front body. The edge of the second back body has an indentation corresponding to the protruding portion. The indentation exposes a part of the backside of the second front body for buckling up with the protruding potion tightly so that the first key and the second key are fastened together firmly.
    Type: Grant
    Filed: October 5, 2004
    Date of Patent: March 3, 2009
    Assignee: Qisda Corporation
    Inventors: Wei-Min Su, Ai-Jun Hu
  • Publication number: 20080253069
    Abstract: A key fixing structure and an electronic device using the same are provided. The key fixing structure is used for fixing several keys in the electronic device having at least one fixing groove. The key fixing structure includes a planar main body and at least one fixing portion. The planar main body has several installing spaces, and the keys are correspondingly disposed in the installing spaces. The fixing portion is provided with an included angle relative to the planar main body. When the fixing portion is received in the fixing groove, the key fixing structure is firmly disposed in the electronic device.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 16, 2008
    Applicant: Qisda Corporation
    Inventors: Shan-Wei Hong, Wei-Min Su
  • Publication number: 20050073502
    Abstract: A keypad having a first key and a second key is provided. The first key includes a first front body and a first back body. The first back body is disposed on the backside of the first front body. The edge of the first back body has a protruding portion. The terminal of the protruding portion is wider than the junction of the protruding portion and the edge of the first back body. The second key includes a second front body and a second back body. The second back body is disposed on the backside of the second front body. The edge of the second back body has an indentation corresponding to the protruding portion. The indentation exposes a part of the backside of the second front body for buckling up with the protruding potion tightly so that the first key and the second key are fastened together firmly.
    Type: Application
    Filed: October 5, 2004
    Publication date: April 7, 2005
    Inventors: Wei-Min Su, Ai-Jun Hu