Abstract: A server includes a first server unit, a second server unit, a hinge and a connecting element. The second server unit is disposed on the first server unit and is electrically connected to the first server unit. The second server unit is pivoted to the first server unit through the hinge. The connecting element is disposed between the first server unit and the second server unit. The connecting element has a first connection end and a second connection end, wherein the first connection end is connected to the first server unit, and the second connection end is connected to the second server unit. A server system including a rack and at least one server is also provided.

Abstract: A server includes a first server unit, a second server unit, a hinge and a connecting element. The second server unit is disposed on the first server unit and is electrically connected to the first server unit. The second server unit is pivoted to the first server unit through the hinge. The connecting element is disposed between the first server unit and the second server unit. The connecting element has a first connection end and a second connection end, wherein the first connection end is connected to the first server unit, and the second connection end is connected to the second server unit. A server system including a rack and at least one server is also provided.

Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

Abstract: A dialyzer and a fabricating method thereof are provided. The dialyzer includes a housing, a hydrophilic layer, a fixing layer, a plurality of hollow fiber membranes, and two end caps. The housing has a first opening and a second opening, and is provided with a dialysate inlet and a dialysate outlet, wherein an entire peripheral surface of the housing located between the first opening and the dialysate inlet is a first portion, and an entire peripheral surface of the housing located between the second opening and the dialysate outlet is a second portion. The hydrophilic layer is disposed on the inner wall of the first portion and the second portion, wherein the hydrophilic layer and the housing are different materials. The fixing layer is disposed on the hydrophilic layer and fixes the hollow fiber membranes to the inner wall of the housing.

Abstract: An end cap of a dialyzer and a fabricating method thereof, and a dialyzer are provided. The end cap includes a main body and a sealing element. The main body has a blood port. The sealing element is integrally connected on an inner wall of the main body.

Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.