Patents by Inventor Wei-Ming Shieh

Wei-Ming Shieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10349522
    Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: July 9, 2019
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang
  • Publication number: 20190184084
    Abstract: A dialyzer and a fabricating method thereof are provided. The dialyzer includes a housing, a hydrophilic layer, a fixing layer, a plurality of hollow fiber membranes, and two end caps. The housing has a first opening and a second opening, and is provided with a dialysate inlet and a dialysate outlet, wherein an entire peripheral surface of the housing located between the first opening and the dialysate inlet is a first portion, and an entire peripheral surface of the housing located between the second opening and the dialysate outlet is a second portion. The hydrophilic layer is disposed on the inner wall of the first portion and the second portion, wherein the hydrophilic layer and the housing are different materials. The fixing layer is disposed on the hydrophilic layer and fixes the hollow fiber membranes to the inner wall of the housing.
    Type: Application
    Filed: December 14, 2018
    Publication date: June 20, 2019
    Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang
  • Publication number: 20190184085
    Abstract: An end cap of a dialyzer and a fabricating method thereof, and a dialyzer are provided. The end cap includes a main body and a sealing element. The main body has a blood port. The sealing element is integrally connected on an inner wall of the main body.
    Type: Application
    Filed: December 18, 2018
    Publication date: June 20, 2019
    Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang
  • Publication number: 20190037699
    Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.
    Type: Application
    Filed: October 2, 2018
    Publication date: January 31, 2019
    Inventors: Wei-Ming SHIEH, Yi-Feng PU, Pei-Hsuan HUANG
  • Publication number: 20190037698
    Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.
    Type: Application
    Filed: October 2, 2018
    Publication date: January 31, 2019
    Inventors: Wei-Ming SHIEH, Yi-Feng PU, Pei-Hsuan HUANG
  • Patent number: 10194532
    Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: January 29, 2019
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang
  • Patent number: 10123423
    Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: November 6, 2018
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wei-Ming Shieh, Yi-Feng Pu, Pei-Hsuan Huang