Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.

Abstract: The present disclosure provides one embodiment of a method making semiconductor structure. The method includes forming a composite stress layer on a semiconductor substrate, wherein the forming of the composite stress layer includes forming a first stress layer of a dielectric material with a first compressive stress and forming a second stress layer of the dielectric material with a second compressive stress on the first stress layer, the second compressive stress being greater than the first compressive stress; and patterning the semiconductor substrate to form fin active regions using the composite stress layer as an etch mask.

Abstract: An IC structure includes a fin structure, a contact overlying the fin structure along a first direction, and an isolation layer between the contact and the fin structure. The isolation layer is adjacent to a portion of the contact along a second direction perpendicular to the first direction.

Abstract: A semiconductor device includes source/drain regions, a gate structure, a first gate spacer, and a dielectric material. The source/drain regions are over a substrate. The gate structure is laterally between the source/drain regions. The first gate spacer is on a first sidewall of the gate structure, and spaced apart from a first one of the source/drain regions at least in part by a void region. The dielectric material is between the first one of the source/drain regions and the void region. The dielectric material has a gradient ratio of a first chemical element to a second chemical element.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A system and method for maximizing bandwidth in an uplink for a 5G communication system is disclosed. Multiple end devices generate image streams. A gateway is coupled to the end devices. The gateway includes a gateway monitor agent collecting utilization rate data of the gateway and an image inspector collecting inspection data from the received image streams. An edge server is coupled to the gateway. The edge server includes an edge server monitor agent collecting utilization rate data of the edge server. An analytics manager is coupled to the gateway and the edge server. The analytics manager is configured to determine an allocation strategy based on the collected utilization rate data from the gateway and the edge server.

Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.

Abstract: The present disclosure provides a motor including a stator, a rotor and a first circuit board. The stator includes a winding assembly including a plurality of coils. A conductive element is extended out from the winding assembly and is electrically connected to a first electrical connector. The first electrical connector penetrates through a pillow of the stator and is electrically connected to the first circuit board. The motor further includes a second circuit board, and the second circuit board is electrically connected to the first circuit board. The first electrical connector serves as a connector for electrically connecting the winding assembly to the first circuit board. The present disclosure has the advantage of easy installation by replacing the conventional wire binding plate with the first circuit board.

Abstract: The present disclosure provides a motor including a base, a stator and a rotor. The stator is disposed on the base. The base includes a cylinder. There is a flange disposed on a side of the cylinder neighboring to the rotor. Fins are axially disposed on the flange, and the periphery of the flange has a breach. The breach is partially extended to the cylinder, and there is also a plurality of fins disposed in the breach. A plurality of air-guiding members are annularly disposed on the periphery of the rotor. The air-guiding members are connected to each other through a connecting rim. The fins on the flange and the air-guiding members of the rotor are both extended axially, thus the interference therebetween is avoided. When the motor rotates, the air-guiding members are able to drive the flow passing through the breach for achieving heat-dissipating effect.

Abstract: The present disclosure provides a motor including a stator, a rotor and a first circuit board. The stator includes a winding assembly including a plurality of coils. A conductive element is extended out from the winding assembly and is electrically connected to a first electrical connector. The first electrical connector penetrates through a pillow of the stator and is electrically connected to the first circuit board. The motor further includes a second circuit board, and the second circuit board is electrically connected to the first circuit board. The first electrical connector serves as a connector for electrically connecting the winding assembly to the first circuit board. The present disclosure has the advantage of easy installation by replacing the conventional wire binding plate with the first circuit board.

Abstract: The present disclosure provides a motor including a base, a stator and a rotor. The stator is disposed on the base. The base includes a cylinder. There is a flange disposed on a side of the cylinder neighboring to the rotor. Fins are axially disposed on the flange, and the periphery of the flange has a breach. The breach is partially extended to the cylinder, and there is also a plurality of fins disposed in the breach. A plurality of air-guiding members are annularly disposed on the periphery of the rotor. The air-guiding members are connected to each other through a connecting rim. The fins on the flange and the air-guiding members of the rotor are both extended axially, thus the interference therebetween is avoided. When the motor rotates, the air-guiding members are able to drive the flow passing through the breach for achieving heat-dissipating effect.

Abstract: A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. A conductive layer is formed on the bond pads and the protection layer. A patterned first photoresist layer is formed on the conductive layer. Copper bumps are respectively formed on the conductive layer located in the first photoresist layer openings. A patterned second photoresist layer is formed on the first photoresist layer, such that at least one of the copper bumps is exposed through second photoresist layer opening and the corresponding first photoresist layer opening. A diffusion barrier layer and an oxidation barrier layer are formed on the copper bump. The first and second photoresist layers, and the conductive layer not covered by the copper bumps are removed.

Abstract: A movable spanner structure contains: a first body, a second body, an adjustable bolt, a first coupling element, a locking member, a third body, and a second coupling element. The first body includes a first retainer, an accommodating groove, a quadrangle trench, a first orifice, a first cavity, a first connecting portion, and a second cavity. The second body includes a second retainer, a slidable extension, and a first toothed portion. The adjustable bolt includes a second toothed portion and a second orifice. The first coupling element is fixed in the first orifice. The locking member includes an abutting portion, a third orifice, and a first pressing portion. The third body includes a second connecting portion and a second pressing portion. The second coupling element is mounted in the first connecting portion and the second connecting portion, such that the third body is rotatably coupled with the first body.

Abstract: A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. A conductive layer is formed on the bond pads and the protection layer. A patterned first photoresist layer is formed on the conductive layer. Copper bumps are respectively formed on the conductive layer located in the first photoresist layer openings. A patterned second photoresist layer is formed on the first photoresist layer, such that at least one of the copper bumps is exposed through second photoresist layer opening and the corresponding first photoresist layer opening. A diffusion barrier layer and an oxidation barrier layer are formed on the copper bump. The first and second photoresist layers, and the conductive layer not covered by the copper bumps are removed.

Abstract: An open-end wrench is capable of locking and unlocking a hexagon nut continuously and contains: a holder, a driving head, a returning spring, and a handle. The holder is configured to accommodate the driving head, the returning spring, and an actuation shaft. The holder includes a first jaw, a body, and an accommodation cavity, wherein the accommodation cavity has a first panel, the holder further includes a first orifice for accommodating a first post, a second orifice for housing a second post, and a third orifice for accommodating a third post. The driving head includes a second jaw and an extension which has a second panel, a slot, a trench, and a projection. The returning spring is accommodated in the slot, and the handle includes the actuation shaft, an operation shaft, a concaved portion, and a coupling hole.

Abstract: A quick-operating adjustable wrench has a fixed jaw, a moveable jaw, and a handle. The fixed jaw has an abutting face, two mounting plates, and a mounting recess. The two mounting plates are formed on and protrude from the abutting face and are separate from each other, and the mounting recess is formed between the two mounting plates. The moveable jaw is pivotally connected to and abuts the fixed jaw, and has a pushing portion mounted in the mounting recess and abutting the fixed jaw. The handle is pivotally connected to the fixed jaw, abuts the movable jaw, and has a driving portion. The driving portion is pivotally connected to the fixed jaw and abuts the moveable jaw, and thereby the quick-operating adjustable wrench is applicable to nuts of different sizes. The structure of the quick-operating adjustable wrench is simplified, and may fasten fastening elements quickly.

Abstract: A movable spanner structure contains: a first body, a second body, an adjustable bolt, a first coupling element, a locking member, a third body, and a second coupling element. The first body includes a first retainer, an accommodating groove, a quadrangle trench, a first orifice, a first cavity, a first connecting portion, and a second cavity. The second body includes a second retainer, a slidable extension, and a first toothed portion. The adjustable bolt includes a second toothed portion and a second orifice. The first coupling element is fixed in the first orifice. The locking member includes an abutting portion, a third orifice, and a first pressing portion. The third body includes a second connecting portion and a second pressing portion. The second coupling element is mounted in the first connecting portion and the second connecting portion, such that the third body is rotatably coupled with the first body.

Abstract: An inductor structure includes a substrate, a protection layer, a patterned first conductive layer, copper bumps, a passivation layer, a diffusion barrier layer, and an oxidation barrier layer. The protection layer is located on the substrate. The bond pads of the substrate are respectively exposed through protection layer openings. The first conductive layer is located on the surfaces of the bond pads and the protection layer adjacent to the protection layer openings. The copper bumps are located on the first conductive layer. The passivation layer is located on the protection layer and the copper bumps. At least one of the copper bumps is exposed through a passivation layer opening. The diffusion barrier layer is located on the copper bump that is exposed through the passivation layer opening. The oxidation barrier layer is located on the diffusion barrier layer.

Abstract: A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. A conductive layer is formed on the bond pads and the protection layer. A patterned first photoresist layer is formed on the conductive layer. Copper bumps are respectively formed on the conductive layer located in the first photoresist layer openings. A patterned second photoresist layer is formed on the first photoresist layer, such that at least one of the copper bumps is exposed through second photoresist layer opening and the corresponding first photoresist layer opening. A diffusion barrier layer and an oxidation barrier layer are formed on the copper bump. The first and second photoresist layers, and the conductive layer not covered by the copper bumps are removed.