Abstract: A thin semiconductor package includes a die paddle and multiple lead fingers made of a metal substrate. A die paddle electroplating layer and a lead finger electroplating layer are formed on the surface of the die paddle and surfaces of the lead fingers, respectively. A die is provided on the die paddle electroplating layer and is electrically connected to the lead finger electroplating layer. The die paddle, the die and the lead fingers are encapsulated by a molding compound. The lower surfaces of the die paddle and the lead fingers are exposed on the bottom surface of the molding compound. The die paddles and the lead fingers are formed by etching the metal substrate instead without using a lead frame.