Patents by Inventor Wei-Ming Hou

Wei-Ming Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyimide resin, thin film and method for manufacturing thereof
    Patent number: 10538626
    Abstract: A transparent and colorless polyimide resin is provided. The polyimide resin is derived from at least two dianhydride monomers and at least two diamine monomers. At least one monomer in the dianhydride and diamine monomers includes structure of formula (1). The monomer with structure of formula (1) has an amount of moles accounting for 10-50% of total moles of the dianhydride or diamine monomers. In formula (1), X is SO2,C(CH3)2 or C(CF3)2, Y is oxygen.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: January 21, 2020
    Assignee: Microcosm Technology Co., Ltd
    Inventors: Bo-Hung Lai, Wei-Ming Hou, Tang-Chieh Huang
  • POLYIMIDE RESIN, THIN FILM AND METHOD FOR MANUFACTURING THEREOF
    Publication number: 20180230270
    Abstract: A transparent and colorless polyimide resin is provided. The polyimide resin is derived from at least two dianhydride monomers and at least two diamine monomers. At least one monomer in the dianhydride and diamine monomers includes structure of formula (1). The monomer with structure of formula (1) has an amount of moles accounting for 10-50% of total moles of the dianhydride or diamine monomers. In formula (1), X is SO2, C(CH3)2 or C(CF3)2, Y is oxygen.
    Type: Application
    Filed: July 10, 2017
    Publication date: August 16, 2018
    Inventors: Bo-Hung Lai, Wei-Ming Hou, Tang-Chieh Huang